DE602004027279D1 - STRAHLLOTBEHÄLTNIS - Google Patents

STRAHLLOTBEHÄLTNIS

Info

Publication number
DE602004027279D1
DE602004027279D1 DE602004027279T DE602004027279T DE602004027279D1 DE 602004027279 D1 DE602004027279 D1 DE 602004027279D1 DE 602004027279 T DE602004027279 T DE 602004027279T DE 602004027279 T DE602004027279 T DE 602004027279T DE 602004027279 D1 DE602004027279 D1 DE 602004027279D1
Authority
DE
Germany
Prior art keywords
blades
hub
solder
molten solder
soldering tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004027279T
Other languages
German (de)
Inventor
Akira Takaguchi
Issaku Sato
Noboru Hashimoto
Junichi Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003352160A external-priority patent/JP4136887B2/en
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of DE602004027279D1 publication Critical patent/DE602004027279D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Abstract

A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.
DE602004027279T 2003-10-10 2004-10-08 STRAHLLOTBEHÄLTNIS Active DE602004027279D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003352160A JP4136887B2 (en) 2003-06-17 2003-10-10 Solder tank pump and solder tank using the same
PCT/JP2004/014936 WO2005035176A1 (en) 2003-10-10 2004-10-08 Jet solder vessel

Publications (1)

Publication Number Publication Date
DE602004027279D1 true DE602004027279D1 (en) 2010-07-01

Family

ID=34431101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004027279T Active DE602004027279D1 (en) 2003-10-10 2004-10-08 STRAHLLOTBEHÄLTNIS

Country Status (12)

Country Link
US (2) US8215534B2 (en)
EP (1) EP1676662B1 (en)
KR (1) KR100820621B1 (en)
CN (1) CN100503118C (en)
AT (1) ATE468194T1 (en)
DE (1) DE602004027279D1 (en)
ES (1) ES2346061T3 (en)
MX (1) MXPA06003903A (en)
MY (1) MY137398A (en)
PL (1) PL1676662T3 (en)
TW (1) TWI364341B (en)
WO (1) WO2005035176A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101112139B (en) * 2005-02-07 2012-01-25 千住金属工业株式会社 Jet solder bath
KR101076645B1 (en) * 2006-04-05 2011-10-27 센주긴조쿠고교 가부시키가이샤 Jet solder bath
ATE530052T1 (en) * 2006-04-26 2011-11-15 Senju Metal Industry Co JET SOLDER TANK
JP4375491B1 (en) * 2008-06-23 2009-12-02 日本ジョイント株式会社 Electronic component soldering apparatus and soldering method
WO2010110341A1 (en) * 2009-03-24 2010-09-30 千住金属工業株式会社 Localized jet soldering device and partial jet soldering method
US8764399B1 (en) * 2010-05-03 2014-07-01 Robert W Linscott Spiral plane drag turbine
JP5601342B2 (en) * 2012-04-27 2014-10-08 千住金属工業株式会社 Drift plate and jet device
CN104339063B (en) * 2013-07-23 2016-06-29 深圳市堃琦鑫华股份有限公司 A kind of jet flow weldering brazier
CN107243201B (en) * 2017-07-13 2023-07-11 蔡志文 Air purification module and air purifier
KR102126822B1 (en) * 2019-01-03 2020-06-26 왕 에릭 Manufacturing method of transformer circuit board and transformer thereof
JP6590232B1 (en) * 2019-04-22 2019-10-16 千住金属工業株式会社 Soldering apparatus and soldering method
CN113941749A (en) * 2021-11-29 2022-01-18 珠海飞创智能科技有限公司 Liquid tin supply equipment for wave soldering

Family Cites Families (31)

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US1932881A (en) * 1930-08-22 1933-10-31 Harry O Bowen Pump
US3198414A (en) * 1963-07-30 1965-08-03 Electrovert Mfg Co Ltd Molten solder bath with uniformly dispersed additive
GB1110892A (en) * 1965-04-28 1968-04-24 British Aircraft Corp Ltd Improvements relating to wave soldering
JPS507211Y2 (en) * 1971-02-15 1975-03-03
JPS513632U (en) * 1974-06-26 1976-01-12
JPS513632A (en) 1974-06-28 1976-01-13 Kenkoo Kk INGAYAKITSUKEHO
JPS5623371A (en) * 1979-07-31 1981-03-05 Koki:Kk Soldering device
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
JPS6051941B2 (en) * 1981-07-16 1985-11-16 株式会社タムラ製作所 Jet solder bath
DE3680606D1 (en) 1985-08-09 1991-09-05 Dolphin Machinery LOETAPPARAT.
JPS6240967A (en) * 1985-08-19 1987-02-21 Tamura Kaken Kk Soldering device
JPS62168663A (en) 1986-01-20 1987-07-24 Asahi Kagaku Kenkyusho:Kk Jet stream type solder tank and its manufacture
JPS62259665A (en) * 1986-01-20 1987-11-12 Asahi Chem Res Lab Ltd Method and device for injecting molten solder
JP2820260B2 (en) * 1989-02-02 1998-11-05 株式会社タムラ製作所 Jet type soldering equipment
JPH0619968A (en) 1991-09-13 1994-01-28 Oki Electric Ind Co Ltd Automatic extraction device for technical term
JP3075610B2 (en) * 1991-10-07 2000-08-14 株式会社不二精機製造所 Solder coating equipment
JPH05293639A (en) 1992-04-15 1993-11-09 Koki Techno:Kk Jet stream type soldering device
BE1008654A3 (en) * 1994-08-24 1996-07-02 Haegeman J H Combined screw water treatment equipment.
JPH08284885A (en) 1995-04-07 1996-10-29 Akio Kako Centrifugal pump
US5566875A (en) * 1995-06-07 1996-10-22 Samsung Electronics Co., Ltd. Lead-oxide preventing apparatus for automatic lead-soldering device
JP3311547B2 (en) * 1995-08-02 2002-08-05 日本電熱計器株式会社 Soldering equipment
JP3104783B2 (en) 1995-12-07 2000-10-30 株式会社石垣 Screw pump trough finishing method
DE19618227A1 (en) * 1996-05-07 1997-11-13 Herbert Streckfus Gmbh Method and device for soldering electronic components on a printed circuit board
JP3205802B2 (en) 1996-10-29 2001-09-04 株式会社コウキテクノ Jet solder bath nozzle
US5916491A (en) * 1997-01-16 1999-06-29 Rhone-Poulenc, Inc. Gas-liquid vortex mixer and method
DE19953316A1 (en) 1999-11-05 2001-05-10 Ltc Sales Europ Gmbh Soldering system and use of a solder feed pump with screw conveyor in a soldering system
CN2445847Y (en) * 2000-06-05 2001-09-05 王赐斌 Tin furnace appts.
JP2002205163A (en) 2000-12-28 2002-07-23 Mitsumi Electric Co Ltd Soldering device
JP2003136233A (en) 2001-11-02 2003-05-14 Matsushita Electric Ind Co Ltd Jet type automatic soldering device
AU2002365681A1 (en) * 2001-12-04 2003-06-17 Kag Holding A/S Screw pump for transporting emulsions susceptible to mechanical handling
JP2004009127A (en) * 2002-06-11 2004-01-15 Senju Metal Ind Co Ltd Jet soldering bath

Also Published As

Publication number Publication date
KR20060121892A (en) 2006-11-29
US8215534B2 (en) 2012-07-10
WO2005035176A1 (en) 2005-04-21
TWI364341B (en) 2012-05-21
CN100503118C (en) 2009-06-24
US20080093417A1 (en) 2008-04-24
US20120255987A1 (en) 2012-10-11
EP1676662A1 (en) 2006-07-05
EP1676662A4 (en) 2008-10-01
US9956633B2 (en) 2018-05-01
PL1676662T3 (en) 2010-10-29
MXPA06003903A (en) 2006-12-15
ES2346061T3 (en) 2010-10-08
EP1676662B1 (en) 2010-05-19
CN1867417A (en) 2006-11-22
ATE468194T1 (en) 2010-06-15
KR100820621B1 (en) 2008-04-08
TW200528224A (en) 2005-09-01
MY137398A (en) 2009-01-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition