DE602004023211D1 - Verfahren zur Herstellung eines mikroelektro-mechanischen Systems mit sich bewegenden Komponenten - Google Patents

Verfahren zur Herstellung eines mikroelektro-mechanischen Systems mit sich bewegenden Komponenten

Info

Publication number
DE602004023211D1
DE602004023211D1 DE602004023211T DE602004023211T DE602004023211D1 DE 602004023211 D1 DE602004023211 D1 DE 602004023211D1 DE 602004023211 T DE602004023211 T DE 602004023211T DE 602004023211 T DE602004023211 T DE 602004023211T DE 602004023211 D1 DE602004023211 D1 DE 602004023211D1
Authority
DE
Germany
Prior art keywords
producing
microelectromechanical system
moving components
microelectromechanical
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004023211T
Other languages
English (en)
Inventor
Naomasa Oka
Hiroshi Harada
Jun Ogihara
Hiroshi Fukshima
Hiroshi Noge
Yuji Suzuki
Kiyohiko Kawano
Takaaki Yoshihara
Masahiko Suzumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd filed Critical Panasonic Electric Works Co Ltd
Publication of DE602004023211D1 publication Critical patent/DE602004023211D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00484—Processes for releasing structures not provided for in group B81C1/00476
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H02N1/008—Laterally driven motors, e.g. of the comb-drive type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/045—Optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3516—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element moving along the beam path, e.g. controllable diffractive effects using multiple micromirrors within the beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
    • G02B6/3546—NxM switch, i.e. a regular array of switches elements of matrix type constellation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
    • G02B6/3548—1xN switch, i.e. one input and a selectable single output of N possible outputs
    • G02B6/355—1x2 switch, i.e. one input and a selectable single output of two possible outputs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357—Electrostatic force

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Weting (AREA)
DE602004023211T 2003-09-22 2004-09-21 Verfahren zur Herstellung eines mikroelektro-mechanischen Systems mit sich bewegenden Komponenten Expired - Lifetime DE602004023211D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003329845 2003-09-22
PCT/JP2004/014142 WO2005028359A1 (en) 2003-09-22 2004-09-21 Process for fabricating a micro-electro-mechanical system with movable components

Publications (1)

Publication Number Publication Date
DE602004023211D1 true DE602004023211D1 (de) 2009-10-29

Family

ID=34372978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004023211T Expired - Lifetime DE602004023211D1 (de) 2003-09-22 2004-09-21 Verfahren zur Herstellung eines mikroelektro-mechanischen Systems mit sich bewegenden Komponenten

Country Status (8)

Country Link
US (1) US7422928B2 (de)
EP (1) EP1663850B1 (de)
KR (1) KR100788857B1 (de)
CN (1) CN100532248C (de)
CA (1) CA2536431C (de)
DE (1) DE602004023211D1 (de)
TW (1) TWI284114B (de)
WO (1) WO2005028359A1 (de)

Families Citing this family (28)

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Publication number Priority date Publication date Assignee Title
US7258010B2 (en) 2005-03-09 2007-08-21 Honeywell International Inc. MEMS device with thinned comb fingers
DE102005015584B4 (de) * 2005-04-05 2010-09-02 Litef Gmbh Verfahren zur Herstellung eines mikromechanischen Bauteils
US7562573B2 (en) * 2005-07-21 2009-07-21 Evigia Systems, Inc. Integrated sensor and circuitry and process therefor
DE102007030121A1 (de) 2007-06-29 2009-01-02 Litef Gmbh Verfahren zur Herstellung eines Bauteils und Bauteil
US7630121B2 (en) * 2007-07-02 2009-12-08 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
DE102008003452A1 (de) * 2008-01-08 2009-07-09 Robert Bosch Gmbh Schutzsystem und Verfahren zur Vereinzelung von MEMS-Strukturen
US7944604B2 (en) 2008-03-07 2011-05-17 Qualcomm Mems Technologies, Inc. Interferometric modulator in transmission mode
US8138859B2 (en) * 2008-04-21 2012-03-20 Formfactor, Inc. Switch for use in microelectromechanical systems (MEMS) and MEMS devices incorporating same
KR100888076B1 (ko) * 2008-05-02 2009-03-11 이화여자대학교 산학협력단 자가 정렬 전극을 이용한 마이크로미러 제작 방법
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
US8604898B2 (en) * 2009-04-20 2013-12-10 International Business Machines Corporation Vertical integrated circuit switches, design structure and methods of fabricating same
US8486744B2 (en) * 2010-09-28 2013-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Multiple bonding in wafer level packaging
US8609450B2 (en) 2010-12-06 2013-12-17 International Business Machines Corporation MEMS switches and fabrication methods
US8338207B2 (en) * 2011-01-13 2012-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Bulk silicon moving member with dimple
CN102241389B (zh) * 2011-06-10 2014-01-01 清华大学 一种碱金属单质封装方法
WO2013002767A1 (en) * 2011-06-28 2013-01-03 Hewlett-Packard Development Company, L.P. Out-of-plane travel restriction structures
ITTO20110995A1 (it) 2011-10-31 2013-05-01 St Microelectronics Srl Dispositivo micro-elettro-meccanico dotato di regioni conduttive sepolte e relativo procedimento di fabbricazione
US9557556B2 (en) 2013-03-18 2017-01-31 Si-Ware Systems Integrated apertured micromirror and applications thereof
DE102014002824A1 (de) * 2014-02-25 2015-08-27 Northrop Grumman Litef Gmbh Verfahren zur Herstellung eines Bauteils
NO2777050T3 (de) * 2014-02-25 2018-06-16
FR3028257A1 (fr) * 2014-11-10 2016-05-13 Tronic's Microsystems Procede de fabrication d'un dispositif electromecanique et dispositif correspondant
CN104370273B (zh) * 2014-11-17 2016-11-23 广东万事泰集团有限公司 一种基于高分子材料可动悬空结构的制作方法
FI126508B (en) 2015-05-15 2017-01-13 Murata Manufacturing Co Method for manufacturing a multilevel micromechanical structure
TWI636949B (zh) 2015-05-15 2018-10-01 村田製作所股份有限公司 多層微機械結構
CN104820283B (zh) * 2015-05-27 2017-05-31 京东方科技集团股份有限公司 Mems光阀及其制作方法、显示装置
WO2020059607A1 (ja) 2018-09-20 2020-03-26 住友精密工業株式会社 基板の加工方法
CN110076940B (zh) * 2019-03-26 2021-10-08 中国科学院微电子研究所 一种基于金属微观结构的精密模具
US11655146B2 (en) * 2020-11-13 2023-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Extended acid etch for oxide removal

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682181B2 (ja) 1990-02-02 1997-11-26 日本電気株式会社 微小可動機械機構
WO2001053194A1 (en) 2000-01-19 2001-07-26 Mitsubishi Denki Kabushiki Kaisha Microdevice and its production method
JP4789080B2 (ja) * 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法

Also Published As

Publication number Publication date
TW200512153A (en) 2005-04-01
CA2536431C (en) 2010-01-26
CN100532248C (zh) 2009-08-26
US20070128831A1 (en) 2007-06-07
EP1663850A1 (de) 2006-06-07
US7422928B2 (en) 2008-09-09
EP1663850B1 (de) 2009-09-16
CN1856440A (zh) 2006-11-01
KR20060087576A (ko) 2006-08-02
TWI284114B (en) 2007-07-21
WO2005028359A1 (en) 2005-03-31
KR100788857B1 (ko) 2007-12-27
CA2536431A1 (en) 2005-03-31

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