DE59810231D1 - WIRING PROCESS FOR SEMICONDUCTOR COMPONENTS FOR PREVENTING PRODUCT PIRACY AND PRODUCT MANIPULATION BY THE PROCESS PRODUCED SEMICONDUCTOR COMPONENT AND USE OF THE SEMICONDUCTOR COMPONENT IN A CHIPKAR - Google Patents

WIRING PROCESS FOR SEMICONDUCTOR COMPONENTS FOR PREVENTING PRODUCT PIRACY AND PRODUCT MANIPULATION BY THE PROCESS PRODUCED SEMICONDUCTOR COMPONENT AND USE OF THE SEMICONDUCTOR COMPONENT IN A CHIPKAR

Info

Publication number
DE59810231D1
DE59810231D1 DE59810231T DE59810231T DE59810231D1 DE 59810231 D1 DE59810231 D1 DE 59810231D1 DE 59810231 T DE59810231 T DE 59810231T DE 59810231 T DE59810231 T DE 59810231T DE 59810231 D1 DE59810231 D1 DE 59810231D1
Authority
DE
Germany
Prior art keywords
semiconductor component
product
semiconductor
chipkar
manipulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59810231T
Other languages
German (de)
Inventor
Peter Ramm
Reinhold Buchner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority claimed from PCT/DE1998/002645 external-priority patent/WO1999016131A1/en
Application granted granted Critical
Publication of DE59810231D1 publication Critical patent/DE59810231D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE59810231T 1997-09-19 1998-09-04 WIRING PROCESS FOR SEMICONDUCTOR COMPONENTS FOR PREVENTING PRODUCT PIRACY AND PRODUCT MANIPULATION BY THE PROCESS PRODUCED SEMICONDUCTOR COMPONENT AND USE OF THE SEMICONDUCTOR COMPONENT IN A CHIPKAR Expired - Lifetime DE59810231D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19741507 1997-09-19
DE19746641A DE19746641B4 (en) 1997-09-19 1997-10-22 Wiring method for semiconductor devices for preventing product piracy and product manipulation and use of the semiconductor device in a smart card
PCT/DE1998/002645 WO1999016131A1 (en) 1997-09-19 1998-09-04 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductor component made according to this method and use of said semi-conductor component in a chip card

Publications (1)

Publication Number Publication Date
DE59810231D1 true DE59810231D1 (en) 2003-12-24

Family

ID=7843033

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19746641A Expired - Fee Related DE19746641B4 (en) 1997-09-19 1997-10-22 Wiring method for semiconductor devices for preventing product piracy and product manipulation and use of the semiconductor device in a smart card
DE59810231T Expired - Lifetime DE59810231D1 (en) 1997-09-19 1998-09-04 WIRING PROCESS FOR SEMICONDUCTOR COMPONENTS FOR PREVENTING PRODUCT PIRACY AND PRODUCT MANIPULATION BY THE PROCESS PRODUCED SEMICONDUCTOR COMPONENT AND USE OF THE SEMICONDUCTOR COMPONENT IN A CHIPKAR

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19746641A Expired - Fee Related DE19746641B4 (en) 1997-09-19 1997-10-22 Wiring method for semiconductor devices for preventing product piracy and product manipulation and use of the semiconductor device in a smart card

Country Status (1)

Country Link
DE (2) DE19746641B4 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19940759B4 (en) * 1999-08-27 2004-04-15 Infineon Technologies Ag Circuit arrangement and method for the production thereof
AU2002356147A1 (en) 2001-08-24 2003-03-10 Schott Glas Method for producing contacts and printed circuit packages

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5030796A (en) * 1989-08-11 1991-07-09 Rockwell International Corporation Reverse-engineering resistant encapsulant for microelectric device
US5489554A (en) * 1992-07-21 1996-02-06 Hughes Aircraft Company Method of making a 3-dimensional circuit assembly having electrical contacts that extend through the IC layer
US5258334A (en) * 1993-01-15 1993-11-02 The U.S. Government As Represented By The Director, National Security Agency Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices
US5399441A (en) * 1994-04-12 1995-03-21 Dow Corning Corporation Method of applying opaque coatings
DE4433833A1 (en) * 1994-09-22 1996-03-28 Fraunhofer Ges Forschung Method for producing a three-dimensional integrated circuit while achieving high system yields
DE4433845A1 (en) * 1994-09-22 1996-03-28 Fraunhofer Ges Forschung Method of manufacturing a three-dimensional integrated circuit
US5739714A (en) * 1995-10-24 1998-04-14 Lucent Technologies, Inc. Apparatus for controlling ground bounce
EP0771023A3 (en) * 1995-10-27 1999-03-24 Honeywell Inc. Method of applying a protective coating on a semiconductor integrated circuit

Also Published As

Publication number Publication date
DE19746641B4 (en) 2006-02-23
DE19746641A1 (en) 1999-04-01

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