DE50009547D1 - Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge - Google Patents
Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-RohlingeInfo
- Publication number
- DE50009547D1 DE50009547D1 DE50009547T DE50009547T DE50009547D1 DE 50009547 D1 DE50009547 D1 DE 50009547D1 DE 50009547 T DE50009547 T DE 50009547T DE 50009547 T DE50009547 T DE 50009547T DE 50009547 D1 DE50009547 D1 DE 50009547D1
- Authority
- DE
- Germany
- Prior art keywords
- contact surfaces
- electrical component
- connecting contact
- component blanks
- blanks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49181—Assembling terminal to elongated conductor by deforming
- Y10T29/49185—Assembling terminal to elongated conductor by deforming of terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5327—Means to fasten by deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50009547T DE50009547D1 (de) | 2000-02-07 | 2000-12-21 | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10005095A DE10005095A1 (de) | 2000-02-07 | 2000-02-07 | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
DE50009547T DE50009547D1 (de) | 2000-02-07 | 2000-12-21 | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
Publications (1)
Publication Number | Publication Date |
---|---|
DE50009547D1 true DE50009547D1 (de) | 2005-03-24 |
Family
ID=7629936
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10005095A Withdrawn DE10005095A1 (de) | 2000-02-07 | 2000-02-07 | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
DE50009547T Expired - Lifetime DE50009547D1 (de) | 2000-02-07 | 2000-12-21 | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10005095A Withdrawn DE10005095A1 (de) | 2000-02-07 | 2000-02-07 | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
Country Status (4)
Country | Link |
---|---|
US (1) | US6460246B2 (de) |
EP (1) | EP1124238B1 (de) |
JP (1) | JP3576493B2 (de) |
DE (2) | DE10005095A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1846740B1 (de) * | 2005-02-10 | 2010-09-08 | Ist Ag | Sensoranschlussleiter mit verminderter wärmeleitung |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2917110A1 (de) * | 1979-04-27 | 1980-10-30 | Preh Elektro Feinmechanik | Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass |
DE8913803U1 (de) * | 1988-12-27 | 1990-02-22 | VEB Thermometerwerk Geraberg, DDR 6306 Geraberg | Widerstandsthermometer zur Messung der Oberflächentemperatur |
DE4004997A1 (de) * | 1990-02-19 | 1991-08-22 | Robotron Veb K | Anschlussarmatur fuer elektronische bauelemente und verfahren zur herstellung einer anschlussarmatur |
DE9102576U1 (de) * | 1991-03-05 | 1991-05-23 | Hella KG Hueck & Co, 4780 Lippstadt | Widerstands-/Sensoranordnung |
US5688150A (en) * | 1995-08-08 | 1997-11-18 | North American Specialties Corporation | Solder bearing lead |
-
2000
- 2000-02-07 DE DE10005095A patent/DE10005095A1/de not_active Withdrawn
- 2000-12-21 EP EP00128042A patent/EP1124238B1/de not_active Expired - Lifetime
- 2000-12-21 DE DE50009547T patent/DE50009547D1/de not_active Expired - Lifetime
-
2001
- 2001-01-18 JP JP2001009974A patent/JP3576493B2/ja not_active Expired - Fee Related
- 2001-02-07 US US09/779,035 patent/US6460246B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10005095A1 (de) | 2001-08-09 |
JP2001244039A (ja) | 2001-09-07 |
US20010020327A1 (en) | 2001-09-13 |
EP1124238A2 (de) | 2001-08-16 |
JP3576493B2 (ja) | 2004-10-13 |
EP1124238A3 (de) | 2004-01-14 |
EP1124238B1 (de) | 2005-02-16 |
US6460246B2 (en) | 2002-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |