DE502004011747D1 - - Google Patents

Info

Publication number
DE502004011747D1
DE502004011747D1 DE502004011747T DE502004011747T DE502004011747D1 DE 502004011747 D1 DE502004011747 D1 DE 502004011747D1 DE 502004011747 T DE502004011747 T DE 502004011747T DE 502004011747 T DE502004011747 T DE 502004011747T DE 502004011747 D1 DE502004011747 D1 DE 502004011747D1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE502004011747T
Other languages
German (de)
Inventor
Thomas Passe
Gottfried Ferber
Benedikt Specht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE502004011747D1 publication Critical patent/DE502004011747D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Inverter Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE502004011747T 2003-07-11 2004-05-21 Expired - Lifetime DE502004011747D1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10331574A DE10331574A1 (de) 2003-07-11 2003-07-11 Leistungshalbleitermodul
PCT/EP2004/005450 WO2005008765A2 (de) 2003-07-11 2004-05-21 Leistungshalbleitermodul mit vom substrat gelösten leiterbahnenden als externe anschlüsse

Publications (1)

Publication Number Publication Date
DE502004011747D1 true DE502004011747D1 (enExample) 2010-11-18

Family

ID=34071633

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10331574A Ceased DE10331574A1 (de) 2003-07-11 2003-07-11 Leistungshalbleitermodul
DE502004011747T Expired - Lifetime DE502004011747D1 (enExample) 2003-07-11 2004-05-21

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10331574A Ceased DE10331574A1 (de) 2003-07-11 2003-07-11 Leistungshalbleitermodul

Country Status (4)

Country Link
US (1) US20060226531A1 (enExample)
EP (1) EP1647051B1 (enExample)
DE (2) DE10331574A1 (enExample)
WO (1) WO2005008765A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007041136A1 (de) * 2007-08-30 2009-03-05 Osram Opto Semiconductors Gmbh LED-Gehäuse
US7791208B2 (en) * 2007-09-27 2010-09-07 Infineon Technologies Ag Power semiconductor arrangement
DE102012216401A1 (de) * 2012-09-14 2014-04-10 Powersem GmbH Halbleiterbauelement

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB775267A (en) * 1955-12-14 1957-05-22 Mullard Radio Valve Co Ltd Improvements in or relating to the production of tags or terminals on articles comprising an electrically conductive pattern on an insulating support
US4924292A (en) * 1988-04-12 1990-05-08 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
DE3932017A1 (de) * 1988-10-27 1990-05-03 Bayer Ag Elektrisch leitende strukturen
US5559374A (en) * 1993-03-25 1996-09-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit
DE19614501C2 (de) * 1996-04-13 2000-11-16 Curamik Electronics Gmbh Verfahren zum Herstellen eines Keramik-Metall-Substrates sowie Keramik-Metall-Substrat
KR100270888B1 (ko) * 1998-04-08 2000-12-01 윤종용 노운 굿 다이 제조장치
US6239980B1 (en) * 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
WO2000055917A1 (de) * 1999-03-17 2000-09-21 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Leistungshalbleitermodul
JP2001308265A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置
DE10122837B4 (de) * 2001-05-11 2006-06-22 Ixys Semiconductor Gmbh Leistungshalbleiter-Modul
JP2003060157A (ja) * 2001-08-08 2003-02-28 Mitsubishi Electric Corp パワーモジュール
DE10142971A1 (de) * 2001-09-01 2003-03-27 Eupec Gmbh & Co Kg Leistungshalbleitermodul
JP3846699B2 (ja) * 2001-10-10 2006-11-15 富士電機ホールディングス株式会社 半導体パワーモジュールおよびその製造方法
DE10213648B4 (de) * 2002-03-27 2011-12-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
DE10225153A1 (de) * 2002-06-06 2003-12-18 Bosch Gmbh Robert Verfahren zur Herstellung einer Leiterplatte mit elektrischen Verbindern sowie nach diesem Verfahren hergestellte Leiterplatte

Also Published As

Publication number Publication date
EP1647051A2 (de) 2006-04-19
DE10331574A1 (de) 2005-02-17
WO2005008765A2 (de) 2005-01-27
US20060226531A1 (en) 2006-10-12
EP1647051B1 (de) 2010-10-06
WO2005008765A3 (de) 2005-08-25

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