DE4446618A1 - Electronic waste metal processing method for esp. circuit board - Google Patents

Electronic waste metal processing method for esp. circuit board

Info

Publication number
DE4446618A1
DE4446618A1 DE19944446618 DE4446618A DE4446618A1 DE 4446618 A1 DE4446618 A1 DE 4446618A1 DE 19944446618 DE19944446618 DE 19944446618 DE 4446618 A DE4446618 A DE 4446618A DE 4446618 A1 DE4446618 A1 DE 4446618A1
Authority
DE
Germany
Prior art keywords
electronic scrap
scrap
processing
pretreated
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19944446618
Other languages
German (de)
Inventor
Klaus Dr Grzam
Matthias Dr Scharf
Dieter Georgi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELEKTRO VERWERTUNGS ZENTRUM
Original Assignee
ELEKTRO VERWERTUNGS ZENTRUM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELEKTRO VERWERTUNGS ZENTRUM filed Critical ELEKTRO VERWERTUNGS ZENTRUM
Priority to DE19944446618 priority Critical patent/DE4446618A1/en
Publication of DE4446618A1 publication Critical patent/DE4446618A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03B—SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
    • B03B9/00—General arrangement of separating plant, e.g. flow sheets
    • B03B9/06—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
    • B03B9/061—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse the refuse being industrial
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/04—Obtaining noble metals by wet processes
    • C22B11/042—Recovery of noble metals from waste materials
    • C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/18—Extraction of metal compounds from ores or concentrates by wet processes with the aid of microorganisms or enzymes, e.g. bacteria or algae
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Biotechnology (AREA)
  • Microbiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Geology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

The method initially involves mechanically and/or chemically pretreating electronic waste metal, and adding different microorganisms to the scrap. After combining the scrap, the biotechnological process parameters are determined, e.g. pH value, oxygen content, conductivity, and temperature. Selective material discharges are adapted during the process. The selectively discharged materials are selected by chemical and/or physical processes. Chemical and/or physical intermediate steps may be added between the different process steps. These selectively attach a predetermined component or reduce mixing of the different strains.

Description

Die bekanntesten Verfahren zur Elektronikschrottentsorgung sind das Verkippen auf Deponien und das Verbrennen in entsprechenden Anlagen. Beim Verbrennen kommt sowohl ein Hochtemperatur- als auch ein Niedrigtemperaturverfahren zur Anwendung.The best known methods for electronic waste disposal are dumping on landfills and burning in appropriate ones Investments. When burning comes a high temperature as well also use a low temperature process.

In der DE OS 4140640 wird ein Verfahren zur Aufbereitung von Leiterplatten beschrieben. Die Leiterplatten werden dabei in eine wäßrige Lösung einer organischen Säure und einem haloge­ nierten Kohlenwasserstoff gegeben, in der diese quellen. Damit kann das Kupfer von dem Träger mechanisch getrennt werden.DE OS 4140640 describes a process for the preparation of Printed circuit boards described. The circuit boards are in an aqueous solution of an organic acid and a halogen nated hydrocarbon in which they swell. In order to the copper can be mechanically separated from the carrier.

Weiterhin ist es möglich, über Pyrolyseverfahren mit nachge­ schalteter Verbrennung eine Trennung in die Bestandteile Schwel­ koks oder Glasfaser und metallische Werkstoffe zu erreichen. Allerdings erfolgt bei Anwendung dieses Verfahrens eine Ver­ mahlung des Ausgangsmaterials bei -50°C.It is also possible to use pyrolysis with switched combustion a separation into the components smoldering to achieve coke or fiberglass and metallic materials. However, a Ver grinding of the raw material at -50 ° C.

Diese bekannten Verfahren zeichnen sich durch einen sehr hohen Energiebedarf und einer nicht abzuschätzenden Schädigung der Umwelt durch freigesetzte Verbrennungsrückstände aus. Es erfolgt dabei nicht nur eine Schädigung der Atmosphäre sondern auch des Bodens.These known methods are characterized by a very high level Energy consumption and damage that cannot be estimated Environment from released combustion residues. It takes place not only damage to the atmosphere but also to the Floor.

Der Einsatz von Lösungsmitteln ist mit einer weiteren problema­ tischen Aufbereitung oder Entsorgung verbunden.The use of solvents is another problem processing or disposal.

Der im Patentanspruch 1 angegebenen Erfindung liegt das Problem zugrunde, ein umweltfreundliches Verfahren zur Aufbereitung von Elektronikschrott zu schaffen. Dieses Problem wird mit den im Patentanspruch 1 aufgeführten Merkmalen gelöst.The invention specified in claim 1 is the problem based on an environmentally friendly process for the preparation of  Creating electronic waste. This problem is solved with the Features listed claim 1 solved.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß durch einen geringen Energieaufwand und durch den Einsatz von Mikroorganismen umweltschonend unter anderem die Wertstoffe Gold, Palladium und Kupfer nahezu 100%ig aus an­ fallenden Elektronikschrott wiedergewonnen werden. Das ist gleichzeitig mit einer erheblichen Reduzierung des zu deponie­ renden Abfalles verbunden. Weiterhin ist es auf biotechnischer Art möglich, den bromierten Anteil im Trägermaterial der Lei­ terplatten auf ein Minimum zu reduzieren, um somit eine um­ weltschonende Deponierung oder Kreislaufrückführung des Basisma­ terials zu gewährleisten.The advantages achieved with the invention are in particular in that by a low energy expenditure and by the Use of microorganisms in an environmentally friendly way, among others Gold, palladium and copper are almost 100% recyclable falling electronic waste can be recovered. This is at the same time as a significant reduction in landfill associated waste. Furthermore, it is based on biotechnology Kind possible, the brominated portion in the carrier material of the Lei to reduce the number of plates to a minimum in order to world-friendly landfill or recycling of the base material to ensure terials.

Vorteilhafte Ausgestaltungen der Erfindung sind in den Patentan­ sprüchen 2 und 5 angegeben.Advantageous embodiments of the invention are in the patent say 2 and 5.

Die Weiterbildungen nach den Patentansprüchen 2 und 5 ermögli­ chen es, den Elektronikschrott so aufzubereiten, daß ein optima­ ler Zugriff der Mikroorganismen zu den Wertstoffen gegeben ist.The further developments according to claims 2 and 5 are possible Chen it to prepare the electronic scrap so that an optima Microorganisms have access to the valuable materials.

Ein Ausführungsbeispiel der Erfindung wird im folgenden näher beschrieben.An embodiment of the invention is described in more detail below described.

Grundlage des Verfahrens zur Aufbereitung von Elektronikschrott bilden biotechnische Verfahren, wobei gleichzeitig zwei Stufen des Aufbereitungsverfahrens ablaufen. Zum einen ist das, die Analyse und zum anderen, die Aufnahme des zu gewinnenden Materi­ als durch speziell gezüchtete und eingesetzte Mikroorganismen. Dabei ist es durch die Steuerung des biotechnologischen Ver­ fahrens z. B. hinsichtlich der Parameter pH-Wert, Sauerstoff­ gehalt, Leitfähigkeit und Temperatur möglich, optimale Lebens­ bedingungen für die Mikroorganismen zu schaffen und diese stän­ dig an die sich ändernden Bedingungen, die unter anderem durch die Lebenszyklen der Mikroorganismen selbst geändert werden, anzupassen.Basis of the process for processing electronic waste form biotechnical processes, simultaneously two stages of the reprocessing process. For one thing, that is Analysis and on the other hand, the inclusion of the material to be extracted than through specially bred and used microorganisms. It is through the control of the biotechnological ver driving z. B. with regard to the parameters pH, oxygen content, conductivity and temperature possible, optimal life  to create conditions for the microorganisms and these dig to the changing conditions, among other things changed by the life cycles of the microorganisms themselves will adapt.

Claims (6)

1. Verfahren zur Aufbereitung von Elektronikschrott, insbesonde­ re bestückter Leiterplatten, gekennzeichnet dadurch, daß der Elektronikschrott mechanisch und/oder chemisch vorbehandelt wird, daß verschiedene Mikroorganismen dem Elektronikschrott zugegeben werden, wobei die biotechnologischen Prozeßparame­ ter nach der Zusammensetzung des Elektronikschrottes festge­ legt sind und der selektiven Materialabscheidung während des Prozesses angepaßt und daß die selektiv abgeschiedenen Mate­ rialen durch chemische und/oder physikalische Verfahren se­ lektiert werden.1. A process for the processing of electronic scrap, in particular re-assembled printed circuit boards, characterized in that the electronic scrap is pretreated mechanically and / or chemically, that various microorganisms are added to the electronic scrap, the biotechnological process parameters being determined according to the composition of the electronic scrap and the adapted selective material deposition during the process and that the selectively deposited mate rials are se se lected by chemical and / or physical processes. 2. Verfahren zur Aufbereitung von Elektronikschrott nach Patent­ anspruch 1, gekennzeichnet dadurch, daß zwischen den ver­ schiedenen Prozeßstufen mit Mikroorganismen chemische und/ oder physikalische Zwischenschritte eingefügt werden, die selektiv eine bestimmte Komponente angreifen bzw. eine Mi­ schung der verschiedenen Stämme vermeiden.2. Process for processing electronic scrap according to a patent Claim 1, characterized in that between the ver different process stages with microorganisms chemical and / or physical intermediate steps are inserted that selectively attack a certain component or a Mi Avoid creating different strains. 3. Verfahren zur Aufbereitung von Elektronikschrott nach Patent­ anspruch 1, gekennzeichnet dadurch, daß der Elektronikschrott durch Zerkleinerer und chemisch vorbehandelt wird.3. Process for processing electronic scrap according to a patent Claim 1, characterized in that the electronic scrap is pre-treated by shredders and chemically. 4. Verfahren zur Aufbereitung von Elektronikschrott nach Patent­ anspruch 1, gekennzeichnet dadurch, daß der Elektronikschrott durch mehrmaliges Verwinden vorbehandelt wird.4. Process for processing electronic scrap according to a patent Claim 1, characterized in that the electronic scrap is pretreated by twisting it several times. 5. Verfahren zur Aufbereitung von Elektronikschrott nach Patent­ anspruch 1, gekennzeichnet dadurch, daß der Elektronikschrott durch Energiebestrahlung vorbehandelt wird.5. Process for processing electronic scrap according to a patent Claim 1, characterized in that the electronic scrap is pretreated by energy radiation. 6. Verfahren zur Aufbereitung von Elektronikschrott nach Patent­ anspruch 1, gekennzeichnet dadurch, daß der Elektronikschrott durch Erhitzen vorbehandelt wird.6. Process for processing electronic scrap according to a patent Claim 1, characterized in that the electronic scrap is pretreated by heating.
DE19944446618 1994-12-24 1994-12-24 Electronic waste metal processing method for esp. circuit board Withdrawn DE4446618A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19944446618 DE4446618A1 (en) 1994-12-24 1994-12-24 Electronic waste metal processing method for esp. circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19944446618 DE4446618A1 (en) 1994-12-24 1994-12-24 Electronic waste metal processing method for esp. circuit board

Publications (1)

Publication Number Publication Date
DE4446618A1 true DE4446618A1 (en) 1996-06-27

Family

ID=6537137

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19944446618 Withdrawn DE4446618A1 (en) 1994-12-24 1994-12-24 Electronic waste metal processing method for esp. circuit board

Country Status (1)

Country Link
DE (1) DE4446618A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104073639A (en) * 2014-06-24 2014-10-01 上海第二工业大学 Method for recycling copper and gold from waste electronic material through two-step method
US11608544B2 (en) * 2017-10-17 2023-03-21 Mint Innovation Limited Process for recovering metal from electronic waste
US11634788B2 (en) 2016-11-03 2023-04-25 Mint Innovation Limited Process for recovering metal

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104073639A (en) * 2014-06-24 2014-10-01 上海第二工业大学 Method for recycling copper and gold from waste electronic material through two-step method
US11634788B2 (en) 2016-11-03 2023-04-25 Mint Innovation Limited Process for recovering metal
US11608544B2 (en) * 2017-10-17 2023-03-21 Mint Innovation Limited Process for recovering metal from electronic waste

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Legal Events

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8139 Disposal/non-payment of the annual fee