DE602004019332D1 - Verbesserungen in oder betreffend wärmehärtbare harzzusammensetzungen - Google Patents

Verbesserungen in oder betreffend wärmehärtbare harzzusammensetzungen

Info

Publication number
DE602004019332D1
DE602004019332D1 DE200460019332 DE602004019332T DE602004019332D1 DE 602004019332 D1 DE602004019332 D1 DE 602004019332D1 DE 200460019332 DE200460019332 DE 200460019332 DE 602004019332 T DE602004019332 T DE 602004019332T DE 602004019332 D1 DE602004019332 D1 DE 602004019332D1
Authority
DE
Germany
Prior art keywords
composition
heat
curable resin
resin compositions
gelator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE200460019332
Other languages
English (en)
Inventor
George Green
John Cawse
Tanya O'reilly
Philip Hadley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hexcel Composites Ltd
Original Assignee
Hexcel Composites Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexcel Composites Ltd filed Critical Hexcel Composites Ltd
Publication of DE602004019332D1 publication Critical patent/DE602004019332D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/21—Urea; Derivatives thereof, e.g. biuret
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Reinforced Plastic Materials (AREA)
DE200460019332 2003-02-13 2004-02-13 Verbesserungen in oder betreffend wärmehärtbare harzzusammensetzungen Expired - Lifetime DE602004019332D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0303257A GB0303257D0 (en) 2003-02-13 2003-02-13 Improvements in or relating to thermosetting resin compositions
PCT/GB2004/000605 WO2004072145A1 (en) 2003-02-13 2004-02-13 Improvements in or relating to thermosetting resin compositions

Publications (1)

Publication Number Publication Date
DE602004019332D1 true DE602004019332D1 (de) 2009-03-19

Family

ID=9952919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460019332 Expired - Lifetime DE602004019332D1 (de) 2003-02-13 2004-02-13 Verbesserungen in oder betreffend wärmehärtbare harzzusammensetzungen

Country Status (8)

Country Link
US (1) US7550522B2 (de)
EP (1) EP1603962B1 (de)
AT (1) ATE422207T1 (de)
DE (1) DE602004019332D1 (de)
DK (1) DK1603962T3 (de)
ES (1) ES2321717T3 (de)
GB (2) GB0303257D0 (de)
WO (1) WO2004072145A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE412033T1 (de) * 2004-01-20 2008-11-15 Hexcel Composites Ltd Kristalline harze stabilisiert mit gelbidenden verbindungen
JP5031721B2 (ja) * 2008-12-19 2012-09-26 東光株式会社 コイル部品の製造方法、およびコイル部品
GB2478984A (en) * 2010-03-26 2011-09-28 Hexcel Composites Ltd Curable composite material
CN105694000B (zh) * 2016-02-03 2018-07-17 上海昭和高分子有限公司 一种乙烯基酯树脂及其制备方法
FR3106590B1 (fr) * 2020-01-27 2024-03-01 Saint Gobain Ct Recherches Pre-impregne pour composite a matrice ceramique

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2067960A (en) * 1937-01-19 Ethers of dihydric phenols
US2138924A (en) * 1936-05-27 1938-12-06 Goodrich Co B F Antioxidant
US2290289A (en) * 1939-05-31 1942-07-21 Du Pont Photographic element containing water soluble salts of alkyd resins as dispersing agents
GB920901A (en) * 1960-02-23 1963-03-13 Toyo Koatsu Ind Inc Novel resin compositions and process for curing the same
GB939437A (en) * 1960-02-23 1963-10-16 Toyo Koatsu Ind Inc Novel resin compositions and process for curing the same
GB1054458A (de) * 1963-10-18 1900-01-01
US3914467A (en) * 1971-06-22 1975-10-21 Matsushita Electric Ind Co Ltd Method of making resin encapsulated electric coil
NL7707669A (nl) * 1977-07-08 1979-01-10 Akzo Nv Werkwijze voor het bekleden van een substraat met een stralingshardbare bekledingscompositie.
US4946908A (en) * 1987-07-15 1990-08-07 Hercules Incorporated Bismaleimide compositions containing high glass transition temperature and soluble reactive oligomers and composites prepared therefrom
EP0363539A1 (de) * 1988-10-14 1990-04-18 MITSUI TOATSU CHEMICALS, Inc. Wärmehärtbare Harzzusammensetzung zum Spritzgiessen
JPH02133421A (ja) * 1988-11-14 1990-05-22 Sunstar Eng Inc エポキシ樹脂組成物
ATE317464T1 (de) * 2001-09-14 2006-02-15 Hexcel Composites Ltd Faserverstärkte kunststoffe
GB0122195D0 (en) * 2001-09-14 2001-10-31 Hexcel Composites Ltd Epoxy resin composition

Also Published As

Publication number Publication date
EP1603962B1 (de) 2009-02-04
WO2004072145A1 (en) 2004-08-26
US20070142600A1 (en) 2007-06-21
ATE422207T1 (de) 2009-02-15
DK1603962T3 (da) 2009-06-08
GB2400606A (en) 2004-10-20
GB0303257D0 (en) 2003-03-19
US7550522B2 (en) 2009-06-23
EP1603962A1 (de) 2005-12-14
GB0403236D0 (en) 2004-03-17
GB2400606B (en) 2007-09-19
ES2321717T3 (es) 2009-06-10

Similar Documents

Publication Publication Date Title
BR0206469A (pt) Composição injetável para depósito
AR039129A1 (es) Composiciones para restablecer la circulacion perdida
DK1162943T3 (da) Ikke-sviende coatingpræparat
ATE365727T1 (de) Epoxyendgruppen-enthaltende polythioether
HRP20041035A2 (en) Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
TW200635976A (en) Epoxy resin composition for photosemiconductor element encapsulation and photosemiconductor device using the same
ATE542548T1 (de) Aushärtbare temperaturempfindliche zusammensetzungen
ATE371691T1 (de) Silsesquioxanharzwachs
EA200800597A1 (ru) Композиции отвержденного меркаптаном эпоксидного полимера и способы производства и применения таких композиций
TWI317743B (en) Curing accelerator, epoxy resin composition, and semiconductor device
BR0108238A (pt) Composições cosméticas contendo pelo menos um hetero polìmero e pelo menos uma resina de silicone de formação de pelìcula e métodos de empregá-las
DE602006002989D1 (de) Epoxidharz Zusammensetzung
ATE403702T1 (de) Wärmeleitfähige silikonzusammensetzung
ATE466589T1 (de) Lagerungsstabile, flüssige fibrinogen- formulierung
ATE439118T1 (de) Kosmetische zusammensetzung enthaltend einen blockpolymer und ein nicht flüchtiges silikonöl
DE602004032573D1 (de) Stabilisierte zusammensetzungen von faktor-vii-polypeptiden
BRPI0601896A (pt) composições que contêm microgéis e agentes espessantes
BR0316616A (pt) Emplastro térmico
TW200613356A (en) Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same
WO2006074394A3 (en) Heat activated sealants and foamed materials
DE60326878D1 (de) Metallacrylate als härter für polybutadiene, melamine und epoxyverbindungen
BR0302358A (pt) Composição polimérica termorreversìvel reativa à umidade, e, métodos para preparar a mesma e para ligar substratos
ATE440125T1 (de) Oberflächenmodifiziertes corund sowie harzzusammensetzung
DE60326634D1 (de) Flammwidrige epoxidharzzusammensetzung und daraus erhaltenes gehärtetes objekt
TW200619257A (en) Epoxyresin compositions and articles

Legal Events

Date Code Title Description
8364 No opposition during term of opposition