DE502005000985D1 - Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen - Google Patents

Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen

Info

Publication number
DE502005000985D1
DE502005000985D1 DE502005000985T DE502005000985T DE502005000985D1 DE 502005000985 D1 DE502005000985 D1 DE 502005000985D1 DE 502005000985 T DE502005000985 T DE 502005000985T DE 502005000985 T DE502005000985 T DE 502005000985T DE 502005000985 D1 DE502005000985 D1 DE 502005000985D1
Authority
DE
Germany
Prior art keywords
flip chip
microwave antenna
chip technology
semiconductor assemblies
assemblies manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE502005000985T
Other languages
English (en)
Inventor
Wolfgang Heinrich
Prodyut Talukder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Forschungsverbund Berlin FVB eV
Original Assignee
Forschungsverbund Berlin FVB eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forschungsverbund Berlin FVB eV filed Critical Forschungsverbund Berlin FVB eV
Publication of DE502005000985D1 publication Critical patent/DE502005000985D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10Resonant slot antennas
    • H01Q13/18Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02Waveguide horns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02Waveguide horns
    • H01Q13/0283Apparatus or processes specially provided for manufacturing horns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/28Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements
    • H01Q19/32Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements the primary active element being end-fed and elongated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0087Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093Monolithic arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)
DE502005000985T 2004-03-19 2005-03-16 Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen Expired - Fee Related DE502005000985D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004014018A DE102004014018B3 (de) 2004-03-19 2004-03-19 Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen
PCT/EP2005/003303 WO2005091438A1 (de) 2004-03-19 2005-03-16 Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen

Publications (1)

Publication Number Publication Date
DE502005000985D1 true DE502005000985D1 (de) 2007-08-16

Family

ID=34745452

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102004014018A Expired - Fee Related DE102004014018B3 (de) 2004-03-19 2004-03-19 Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen
DE502005000985T Expired - Fee Related DE502005000985D1 (de) 2004-03-19 2005-03-16 Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102004014018A Expired - Fee Related DE102004014018B3 (de) 2004-03-19 2004-03-19 Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen

Country Status (6)

Country Link
US (1) US7612728B2 (de)
EP (1) EP1726063B1 (de)
JP (1) JP2007529930A (de)
AT (1) ATE366465T1 (de)
DE (2) DE102004014018B3 (de)
WO (1) WO2005091438A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9103902B2 (en) * 2007-05-09 2015-08-11 Infineon Technologies Ag Packaged antenna and method for producing same
JP2009200101A (ja) 2008-02-19 2009-09-03 Liquid Design Systems:Kk 半導体チップ及び半導体装置
US8274136B2 (en) * 2009-04-09 2012-09-25 Worcester Polytechnic Institute Semiconductor patch antenna
JP5429459B2 (ja) * 2009-06-01 2014-02-26 独立行政法人情報通信研究機構 ミリ波アンテナ
US8489162B1 (en) * 2010-08-17 2013-07-16 Amazon Technologies, Inc. Slot antenna within existing device component
EP2667449A1 (de) * 2012-05-23 2013-11-27 Nxp B.V. Integriertes Schaltungspaket mit integrierter Antenne
US9871299B2 (en) 2014-12-04 2018-01-16 Qualcomm Incorporated Cavity backed aperture antenna
US9443810B1 (en) * 2015-09-14 2016-09-13 Qualcomm Incorporated Flip-chip employing integrated cavity filter, and related components, systems, and methods
WO2018182569A1 (en) 2017-03-27 2018-10-04 Intel Corporation Antennas integrated into a printed circuit board
US11527696B2 (en) * 2017-10-05 2022-12-13 Google Llc Low footprint resonator in flip chip geometry
CN113659322B (zh) * 2021-07-26 2024-04-19 西安理工大学 一种基于四分之一模的波束可重构基片集成波导天线

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5115245A (en) * 1990-09-04 1992-05-19 Hughes Aircraft Company Single substrate microwave radar transceiver including flip-chip integrated circuits
JP3141692B2 (ja) * 1994-08-11 2001-03-05 松下電器産業株式会社 ミリ波用検波器
JP3471160B2 (ja) * 1996-03-18 2003-11-25 株式会社東芝 モノリシックアンテナ
US6563464B2 (en) * 2001-03-19 2003-05-13 International Business Machines Corporation Integrated on-chip half-wave dipole antenna structure
EP1258948A3 (de) * 2001-05-17 2004-04-07 Hitachi Kokusai Electric Inc. Halbkreisförmige Radialantenne

Also Published As

Publication number Publication date
ATE366465T1 (de) 2007-07-15
DE102004014018B3 (de) 2005-08-11
EP1726063A1 (de) 2006-11-29
US7612728B2 (en) 2009-11-03
JP2007529930A (ja) 2007-10-25
WO2005091438A1 (de) 2005-09-29
US20080238792A1 (en) 2008-10-02
EP1726063B1 (de) 2007-07-04

Similar Documents

Publication Publication Date Title
DE502005000985D1 (de) Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen
EP4235768A3 (de) Integrierte strukturen mit antennenelementen und ic-chips mit randkontaktverbindungen
HK1122906A1 (en) Antenna structure of an integrated circuit
WO2005034203A3 (en) Method and apparatus for a dual substrate package
TWI266354B (en) IC tag-bearing wiring board and method of fabricating the same
WO2007004137A3 (en) Electronic device
FR2882174B1 (fr) Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
TW200620594A (en) Flip chip ball grid array package assemblies
WO2003100858A3 (en) Surface mounted decoupling capacitor system and process of making the same
TW200705621A (en) Interposer and semiconductor device
TWI260056B (en) Module structure having an embedded chip
WO2005018291A3 (en) Thermally enhanced electronic module with self-aligning heat sink
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
TW200605296A (en) A semiconductor device with a plurality of ground planes
FR2963478B1 (fr) Dispositif semi-conducteur comprenant un composant passif de condensateurs et procede pour sa fabrication.
TW200802647A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
TW200635013A (en) Stacked semiconductor package
WO2006132803A3 (en) Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
TW200703523A (en) Semiconductor device with low CTE substrates
TW200627652A (en) Electronic package and method of manufacturing same
WO2003083942A3 (en) Semiconductor device with components embedded in backside diamond layer
TW200723462A (en) Package module with alignment structure and electronic device with the same
TW200721418A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device
MX2007003615A (es) Circuito integrado y metodo de fabricacion.
TWI264127B (en) Chip package and substrate thereof

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee