DE502005000985D1 - Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen - Google Patents
Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppenInfo
- Publication number
- DE502005000985D1 DE502005000985D1 DE502005000985T DE502005000985T DE502005000985D1 DE 502005000985 D1 DE502005000985 D1 DE 502005000985D1 DE 502005000985 T DE502005000985 T DE 502005000985T DE 502005000985 T DE502005000985 T DE 502005000985T DE 502005000985 D1 DE502005000985 D1 DE 502005000985D1
- Authority
- DE
- Germany
- Prior art keywords
- flip chip
- microwave antenna
- chip technology
- semiconductor assemblies
- assemblies manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/02—Waveguide horns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/02—Waveguide horns
- H01Q13/0283—Apparatus or processes specially provided for manufacturing horns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/28—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements
- H01Q19/32—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements the primary active element being end-fed and elongated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004014018A DE102004014018B3 (de) | 2004-03-19 | 2004-03-19 | Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen |
PCT/EP2005/003303 WO2005091438A1 (de) | 2004-03-19 | 2005-03-16 | Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE502005000985D1 true DE502005000985D1 (de) | 2007-08-16 |
Family
ID=34745452
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004014018A Expired - Fee Related DE102004014018B3 (de) | 2004-03-19 | 2004-03-19 | Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen |
DE502005000985T Expired - Fee Related DE502005000985D1 (de) | 2004-03-19 | 2005-03-16 | Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004014018A Expired - Fee Related DE102004014018B3 (de) | 2004-03-19 | 2004-03-19 | Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen |
Country Status (6)
Country | Link |
---|---|
US (1) | US7612728B2 (de) |
EP (1) | EP1726063B1 (de) |
JP (1) | JP2007529930A (de) |
AT (1) | ATE366465T1 (de) |
DE (2) | DE102004014018B3 (de) |
WO (1) | WO2005091438A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9103902B2 (en) * | 2007-05-09 | 2015-08-11 | Infineon Technologies Ag | Packaged antenna and method for producing same |
JP2009200101A (ja) | 2008-02-19 | 2009-09-03 | Liquid Design Systems:Kk | 半導体チップ及び半導体装置 |
US8274136B2 (en) * | 2009-04-09 | 2012-09-25 | Worcester Polytechnic Institute | Semiconductor patch antenna |
JP5429459B2 (ja) * | 2009-06-01 | 2014-02-26 | 独立行政法人情報通信研究機構 | ミリ波アンテナ |
US8489162B1 (en) * | 2010-08-17 | 2013-07-16 | Amazon Technologies, Inc. | Slot antenna within existing device component |
EP2667449A1 (de) * | 2012-05-23 | 2013-11-27 | Nxp B.V. | Integriertes Schaltungspaket mit integrierter Antenne |
US9871299B2 (en) | 2014-12-04 | 2018-01-16 | Qualcomm Incorporated | Cavity backed aperture antenna |
US9443810B1 (en) * | 2015-09-14 | 2016-09-13 | Qualcomm Incorporated | Flip-chip employing integrated cavity filter, and related components, systems, and methods |
WO2018182569A1 (en) | 2017-03-27 | 2018-10-04 | Intel Corporation | Antennas integrated into a printed circuit board |
US11527696B2 (en) * | 2017-10-05 | 2022-12-13 | Google Llc | Low footprint resonator in flip chip geometry |
CN113659322B (zh) * | 2021-07-26 | 2024-04-19 | 西安理工大学 | 一种基于四分之一模的波束可重构基片集成波导天线 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5115245A (en) * | 1990-09-04 | 1992-05-19 | Hughes Aircraft Company | Single substrate microwave radar transceiver including flip-chip integrated circuits |
JP3141692B2 (ja) * | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | ミリ波用検波器 |
JP3471160B2 (ja) * | 1996-03-18 | 2003-11-25 | 株式会社東芝 | モノリシックアンテナ |
US6563464B2 (en) * | 2001-03-19 | 2003-05-13 | International Business Machines Corporation | Integrated on-chip half-wave dipole antenna structure |
EP1258948A3 (de) * | 2001-05-17 | 2004-04-07 | Hitachi Kokusai Electric Inc. | Halbkreisförmige Radialantenne |
-
2004
- 2004-03-19 DE DE102004014018A patent/DE102004014018B3/de not_active Expired - Fee Related
-
2005
- 2005-03-16 US US10/593,337 patent/US7612728B2/en not_active Expired - Fee Related
- 2005-03-16 AT AT05728358T patent/ATE366465T1/de not_active IP Right Cessation
- 2005-03-16 JP JP2007503307A patent/JP2007529930A/ja active Pending
- 2005-03-16 EP EP05728358A patent/EP1726063B1/de not_active Not-in-force
- 2005-03-16 WO PCT/EP2005/003303 patent/WO2005091438A1/de active IP Right Grant
- 2005-03-16 DE DE502005000985T patent/DE502005000985D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE366465T1 (de) | 2007-07-15 |
DE102004014018B3 (de) | 2005-08-11 |
EP1726063A1 (de) | 2006-11-29 |
US7612728B2 (en) | 2009-11-03 |
JP2007529930A (ja) | 2007-10-25 |
WO2005091438A1 (de) | 2005-09-29 |
US20080238792A1 (en) | 2008-10-02 |
EP1726063B1 (de) | 2007-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE502005000985D1 (de) | Mikrowellenantenne für in flip-chip-technologie hergestellte halbleiterbaugruppen | |
EP4235768A3 (de) | Integrierte strukturen mit antennenelementen und ic-chips mit randkontaktverbindungen | |
HK1122906A1 (en) | Antenna structure of an integrated circuit | |
WO2005034203A3 (en) | Method and apparatus for a dual substrate package | |
TWI266354B (en) | IC tag-bearing wiring board and method of fabricating the same | |
WO2007004137A3 (en) | Electronic device | |
FR2882174B1 (fr) | Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique | |
TW200620594A (en) | Flip chip ball grid array package assemblies | |
WO2003100858A3 (en) | Surface mounted decoupling capacitor system and process of making the same | |
TW200705621A (en) | Interposer and semiconductor device | |
TWI260056B (en) | Module structure having an embedded chip | |
WO2005018291A3 (en) | Thermally enhanced electronic module with self-aligning heat sink | |
TW200715708A (en) | Electronic substrate, manufacturing method for electronic substrate, and electronic device | |
TW200605296A (en) | A semiconductor device with a plurality of ground planes | |
FR2963478B1 (fr) | Dispositif semi-conducteur comprenant un composant passif de condensateurs et procede pour sa fabrication. | |
TW200802647A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device | |
TW200635013A (en) | Stacked semiconductor package | |
WO2006132803A3 (en) | Reduced inductance interconnect for enhanced microwave and millimeter-wave systems | |
TW200703523A (en) | Semiconductor device with low CTE substrates | |
TW200627652A (en) | Electronic package and method of manufacturing same | |
WO2003083942A3 (en) | Semiconductor device with components embedded in backside diamond layer | |
TW200723462A (en) | Package module with alignment structure and electronic device with the same | |
TW200721418A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device | |
MX2007003615A (es) | Circuito integrado y metodo de fabricacion. | |
TWI264127B (en) | Chip package and substrate thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |