DE60044226D1 - Silikongummi-Zusammensetzungen, ihrer Herstellung und Verwendung als Hochspannungsisolierstoff - Google Patents

Silikongummi-Zusammensetzungen, ihrer Herstellung und Verwendung als Hochspannungsisolierstoff

Info

Publication number
DE60044226D1
DE60044226D1 DE60044226T DE60044226T DE60044226D1 DE 60044226 D1 DE60044226 D1 DE 60044226D1 DE 60044226 T DE60044226 T DE 60044226T DE 60044226 T DE60044226 T DE 60044226T DE 60044226 D1 DE60044226 D1 DE 60044226D1
Authority
DE
Germany
Prior art keywords
preparation
high voltage
insulating material
silicone rubber
rubber compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60044226T
Other languages
English (en)
Inventor
Noriyuki Meguriya
Syuuichi Azechi
Susumu Sekiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23115599A external-priority patent/JP4780256B2/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60044226D1 publication Critical patent/DE60044226D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0247—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0657—Polyethers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
DE60044226T 1999-08-18 2000-01-19 Silikongummi-Zusammensetzungen, ihrer Herstellung und Verwendung als Hochspannungsisolierstoff Expired - Lifetime DE60044226D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23115599A JP4780256B2 (ja) 1998-08-24 1999-08-18 ポリマー碍子用シール材及びポリマー碍子用補修材

Publications (1)

Publication Number Publication Date
DE60044226D1 true DE60044226D1 (de) 2010-06-02

Family

ID=16919170

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60044226T Expired - Lifetime DE60044226D1 (de) 1999-08-18 2000-01-19 Silikongummi-Zusammensetzungen, ihrer Herstellung und Verwendung als Hochspannungsisolierstoff

Country Status (2)

Country Link
EP (1) EP1079398B1 (de)
DE (1) DE60044226D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1570494A1 (de) * 2002-12-09 2005-09-07 Rhodia Chimie Hitzehärtbare polysiloxanzusammensetzungen, insbesondere zur herstellung von elektrischen drähten und kabeln
WO2006085816A1 (en) * 2005-02-09 2006-08-17 Abb Research Ltd Silicone rubber material
CN102220011B (zh) * 2011-05-30 2012-11-21 黄山市强路新材料有限公司 一种加成型阻燃液态硅树脂及其制备方法
JP5998639B2 (ja) 2012-04-09 2016-09-28 信越化学工業株式会社 高電圧電気絶縁体ポリマー碍子用シリコーンゴム組成物及びポリマー碍子
EP2842992B1 (de) * 2013-08-27 2017-02-08 ContiTech Elastomer-Beschichtungen GmbH Isolationsmaterial
JP2015101601A (ja) * 2013-11-21 2015-06-04 日本碍子株式会社 ポリマー碍子用外被ゴム
GB201709563D0 (en) * 2017-06-15 2017-08-02 Advanced Insulation Plc Thixotropic silicone mixture
RU2672447C1 (ru) * 2017-09-25 2018-11-14 Федеральное государственное бюджетное образовательное учреждение высшего образования "Владимирский Государственный Университет имени Александра Григорьевича и Николая Григорьевича Столетовых" (ВлГУ) Композиция для кремнийорганического электроизоляционного материала

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2689281B2 (ja) * 1990-07-26 1997-12-10 日本碍子株式会社 屋外で使用する碍子用シリコーンゴム組成物
JP3378597B2 (ja) * 1992-09-28 2003-02-17 東レ・ダウコーニング・シリコーン株式会社 耐油性シリコーンゴム組成物
JP2557604B2 (ja) * 1993-08-17 1996-11-27 東レ・ダウコーニング・シリコーン株式会社 碍 子
US5668205A (en) * 1994-05-27 1997-09-16 Shin-Etsu Chemical Co., Ltd. Silicone rubber compositions for high-voltage electrical insulators
JP3457150B2 (ja) * 1997-06-18 2003-10-14 財団法人鉄道総合技術研究所 セラミックがいし塗膜用シリコーン組成物

Also Published As

Publication number Publication date
EP1079398B1 (de) 2010-04-21
EP1079398A3 (de) 2001-09-12
EP1079398A2 (de) 2001-02-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition