DE60124721D1 - Federsensoranordnungen - Google Patents

Federsensoranordnungen

Info

Publication number
DE60124721D1
DE60124721D1 DE60124721T DE60124721T DE60124721D1 DE 60124721 D1 DE60124721 D1 DE 60124721D1 DE 60124721 T DE60124721 T DE 60124721T DE 60124721 T DE60124721 T DE 60124721T DE 60124721 D1 DE60124721 D1 DE 60124721D1
Authority
DE
Germany
Prior art keywords
sensor arrangements
spring sensor
spring
arrangements
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60124721T
Other languages
English (en)
Other versions
DE60124721T2 (de
Inventor
Frank Beckous
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gore Enterprise Holdings Inc
Original Assignee
Gore Enterprise Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gore Enterprise Holdings Inc filed Critical Gore Enterprise Holdings Inc
Publication of DE60124721D1 publication Critical patent/DE60124721D1/de
Application granted granted Critical
Publication of DE60124721T2 publication Critical patent/DE60124721T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
DE60124721T 2000-07-26 2001-07-25 Federsensoranordnungen Expired - Lifetime DE60124721T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US643664 2000-07-26
US09/643,664 US6498506B1 (en) 2000-07-26 2000-07-26 Spring probe assemblies
PCT/US2001/023391 WO2002008770A2 (en) 2000-07-26 2001-07-25 Spring probe assemblies

Publications (2)

Publication Number Publication Date
DE60124721D1 true DE60124721D1 (de) 2007-01-04
DE60124721T2 DE60124721T2 (de) 2007-10-04

Family

ID=24581771

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60124721T Expired - Lifetime DE60124721T2 (de) 2000-07-26 2001-07-25 Federsensoranordnungen

Country Status (5)

Country Link
US (1) US6498506B1 (de)
EP (1) EP1303763B1 (de)
JP (1) JP4615822B2 (de)
DE (1) DE60124721T2 (de)
WO (1) WO2002008770A2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6902416B2 (en) * 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6703855B1 (en) * 2002-12-03 2004-03-09 C.C.P. Contact Probes Co., Ltd. Structure of a probe
US6734689B1 (en) * 2002-12-05 2004-05-11 Tektronix, Inc. Measurement probe providing signal control for an EOS/ESD protection module
US7015708B2 (en) * 2003-07-11 2006-03-21 Gore Enterprise Holdings, Inc. Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
KR100600482B1 (ko) * 2004-06-22 2006-07-13 삼성전자주식회사 반도체 패키지 측정용 프로브
DE102004033302A1 (de) * 2004-07-08 2006-02-16 Endress + Hauser Gmbh + Co. Kg Testvorrichtung für elektronische Schaltungen
US7030636B1 (en) 2005-05-02 2006-04-18 Fargo Assembly Company Low pin testing system
US20060267605A1 (en) * 2005-05-27 2006-11-30 Yang Kei-Wean C Differential measurement probe having a ground clip system for the probing tips
US7322861B2 (en) * 2005-11-23 2008-01-29 Lear Corporation Power supply circuit for removable automotive interior systems with integrated switching function
US7553187B2 (en) * 2006-01-31 2009-06-30 3M Innovative Properties Company Electrical connector assembly
US7731528B2 (en) * 2006-01-31 2010-06-08 3M Innovative Properties Company Electrical termination device
US7876121B2 (en) 2007-09-14 2011-01-25 Mayo Foundation For Medical Education And Research Link analysis compliance and calibration verification for automated printed wiring board test systems
US7906979B2 (en) * 2007-09-14 2011-03-15 Mayo Foundation For Medical Education And Research High frequency differential test probe for automated printed wiring board test systems
US8007308B2 (en) * 2007-10-17 2011-08-30 3M Innovative Properties Company Electrical connector assembly
US7722394B2 (en) * 2008-02-21 2010-05-25 3M Innovative Properties Company Electrical termination device
US7795890B2 (en) * 2008-06-09 2010-09-14 Integrated Test Arizona Reduced ground spring probe array and method for controlling signal spring probe impedance
CN101614756A (zh) * 2008-06-27 2009-12-30 鸿富锦精密工业（深圳）有限公司 测试仪探头
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US20110138612A1 (en) * 2009-12-10 2011-06-16 Yin Te-Hung Jig For Probe Connector
US8029322B1 (en) * 2010-09-27 2011-10-04 Tyco Electronics Corporation Electrical contact assemblies and connectors including retention clips
CN104345184B (zh) * 2013-07-26 2019-03-01 苏州普源精电科技有限公司 一种多通道获取探头及具有多通道获取探头的测量仪器
CN204243228U (zh) * 2014-09-25 2015-04-01 富士康(昆山)电脑接插件有限公司 线缆连接器组件
KR102044753B1 (ko) * 2018-05-25 2019-11-15 리노공업주식회사 검사장치

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724180A (en) 1985-08-05 1988-02-09 Teradyne, Inc. Electrically shielded connectors
JPS63155573A (ja) * 1986-12-18 1988-06-28 株式会社日立製作所 プラグイン同軸コネクタのア−ス接続装置
US4931726A (en) 1987-06-22 1990-06-05 Hitachi, Ltd. Apparatus for testing semiconductor device
US5194020A (en) 1991-06-17 1993-03-16 W. L. Gore & Associates, Inc. High-density coaxial interconnect system
US5218293A (en) 1991-08-30 1993-06-08 Kan David T Passive high-frequency signal probe
US5850147A (en) 1992-03-10 1998-12-15 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
US5576631A (en) 1992-03-10 1996-11-19 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly
US5190472A (en) 1992-03-24 1993-03-02 W. L. Gore & Associates, Inc. Miniaturized high-density coaxial connector system with staggered grouper modules
JP3415889B2 (ja) * 1992-08-18 2003-06-09 ザ ウィタカー コーポレーション シールドコネクタ
US5399104A (en) * 1992-09-28 1995-03-21 Mckenzie Socket Technology, Inc. Socket for multi-lead integrated circuit packages
US5437562A (en) 1993-03-26 1995-08-01 The Whitaker Corporation Low profile edge mount connector
GB2291544B (en) 1994-07-12 1996-10-02 Everett Charles Tech Electrical connectors
JP2956877B2 (ja) * 1994-07-22 1999-10-04 矢崎総業株式会社 ワイヤーハーネス部品の検査方法及び検査具
US5509827A (en) * 1994-11-21 1996-04-23 Cray Computer Corporation High density, high bandwidth, coaxial cable, flexible circuit and circuit board connection assembly
US5625299A (en) 1995-02-03 1997-04-29 Uhling; Thomas F. Multiple lead analog voltage probe with high signal integrity over a wide band width
US5567179A (en) * 1995-02-10 1996-10-22 W. L. Gore & Associates, Inc. Connector system for coaxial cables
US5711676A (en) 1996-01-26 1998-01-27 The Whitaker Corporation Vertically mounted cable plug
JPH10289757A (ja) * 1997-02-13 1998-10-27 Yazaki Corp シールド電線のコネクタ構造
US5997314A (en) 1997-12-15 1999-12-07 Qualcomm Incorporated Method and apparatus for providing a dual purpose connection for interface with an antenna or connection interface
US6037787A (en) * 1998-03-24 2000-03-14 Teradyne, Inc. High performance probe interface for automatic test equipment
US6307787B1 (en) 2000-07-25 2001-10-23 Advanced Micro Devices, Inc. Burst read incorporating output based redundancy

Also Published As

Publication number Publication date
EP1303763A2 (de) 2003-04-23
US6498506B1 (en) 2002-12-24
WO2002008770A3 (en) 2002-04-25
JP4615822B2 (ja) 2011-01-19
EP1303763B1 (de) 2006-11-22
JP2004505408A (ja) 2004-02-19
WO2002008770A2 (en) 2002-01-31
DE60124721T2 (de) 2007-10-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition