DE60020928D1 - Verschleissfeste Federkontakte - Google Patents

Verschleissfeste Federkontakte

Info

Publication number
DE60020928D1
DE60020928D1 DE60020928T DE60020928T DE60020928D1 DE 60020928 D1 DE60020928 D1 DE 60020928D1 DE 60020928 T DE60020928 T DE 60020928T DE 60020928 T DE60020928 T DE 60020928T DE 60020928 D1 DE60020928 D1 DE 60020928D1
Authority
DE
Germany
Prior art keywords
wear
spring contacts
resistant spring
resistant
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60020928T
Other languages
English (en)
Other versions
DE60020928T2 (de
Inventor
Patrick Kim
Andrew S Alimonda
Donald L Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of DE60020928D1 publication Critical patent/DE60020928D1/de
Application granted granted Critical
Publication of DE60020928T2 publication Critical patent/DE60020928T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE60020928T 1999-10-20 2000-10-17 Verschleissfeste Federkontakte Expired - Lifetime DE60020928T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/421,389 US6352454B1 (en) 1999-10-20 1999-10-20 Wear-resistant spring contacts
US421389 1999-10-20

Publications (2)

Publication Number Publication Date
DE60020928D1 true DE60020928D1 (de) 2005-07-28
DE60020928T2 DE60020928T2 (de) 2006-05-11

Family

ID=23670316

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60020928T Expired - Lifetime DE60020928T2 (de) 1999-10-20 2000-10-17 Verschleissfeste Federkontakte

Country Status (4)

Country Link
US (1) US6352454B1 (de)
EP (1) EP1094319B1 (de)
JP (1) JP4530517B2 (de)
DE (1) DE60020928T2 (de)

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* Cited by examiner, † Cited by third party
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US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US20070245553A1 (en) * 1999-05-27 2007-10-25 Chong Fu C Fine pitch microfabricated spring contact structure & method
US6710609B2 (en) * 2002-07-15 2004-03-23 Nanonexus, Inc. Mosaic decal probe
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US7579848B2 (en) * 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
KR100600092B1 (ko) * 2000-06-28 2006-07-13 닛폰 하츠죠 가부시키가이샤 도전성 접촉자
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
CN1575350A (zh) * 2001-08-24 2005-02-02 纳米纳克斯公司 用于在溅射薄膜中产生均匀、各向同性应力的方法和装置
DE10150291A1 (de) * 2001-10-15 2003-05-08 Infineon Technologies Ag Sondennadel zum Testen von Halbleiterchips und Verfahren zu ihrer Herstellung
US6866255B2 (en) * 2002-04-12 2005-03-15 Xerox Corporation Sputtered spring films with low stress anisotropy
US7006720B2 (en) * 2002-04-30 2006-02-28 Xerox Corporation Optical switching system
US6891240B2 (en) 2002-04-30 2005-05-10 Xerox Corporation Electrode design and positioning for controlled movement of a moveable electrode and associated support structure
US7047638B2 (en) * 2002-07-24 2006-05-23 Formfactor, Inc Method of making microelectronic spring contact array
US6793544B2 (en) * 2003-02-05 2004-09-21 General Motors Corporation Corrosion resistant fuel cell terminal plates
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7015584B2 (en) * 2003-07-08 2006-03-21 Xerox Corporation High force metal plated spring structure
WO2006017078A2 (en) * 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US6973722B2 (en) * 2003-11-17 2005-12-13 Palo Alto Research Center Incorporated Release height adjustment of stressy metal devices by annealing before and after release
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
JP4723195B2 (ja) * 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
US20060074836A1 (en) * 2004-09-03 2006-04-06 Biowisdom Limited System and method for graphically displaying ontology data
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US20060058821A1 (en) * 2004-09-15 2006-03-16 Jansheski John M Tongue scraper
JP2006084450A (ja) * 2004-09-17 2006-03-30 Sumitomo Electric Ind Ltd コンタクトプローブおよびプローブカード
US7230440B2 (en) 2004-10-21 2007-06-12 Palo Alto Research Center Incorporated Curved spring structure with elongated section located under cantilevered section
US8330485B2 (en) * 2004-10-21 2012-12-11 Palo Alto Research Center Incorporated Curved spring structure with downturned tip
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7550855B2 (en) * 2005-12-02 2009-06-23 Palo Alto Research Center Incorporated Vertically spaced plural microsprings
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
EP2060921A1 (de) * 2007-11-16 2009-05-20 Technoprobe S.p.A Kontaktsonde für Prüfkopf mit vertikalen Sonden und dazugehöriger Prüfkopf zur Prüfung der elektrischen Eigenschaft von Mikrostrukturen
US20090140433A1 (en) * 2007-11-30 2009-06-04 Alces Technology, Inc. MEMS chip-to-chip interconnects
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8441808B2 (en) 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
US8519534B2 (en) 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
US9735066B2 (en) * 2014-01-30 2017-08-15 Fei Company Surface delayering with a programmed manipulator
CN104124495B (zh) * 2014-07-08 2018-08-14 中国电子科技集团公司第四十一研究所 一种射频机械开关及微波程控步进衰减器
CN104730298B (zh) * 2015-03-19 2017-12-12 西安福科材料科技有限公司 用于电子测试探针的耐磨导电多层复合薄膜及其工业制备方法
KR101717567B1 (ko) * 2015-08-05 2017-03-20 주식회사 유진텍 연료전지 전압측정단자용 지르코니아-니켈 핀 및 그 제조방법
US20190273341A1 (en) * 2018-03-01 2019-09-05 Dell Products L.P. High Speed Connector
KR102114210B1 (ko) * 2018-12-17 2020-05-25 주식회사 코리아 인스트루먼트 프로브 빔 및 프로브 모듈

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US3780247A (en) * 1972-05-18 1973-12-18 Bunker Ramo Contact element having noble wear area
US3842189A (en) 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
JPH06289056A (ja) * 1993-04-02 1994-10-18 Kobe Steel Ltd プローブユニット
US5475318A (en) * 1993-10-29 1995-12-12 Robert B. Marcus Microprobe
JPH08240598A (ja) * 1995-03-02 1996-09-17 Nikon Corp 導電性プローブ
US5720098A (en) * 1995-05-12 1998-02-24 Probe Technology Method for making a probe preserving a uniform stress distribution under deflection
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
US5665648A (en) 1995-12-21 1997-09-09 Hughes Electronics Integrated circuit spring contact fabrication methods
US5944537A (en) 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Also Published As

Publication number Publication date
EP1094319A2 (de) 2001-04-25
US6352454B1 (en) 2002-03-05
EP1094319B1 (de) 2005-06-22
DE60020928T2 (de) 2006-05-11
JP2001165959A (ja) 2001-06-22
JP4530517B2 (ja) 2010-08-25
EP1094319A3 (de) 2004-01-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition