DE4445184B4 - Method for connecting two parts by active soldering - Google Patents

Method for connecting two parts by active soldering Download PDF

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Publication number
DE4445184B4
DE4445184B4 DE19944445184 DE4445184A DE4445184B4 DE 4445184 B4 DE4445184 B4 DE 4445184B4 DE 19944445184 DE19944445184 DE 19944445184 DE 4445184 A DE4445184 A DE 4445184A DE 4445184 B4 DE4445184 B4 DE 4445184B4
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Prior art keywords
electrically conductive
parts
active soldering
soldering
ceramic
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Expired - Fee Related
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DE19944445184
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German (de)
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DE4445184A1 (en
Inventor
Werner Dr. Bürger
Udo Broich
Erich Prof. Dr.techn. Lugscheider
Wolfgang Dr.-Ing. Tillmann
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Hermsdorfer Institut fuer Technische Keramik eV HITK
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Abstract

Verfahren zum Verbinden zweier Teile, von denen zumindest eines elektrisch leitfähig ist und aus elektrisch leitfähiger Keramik besteht, durch Aktivlöten, dadurch ge kennzeichnet, daß das Aktivlöten durch induktive Erwärmung des elektrisch leitfähigen Teils bzw. der elektrisch leitfähigen Teile und Druckeinwirkung unter Schutzgas erfolgt.method for connecting two parts, at least one of which electrically conductive is and is more electrically conductive Ceramic is, by active soldering, characterized indicates that the active soldering by inductive heating of the electrically conductive Part or the electrically conductive Parts and pressure under protective gas takes place.

Figure 00000001
Figure 00000001

Description

Die Erfindung betrifft ein Verfahren zum stoffschlüssigen Verbinden zweier Teile, von denen zumindest eines elektrisch leitfähig ist und vorzugsweise aus elektrisch leitfähiger Keramik besteht, durch das sogenannte Aktivlöten.The The invention relates to a method for materially joining two parts, of which at least one is electrically conductive and preferably made electrically conductive Ceramic exists, by the so-called active soldering.

Zur Verbindung von Keramikteilen untereinander durch Löten sind zwei grundsätzliche Verfahren bekannt. Zum einen werden beide zu verbindende Flächen mit einer Schicht aus Molybdän und Mangan oder mit Wolfram metallisiert und dann in einem Ofen unter Hinzufügung einer Hartlotfolie gelötet. Zum anderen ist das sogenannte Aktivlöten bekannt, bei dem ein Lot, das sogenannte Aktivmetalle, wie Titan, Zirkon, Lithium, Beryllium und Magnesium enthält, unter Druck- und Temperatureinwirkung eine direkte stoffschlüssige Verbindung mit Keramik eingeht ( DE-OS 39 14 332 ). Das erstgenannte Verfahren ist wegen der Vielzahl der Arbeitsgänge sehr aufwendig und gewährleistet nicht immer die für hohe Beanspruchungen erforderlichen hohen Haftfestigkeiten.To connect ceramic parts with each other by soldering two basic methods are known. On the one hand both surfaces to be joined are metallized with a layer of molybdenum and manganese or with tungsten and then soldered in a furnace with the addition of a brazing foil. On the other hand, the so-called active soldering is known in which a solder containing so-called active metals, such as titanium, zirconium, lithium, beryllium and magnesium, under pressure and temperature enters into a direct cohesive connection with ceramic ( DE-OS 39 14 332 ). The former method is very complicated because of the large number of operations and does not always guarantee the high adhesive strengths required for high loads.

Das an zweiter Stelle genannte Verfahren erfordert die Durchführung des Lötvorganges im Vakuum ggf. noch unter Anwesenheit umweltschädlicher, aus ihren Verbindungen freigesetzter Halogene ( DE-OS 25 55 157 ). Außer dem verfahrenstechnischen und energetischen Aufwand für Vakuumanlagen ist in vielen Fällen deren Bindung an einen bestimmten Aufstellungsort nachteilig. Dies hat man dadurch zu umgehen gesucht, daß analog zum erstgenannten Verfahren nur eine Metallisierung aus Aktivlot aufgebracht wird, wobei eine durchgehende stoffschlüssige Verbindung durch Andrücken eines inerten Polsters während eines Glühprozesses erreicht wird ( DE-OS 24 18 106 ). Die eigentliche Verbindung zweier solcherart metallisierter Flächen könnte dann vor Ort durch herkömmliche Lötverfahren erfolgen, aber es ergäbe sich wiederum der hohe Aufwand an Verfahrensschritten, wie beim ersten Verfahren.The second method mentioned requires the execution of the soldering process in vacuo, possibly still in the presence of environmentally harmful, released from their compounds halogens ( DE-OS 25 55 157 ). In addition to the process engineering and energy costs for vacuum systems, their binding to a specific installation location is disadvantageous in many cases. This has been sought by the fact that analogously to the first-mentioned method, only one metallization of active solder is applied, a continuous cohesive connection being achieved by pressing an inert pad during an annealing process ( DE-OS 24 18 106 ). The actual connection of two metallized surfaces of this kind could then be carried out on site by conventional soldering methods, but this would in turn result in the high expenditure on method steps, as in the first method.

Schließlich ist das induktive Löten zur Verbindung von Metallteilen bekannt. Beim Verbinden von Metall und Keramik muß die Wärme aus dem induktiv erhitzten Metallteil auf das Lot und schließlich das Keramikteil durch Wärmeleitung übertragen werden, was naturgemäß zu thermisch induzierten Spannungen an der Verbindungsstelle führt sowie das Verfahren zeitaufwendig macht.Finally is inductive soldering known for the connection of metal parts. When connecting metal and ceramics must Heat off the inductively heated metal part on the solder and finally the Transfer ceramic part by heat conduction which is naturally too thermal induced voltages at the junction leads as well as the Time consuming process makes.

Der Erfindung liegt die Aufgabe zugrunde, zwei Teile, von denen zumindest eines elektrisch leitfähig ist und vorzugsweise aus elektrisch leitfähiger Keramik besteht, in technologisch einfacher Weise und unabhängig von einem aufwendigen und ortsfesten Vakuumofen zu verbinden.Of the Invention is based on the object, two parts, of which at least one electrically conductive is and is preferably made of electrically conductive ceramic in technologically simpler Way and independent from a complex and stationary vacuum oven to connect.

Erfindungsgemäß wird diese Aufgabe unter Anwendung des Aktivlötens durch das in den Patentansprüchen beschriebene Verfahren gelöst.According to the invention this Task using the active soldering by that described in the claims Procedure solved.

Das erfindungsgemäße Verfahren weist gegenüber dem Stand der Technik eine ganze Reihe von Vorteilen auf:

  • – Es ist als mobiles Verfahren ohne das Erfordernis eines Vakuumofens "vor Ort" anwendbar.
  • – Die kurzen Prozeßzeiten mindern ebenso wie die Schutzgasspülung die Gefahr einer Oxidation des Aktivlots.
  • – Es lassen sich Lotmaterialien einsetzen, die im Vakuumofen ganz oder fraktioniert abdampfen würden.
  • – Aus der Entbehrlichkeit eines Vakuumofens, der geringen Anzahl technologischer Schritte sowie den geringen Prozeßzeiten resultieren wirtschaftliche Vorteile infolge geringerer Kosten.
  • – Im bevorzugten Anwendungsfall der Erfindung bei elektrisch leitender Keramik, wie Aluminiumoxid-Titancarbid-Dispersionskeramik (ATC-Keramik) lassen sich zum einen Verbundkörper mit beliebigen anderen Materialien herstellen, sofern diese nur ausreichend wärmefest sind. Zum anderen ist die Herstellung größerer und/oder komplizierter Strukturen auch aus durchgehend elektrisch leitfähiger Keramik möglich, ohne daß eine teure Bearbeitung mittels Diamantschleifen erforderlich ist.
The method according to the invention has a number of advantages over the prior art:
  • It is applicable as a mobile method without the need for a "local" vacuum oven.
  • - The short process times as well as the inert gas purge reduce the risk of oxidation of the active solder.
  • - It can be used solder materials that would evaporate completely or fractionally in a vacuum oven.
  • - The dispensability of a vacuum furnace, the small number of technological steps and the low process times result in economic benefits due to lower costs.
  • - In the preferred application of the invention in electrically conductive ceramics, such as alumina-titanium carbide dispersion ceramic (ATC ceramic) can be made on the one hand composite body with any other materials, provided that they are only sufficiently heat-resistant. On the other hand, the production of larger and / or complicated structures is also possible from continuously electrically conductive ceramic, without the need for expensive processing by means of diamond grinding is required.

Die Erfindung wird nachstehend durch drei Ausführungsbeispiele näher beschrieben, die sich im wesentlichen nur in der Art der Materialpaarung unterscheiden. Die beigefügte Zeichnung stellt das Verfahrensprinzip schematisch an der stirnseitigen Verbindung zweier zylindrischer Teile dar.The Invention will be described in more detail below by means of three exemplary embodiments, which differ essentially only in the type of material pairing. The enclosed Drawing shows the principle of the method schematically at the front Connection of two cylindrical parts.

Zwischen den beiden Fügepartnern aus ATC-Keramik befindet sich eine 0,3 mm dicke Folie aus Ag-Cu-Ti-Aktivlot. Die Fügepartner werden mit einem Druck von 0,02 MPa zusammengedrückt und in der Induktorspule, deren Windungen eine Höhe von 50 mm und einen gleichmäßigen Abstand von 2 mm von den Fügepartnern haben, wird ein Hochfrequenzfeld mit einer Frequenz von 200 kHz und einer Leistung von 2,5 kW erzeugt. Die Einschaltdauer beträgt 300 s. Mit einer Vor- und Nachlaufdauer von je 300 s wird direkt an der Füge-Ebene Argon angeblasen, welches die Fügestelle während der Prozeßdauer in einen andauernden Gasstrom einhüllt. Die Lötstelle erreicht eine Festigkeit in der Größenordnung von 200 MPa, wobei thermisch induzierte Spannungen vermieden werden konnten.Between the two joining partners made of ATC ceramic is a 0.3 mm thick film of Ag-Cu-Ti active solder. The joining partners are compressed with a pressure of 0.02 MPa and in the inductor coil, whose turns have a height of 50 mm and a uniform distance of 2 mm from the joining partners have a high frequency field with a frequency of 200 kHz and a power of 2.5 kW generated. The duty cycle is 300 s. With a pre- and post-run duration of 300 s each is directly at the Add level Argon blown, which is the joint while the process duration wrapped in a continuous gas stream. The soldering point reaches a strength in the order of 200 MPa, avoiding thermally induced voltages could.

Bei den weiteren Ausführungsbeispielen sind die Fügepartner ATC-Keramik und Stahl sowie ATC-Keramik und Aluminiumoxidkeramik. Im erstgenannten Fall ergibt sich wegen der unterschiedlichen Leitfähigkeiten eine stark unterschiedliche Erwärmung der Fügepartner; im zweiten Fall entsteht nur im leitfähigen Fügepartner Wärme, die durch Wärmeleitung mit einer Einschaltdauer von ≥ 10 min auf den anderen übertragen werden muß. Daraus ergeben sich als vom ersten Ausführungsbeispiel abweichende Verfahrensparameter: Paarung ATC-Keramik/Stahl: Hier ist eine geringere Leistung ( < 2 kW) und eine geringere Einschaltdauer (< 100 s) erforderlich.at the other embodiments are the joining partners ATC ceramics and steel as well as ATC ceramics and alumina ceramics. In the former case arises because of the different conductivities a very different warming the joining partner; in the second case, heat is generated only in the conductive joining partner, by heat conduction with a duty cycle of ≥ 10 transferred to the other min must become. This results in deviating from the first embodiment Process parameters: pairing ATC ceramic / steel: Here is a smaller one Performance (<2 kW) and a lower duty cycle (<100 s).

Paarung ATC-Keramik/Al2O3-Keramik: Hier sind aus den oben erwähnten Gründen (Wärmetransport durch Wärmeleitung) die gleichfalls erwähnten höheren Leistungen und die längere Einschaltdauer erforderlich.Pairing of ATC ceramic / Al 2 O 3 ceramic: For the reasons mentioned above (heat transfer by heat conduction), the higher power levels and the longer duty cycle mentioned above are required here.

Claims (4)

Verfahren zum Verbinden zweier Teile, von denen zumindest eines elektrisch leitfähig ist und aus elektrisch leitfähiger Keramik besteht, durch Aktivlöten, dadurch ge kennzeichnet, daß das Aktivlöten durch induktive Erwärmung des elektrisch leitfähigen Teils bzw. der elektrisch leitfähigen Teile und Druckeinwirkung unter Schutzgas erfolgt.A method for connecting two parts, of which at least one is electrically conductive and is made of electrically conductive ceramic by active soldering, characterized in that the active soldering is carried out by inductive heating of the electrically conductive portion or the electrically conductive parts and pressure under an inert gas. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Aktivlöten an Ort und Stelle an Luft unter Anblasen mit dem Schutzgas erfolgt.Method according to claim 1, characterized in that that this active soldering in place in air while blowing with the protective gas. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß das Anblasen mit dem Schutzgas räumlich unter der Lötstelle erfolgt und diese durch einen konvektiv aufsteigenden Schutzgasstrom eingehüllt wird.Method according to claim 2, characterized in that that this Blowing with the inert gas spatially under the solder joint takes place and this by a convective rising gas flow shrouded becomes. Verfahren nach einem der vorhergehenden Ansprüche, gekennzeichnet durch die Verwendung einer Induktorspule, die sich axial wesentlich über die Ausdehnung der Lötstelle hinaus erstreckt und eine solche Querschnittsform aufweist, daß sie über ihren gesamten Querschnitt einen möglichst gleichen Abstand zu dem bzw. den elektrisch leitfähigem(n) Teilen) aufweist.Method according to one of the preceding claims, characterized by using an inductor coil that extends axially substantially beyond the expansion the solder joint extends out and has such a cross-sectional shape that they over their entire Cross section one possible same distance to the electrically conductive (s) Share).
DE19944445184 1994-12-17 1994-12-17 Method for connecting two parts by active soldering Expired - Fee Related DE4445184B4 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3045252A1 (en) * 2015-01-16 2016-07-20 Elmotec AG Inductive soldering method and device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638287A1 (en) * 1996-09-19 1998-04-02 Gerling Automation Gmbh Method of attaching teeth to circular saw blade blanks

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2418106A1 (en) * 1974-04-13 1975-11-06 Siemens Ag Dry soldering metal foils to ceramic substrates - using flexible carbon felt pressure bolster to ensure uniform surface contact
DE2555157A1 (en) * 1974-12-13 1976-06-24 C E R C A Companie Pour L Etud PROCESS FOR JOINING WORK PIECES
DE3914332A1 (en) * 1989-04-29 1990-11-08 Hoechst Ceram Tec Ag CONNECTION OF PARTS FROM CERAMIC AND METAL MATERIAL

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2418106A1 (en) * 1974-04-13 1975-11-06 Siemens Ag Dry soldering metal foils to ceramic substrates - using flexible carbon felt pressure bolster to ensure uniform surface contact
DE2555157A1 (en) * 1974-12-13 1976-06-24 C E R C A Companie Pour L Etud PROCESS FOR JOINING WORK PIECES
DE3914332A1 (en) * 1989-04-29 1990-11-08 Hoechst Ceram Tec Ag CONNECTION OF PARTS FROM CERAMIC AND METAL MATERIAL

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3045252A1 (en) * 2015-01-16 2016-07-20 Elmotec AG Inductive soldering method and device

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