DE59009253D1 - Method and arrangement for controlling the sequence of galvanic systems. - Google Patents

Method and arrangement for controlling the sequence of galvanic systems.

Info

Publication number
DE59009253D1
DE59009253D1 DE59009253T DE59009253T DE59009253D1 DE 59009253 D1 DE59009253 D1 DE 59009253D1 DE 59009253 T DE59009253 T DE 59009253T DE 59009253 T DE59009253 T DE 59009253T DE 59009253 D1 DE59009253 D1 DE 59009253D1
Authority
DE
Germany
Prior art keywords
parts
pct
electroplated
distances
controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59009253T
Other languages
German (de)
Inventor
Horst Blaesing
Manfred Maurer
Rolf Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of DE59009253D1 publication Critical patent/DE59009253D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

PCT No. PCT/DE90/00943 Sec. 371 Date Jun. 18, 1992 Sec. 102(e) Date Jun. 18, 1992 PCT Filed Nov. 30, 1990 PCT Pub. No. WO91/08327 PCT Pub. Date Jun. 13, 1991.A process and apparatus are disclosed for controlling the flow of operations in electroplating plants with horizontal throughflow in which the parts to be electroplated, in particular plate-shaped parts, pass through the plant in succession and are electroplated by means of currents applied by anodes. In order to prevent undesirable, increased precipitation on the front faces or edges of parts to be electroplated which follow each other at undesirable distances apart, or at least to reduce this precipitation to an acceptable level, the position of the parts which pass through the plant in succession and/or the distances between these parts are detected and the application of the electroplating currents is controlled as a function of these positions and/or distances by switching the anodes on and off, in such a manner that the flux density is approximately the same in all regions of the parts.
DE59009253T 1989-12-01 1990-11-30 Method and arrangement for controlling the sequence of galvanic systems. Expired - Fee Related DE59009253D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3939681A DE3939681A1 (en) 1989-12-01 1989-12-01 METHOD FOR CONTROLLING THE OUTLET OF GALVANIC PLANTS AND FOR IMPLEMENTING THE METHOD OF THE SERVICE ARRANGEMENT
PCT/DE1990/000943 WO1991008327A1 (en) 1989-12-01 1990-11-30 Process and device for controlling the flow of operations in electroplating plants

Publications (1)

Publication Number Publication Date
DE59009253D1 true DE59009253D1 (en) 1995-07-20

Family

ID=6394543

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3939681A Granted DE3939681A1 (en) 1989-12-01 1989-12-01 METHOD FOR CONTROLLING THE OUTLET OF GALVANIC PLANTS AND FOR IMPLEMENTING THE METHOD OF THE SERVICE ARRANGEMENT
DE59009253T Expired - Fee Related DE59009253D1 (en) 1989-12-01 1990-11-30 Method and arrangement for controlling the sequence of galvanic systems.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE3939681A Granted DE3939681A1 (en) 1989-12-01 1989-12-01 METHOD FOR CONTROLLING THE OUTLET OF GALVANIC PLANTS AND FOR IMPLEMENTING THE METHOD OF THE SERVICE ARRANGEMENT

Country Status (9)

Country Link
US (1) US5292424A (en)
EP (1) EP0502915B1 (en)
JP (1) JP2944744B2 (en)
KR (1) KR920703886A (en)
AT (1) ATE123822T1 (en)
CA (1) CA2069908C (en)
DE (2) DE3939681A1 (en)
ES (1) ES2074588T3 (en)
WO (1) WO1991008327A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19504517C1 (en) * 1995-02-11 1996-08-08 Atotech Deutschland Gmbh Process for electroplating plate-shaped items to be treated in horizontal continuous systems and device for carrying out the process
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
DE19612555C2 (en) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Process for the selective electrochemical treatment of printed circuit boards and device for carrying out the process
DE19645875A1 (en) * 1996-09-10 1998-03-12 Stohrer Doduco Gmbh & Co Electro plating of sheet workpieces
DE19707905C1 (en) * 1997-02-27 1998-02-05 Atotech Deutschland Gmbh Bipolar pulsed current supply method for electroplating
DE19717512C3 (en) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Device for electroplating circuit boards under constant conditions in continuous systems
DE19717510C1 (en) * 1997-04-25 1998-10-01 Atotech Deutschland Gmbh Device for dimming electroplated goods in continuous systems
EP1541719A3 (en) 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6261425B1 (en) 1998-08-28 2001-07-17 Process Automation International, Ltd. Electroplating machine
US6203685B1 (en) 1999-01-20 2001-03-20 International Business Machines Corporation Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
DE10153171B4 (en) * 2001-10-27 2004-09-16 Atotech Deutschland Gmbh Method and device for the electrolytic treatment of parts in continuous systems
DE10215463C1 (en) * 2002-03-28 2003-07-24 Atotech Deutschland Gmbh Continuous plant for electrolytic metallization of printed circuit boards, includes precautions reducing electrical potential between adjacent workpieces
US8133374B2 (en) * 2006-09-21 2012-03-13 Panasonic Corporation Method and apparatus for manufacturing negative electrode for non-aqueous electrolyte secondary battery
JP5457010B2 (en) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 Continuous plating equipment
DE102009057463A1 (en) 2009-12-03 2011-06-09 Hübel, Egon Method for electrochemical treatment of goods as section, comprises conveying the goods in transport direction with mutual distance as a gap through continuous flow system by means of rotating or moving transport and/or contact means
JP5795514B2 (en) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 Continuous plating equipment
US20150090599A1 (en) * 2013-10-02 2015-04-02 Tel Nexx, Inc. Insoluble Anode With a Plurality of Switchable Conductive Elements Used to Control Current Density in a Plating Bath
CN104988573B (en) * 2015-05-27 2017-08-08 广州杰赛科技股份有限公司 The electro-plating method and device of a kind of circuit board
CN112760701B (en) * 2020-12-16 2022-04-12 景旺电子科技(珠海)有限公司 Vertical continuous electroplating equipment
CN114016118A (en) * 2021-11-09 2022-02-08 邦仪精密科技(苏州)有限公司 Special electroplating device and method for high-speed rail train accessories

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880725A (en) * 1974-04-10 1975-04-29 Rca Corp Predetermined thickness profiles through electroplating
FR2396102A1 (en) * 1977-06-29 1979-01-26 Trefimetaux CONTINUOUS HIGH-SPEED ELECTROLYTIC DEPOSIT PROCESS ON A MOVING METAL SUBSTRATE
US4240881A (en) * 1979-02-02 1980-12-23 Republic Steel Corporation Electroplating current control
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
JPS58140820A (en) * 1982-02-16 1983-08-20 Nippon Steel Corp Automatic changeover controller of plating current
DE3205969A1 (en) * 1982-02-19 1983-09-01 Frisch Kabel- Und Verseilmaschinenbau Gmbh, 4030 Ratingen Power supply for electrolysis plants
JPS60128295A (en) * 1983-12-16 1985-07-09 Nippon Steel Corp Device for automatic compensation and control of plating current
US4534832A (en) * 1984-08-27 1985-08-13 Emtek, Inc. Arrangement and method for current density control in electroplating
US4749460A (en) * 1984-12-14 1988-06-07 Mitsubishi Denki Kabushiki Kaisha Plating current automatic compensating apparatus
GB8809750D0 (en) * 1988-04-25 1988-06-02 Beckswift Ltd Electrical apparatus
DD273653A1 (en) * 1988-07-04 1989-11-22 Mikroelektronik Bruno Baum Zeh DEVICE FOR THE EQUIPPED GALVANIC COATING OF MULTIPLE PARALLEL IN A BATHROOM TO CUSTOMIZE BANDFOERMIGER SUBSTRATE

Also Published As

Publication number Publication date
EP0502915A1 (en) 1992-09-16
CA2069908C (en) 1998-12-22
KR920703886A (en) 1992-12-18
WO1991008327A1 (en) 1991-06-13
CA2069908A1 (en) 1991-06-02
US5292424A (en) 1994-03-08
DE3939681C2 (en) 1993-01-28
JP2944744B2 (en) 1999-09-06
JPH05501284A (en) 1993-03-11
EP0502915B1 (en) 1995-06-14
DE3939681A1 (en) 1991-06-06
ATE123822T1 (en) 1995-06-15
ES2074588T3 (en) 1995-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee