DE602004030590D1 - Elektrische schaltungsvorrichtung und verfahren zu ihrem zusammenbau - Google Patents
Elektrische schaltungsvorrichtung und verfahren zu ihrem zusammenbauInfo
- Publication number
- DE602004030590D1 DE602004030590D1 DE602004030590T DE602004030590T DE602004030590D1 DE 602004030590 D1 DE602004030590 D1 DE 602004030590D1 DE 602004030590 T DE602004030590 T DE 602004030590T DE 602004030590 T DE602004030590 T DE 602004030590T DE 602004030590 D1 DE602004030590 D1 DE 602004030590D1
- Authority
- DE
- Germany
- Prior art keywords
- assembling
- circuiting device
- electrical circuiting
- electrical
- circuiting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/677,456 US6861746B1 (en) | 2003-10-02 | 2003-10-02 | Electrical circuit apparatus and methods for assembling same |
PCT/US2004/030740 WO2005038986A2 (en) | 2003-10-02 | 2004-09-17 | Electrical circuit apparatus and methods for assembling same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004030590D1 true DE602004030590D1 (de) | 2011-01-27 |
Family
ID=34194925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004030590T Active DE602004030590D1 (de) | 2003-10-02 | 2004-09-17 | Elektrische schaltungsvorrichtung und verfahren zu ihrem zusammenbau |
Country Status (7)
Country | Link |
---|---|
US (2) | US6861746B1 (de) |
EP (1) | EP1668697B1 (de) |
CN (1) | CN100449739C (de) |
DE (1) | DE602004030590D1 (de) |
MY (1) | MY141552A (de) |
TW (1) | TWI267326B (de) |
WO (1) | WO2005038986A2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6861746B1 (en) * | 2003-10-02 | 2005-03-01 | Motorola, Inc. | Electrical circuit apparatus and methods for assembling same |
US6842341B1 (en) * | 2003-10-02 | 2005-01-11 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
US7310036B2 (en) | 2005-01-10 | 2007-12-18 | International Business Machines Corporation | Heat sink for integrated circuit devices |
US7195145B2 (en) * | 2005-07-13 | 2007-03-27 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
CN101090599B (zh) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
CN101296563B (zh) * | 2007-04-27 | 2010-06-02 | 鸿富锦精密工业(深圳)有限公司 | 电路板、电子组件及电路板组件 |
KR101015735B1 (ko) * | 2009-07-02 | 2011-02-22 | 삼성전기주식회사 | 세라믹 적층체 모듈 및 그 제조방법 |
CN102917553B (zh) * | 2012-10-22 | 2016-04-20 | 友达光电(苏州)有限公司 | 焊接定位结构 |
US9554453B2 (en) * | 2013-02-26 | 2017-01-24 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
US8995933B2 (en) * | 2013-06-21 | 2015-03-31 | Motorola Solutions, Inc. | Radio frequency transistor and matching circuit grounding and thermal management apparatus |
US9607964B2 (en) * | 2014-03-28 | 2017-03-28 | Intel Corporation | Method and materials for warpage thermal and interconnect solutions |
US10763193B2 (en) * | 2018-10-30 | 2020-09-01 | Hamilton Sundstrand Corporation | Power control modules |
CN113056087B (zh) * | 2021-01-28 | 2022-05-03 | 中国电子科技集团公司第二十九研究所 | 一种内嵌微流道的印制电路板及其制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3750269A (en) * | 1970-07-06 | 1973-08-07 | Texas Instruments Inc | Method of mounting electronic devices |
FR2599893B1 (fr) * | 1986-05-23 | 1996-08-02 | Ricoh Kk | Procede de montage d'un module electronique sur un substrat et carte a circuit integre |
US4993148A (en) * | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
WO1992022090A1 (en) * | 1991-06-03 | 1992-12-10 | Motorola, Inc. | Thermally conductive electronic assembly |
US5263245A (en) * | 1992-01-27 | 1993-11-23 | International Business Machines Corporation | Method of making an electronic package with enhanced heat sinking |
US5842275A (en) * | 1995-09-05 | 1998-12-01 | Ford Motor Company | Reflow soldering to mounting pads with vent channels to avoid skewing |
US5646444A (en) | 1995-10-05 | 1997-07-08 | Motorola, Inc. | Apparatus and method for mounting a component to an electrical circuit |
EP0869704A1 (de) * | 1997-03-31 | 1998-10-07 | Ford Motor Company | Verfahren zum Montieren von Bauelementen auf einer Leiterplatte |
US6117797A (en) * | 1998-09-03 | 2000-09-12 | Micron Technology, Inc. | Attachment method for heat sinks and devices involving removal of misplaced encapsulant |
US6770967B2 (en) * | 2002-12-23 | 2004-08-03 | Eastman Kodak Company | Remote thermal vias for densely packed electrical assemblage |
US6842341B1 (en) * | 2003-10-02 | 2005-01-11 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
US6861746B1 (en) * | 2003-10-02 | 2005-03-01 | Motorola, Inc. | Electrical circuit apparatus and methods for assembling same |
-
2003
- 2003-10-02 US US10/677,456 patent/US6861746B1/en not_active Expired - Lifetime
-
2004
- 2004-09-17 CN CNB2004800286376A patent/CN100449739C/zh not_active Expired - Fee Related
- 2004-09-17 WO PCT/US2004/030740 patent/WO2005038986A2/en active Application Filing
- 2004-09-17 DE DE602004030590T patent/DE602004030590D1/de active Active
- 2004-09-17 EP EP04784570A patent/EP1668697B1/de not_active Expired - Fee Related
- 2004-09-30 TW TW093129640A patent/TWI267326B/zh not_active IP Right Cessation
- 2004-10-01 MY MYPI20044044A patent/MY141552A/en unknown
-
2005
- 2005-01-07 US US11/031,224 patent/US7070084B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1668697B1 (de) | 2010-12-15 |
TW200524493A (en) | 2005-07-16 |
WO2005038986A3 (en) | 2005-07-21 |
US20050121774A1 (en) | 2005-06-09 |
CN1864258A (zh) | 2006-11-15 |
WO2005038986A2 (en) | 2005-04-28 |
US7070084B2 (en) | 2006-07-04 |
EP1668697A4 (de) | 2006-12-27 |
US6861746B1 (en) | 2005-03-01 |
TWI267326B (en) | 2006-11-21 |
EP1668697A2 (de) | 2006-06-14 |
CN100449739C (zh) | 2009-01-07 |
MY141552A (en) | 2010-05-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE0302467L (sv) | A method and a device for manufacturing of electrical components | |
DE602004029810D1 (de) | Leistungsschaltung und verfahren zur vergrösserung | |
DE60114980D1 (de) | Tragbares elektronisches Gerät, Ladevorrichtung und dazugehöriges Verfahren | |
DE60334672D1 (de) | Elektrische Spannvorrichtung | |
EP1752777A4 (de) | Verfahren und vorrichtung zur messung eines elektrischen schaltungsparameters | |
HK1096456A1 (en) | Method and device for measuring voltage | |
DE602004032300D1 (de) | Vorrichtung zur elektrische Bauteilbestückung | |
DE602004007110D1 (de) | Modulare elektrische einrichtung | |
GB2391394B (en) | Apparatus and methods for retaining and placing electrical components | |
DE60042382D1 (de) | Bestückungsmethode und Vorrichtung für elektrische Bauteile | |
DE602004030590D1 (de) | Elektrische schaltungsvorrichtung und verfahren zu ihrem zusammenbau | |
DE60219502D1 (de) | Gerät und verfahren zur eichung und validierung von hochleistungs-stromversorgungen für testgeräte | |
DE60218278D1 (de) | Elektrische Drehmaschine und Verfahren zur Verbindung von Statorleitern | |
DE502005010758D1 (de) | Elektrische funktionseinheit und verfahren zu deren herstellung | |
DE60209272D1 (de) | Regelvorrichtung für ein elektrisches Fahrzeug und Reglungsmethode | |
FR2850598B1 (fr) | Dispositif electrique de serrage | |
DE602004004466D1 (de) | Elektrische Verbindungsvorrichtung | |
DE60333050D1 (de) | Elektrische Verbindungseinrichtung | |
DE60238720D1 (de) | Sammelverfahren für elektrische geräte und elektrisches gerät | |
DE60313822D1 (de) | Steckverbinder für ein elektrisches Gerät | |
DE60331193D1 (de) | Elektrischer verbinder für eine drahtlose elektrische vorrichtung | |
DE60317443D1 (de) | H-Brückenvorrichtung und Verfahren | |
DE60206240D1 (de) | Spannungssensor für gasisolierte elektrische Vorrichtung | |
DE602004012603D1 (de) | Prüfsummen-erzeugungsvorrichtung und verfahren dafür | |
SG110150A1 (en) | Electrical circuit and method for testing integrate circuits |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R097 | No opposition filed against granted patent, or epo opposition proceedings concluded without decision |
Ref document number: 1668697 Country of ref document: EP Effective date: 20110916 |
|
R082 | Change of representative |
Ref document number: 1668697 Country of ref document: EP Representative=s name: SPLANEMANN BARONETZKY KNITTER PATENTANWAELTE RECHT |
|
R082 | Change of representative |
Ref document number: 1668697 Country of ref document: EP Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT, DE |
|
R082 | Change of representative |
Ref document number: 1668697 Country of ref document: EP Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT, DE |