DE60005959D1 - SEMICONDUCTOR DEVICE - Google Patents

SEMICONDUCTOR DEVICE

Info

Publication number
DE60005959D1
DE60005959D1 DE60005959T DE60005959T DE60005959D1 DE 60005959 D1 DE60005959 D1 DE 60005959D1 DE 60005959 T DE60005959 T DE 60005959T DE 60005959 T DE60005959 T DE 60005959T DE 60005959 D1 DE60005959 D1 DE 60005959D1
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60005959T
Other languages
German (de)
Other versions
DE60005959T2 (en
Inventor
Takashi Hirano
Kagehisa Yamamoto
Toshio Banba
Hiroaki Makabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of DE60005959D1 publication Critical patent/DE60005959D1/en
Application granted granted Critical
Publication of DE60005959T2 publication Critical patent/DE60005959T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

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  • Chemical & Material Sciences (AREA)
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  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polyamides (AREA)
DE60005959T 1999-02-26 2000-02-23 SEMICONDUCTOR DEVICE Expired - Lifetime DE60005959T2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP5142299 1999-02-26
JP5142299 1999-02-26
JP2000039079 2000-02-17
JP2000039079A JP3667184B2 (en) 1999-02-26 2000-02-17 Semiconductor device
PCT/JP2000/001028 WO2000052757A1 (en) 1999-02-26 2000-02-23 Semiconductor device

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DE60005959D1 true DE60005959D1 (en) 2003-11-20
DE60005959T2 DE60005959T2 (en) 2004-08-12

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US (1) US6576381B1 (en)
EP (1) EP1195811B1 (en)
JP (1) JP3667184B2 (en)
KR (1) KR100695636B1 (en)
CN (1) CN1198334C (en)
DE (1) DE60005959T2 (en)
TW (1) TW500978B (en)
WO (1) WO2000052757A1 (en)

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JP2003045877A (en) * 2001-08-01 2003-02-14 Sharp Corp Semiconductor device and its manufacturing method
CN1287435C (en) * 2002-06-27 2006-11-29 松下电器产业株式会社 Semiconductor device and manufacturing method thereof
US6887643B2 (en) * 2002-08-05 2005-05-03 Toray Industries, Inc. Photosensitive resin precursor composition
EP2381308B1 (en) * 2003-06-23 2015-07-29 Sumitomo Bakelite Co., Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
JP4327657B2 (en) * 2004-05-20 2009-09-09 Ｎｅｃエレクトロニクス株式会社 Semiconductor device
CN101138084B (en) * 2004-10-29 2010-06-02 弗利普芯片国际有限公司 Semiconductor device package with bump overlying a polymer layer
US7220520B2 (en) * 2005-06-03 2007-05-22 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive resin compositions
TW200702913A (en) * 2005-06-03 2007-01-16 Fujifilm Electronic Materials Pretreatment compositions
SG175668A1 (en) * 2006-10-24 2011-11-28 Sumitomo Bakelite Co Bis(aminophenol) derivative, process for producing the same, polyamide resin, positive photosensitive resin compositions, protective film, interlayer dielectric, semiconductor device, and display element
US9524945B2 (en) 2010-05-18 2016-12-20 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with L-shaped non-metal sidewall protection structure
JP5410918B2 (en) * 2008-10-20 2014-02-05 チェイル インダストリーズ インコーポレイテッド Positive photosensitive resin composition
CN102282659B (en) * 2009-02-04 2013-11-20 松下电器产业株式会社 Semiconductor substrate structure and semiconductor device
US8841766B2 (en) 2009-07-30 2014-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with non-metal sidewall protection structure
US8377816B2 (en) * 2009-07-30 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming electrical connections
US8324738B2 (en) 2009-09-01 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Self-aligned protection layer for copper post structure
US8659155B2 (en) * 2009-11-05 2014-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps
US8610270B2 (en) * 2010-02-09 2013-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and semiconductor assembly with lead-free solder
US8441124B2 (en) 2010-04-29 2013-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with non-metal sidewall protection structure
US9018758B2 (en) 2010-06-02 2015-04-28 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with non-metal sidewall spacer and metal top cap

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US5194934A (en) * 1988-07-27 1993-03-16 Semiconductor Energy Laboratory Co., Ltd. Mounting structure for a semiconductor chip having a buffer layer
DE59208963D1 (en) 1991-05-07 1997-11-20 Siemens Ag Highly heat-resistant positive resists and process for the production of highly heat-resistant relief structures
US5162257A (en) * 1991-09-13 1992-11-10 Mcnc Solder bump fabrication method
KR0181615B1 (en) * 1995-01-30 1999-04-15 모리시다 요이치 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
JPH11505668A (en) 1995-03-20 1999-05-21 エムシーエヌシー Solder bump manufacturing method and structure including titanium barrier layer
TW502135B (en) * 1996-05-13 2002-09-11 Sumitomo Bakelite Co Positive type photosensitive resin composition and process for preparing polybenzoxazole resin film by using the same
US6222272B1 (en) * 1996-08-06 2001-04-24 Nitto Denko Corporation Film carrier and semiconductor device using same
JPH1135915A (en) 1997-07-15 1999-02-09 Toray Ind Inc Resin-sealed semiconductor device
JPH11312675A (en) 1998-04-27 1999-11-09 Sumitomo Bakelite Co Ltd Semiconductor device and manufacture thereof

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EP1195811B1 (en) 2003-10-15
CN1341279A (en) 2002-03-20
KR100695636B1 (en) 2007-03-15
EP1195811A1 (en) 2002-04-10
JP3667184B2 (en) 2005-07-06
TW500978B (en) 2002-09-01
JP2000310858A (en) 2000-11-07
US6576381B1 (en) 2003-06-10
DE60005959T2 (en) 2004-08-12
WO2000052757A1 (en) 2000-09-08
CN1198334C (en) 2005-04-20
EP1195811A4 (en) 2002-05-15
KR20010111495A (en) 2001-12-19

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