DE4428732C1 - Multilayer chip card coil for contactless chip cards - Google Patents

Multilayer chip card coil for contactless chip cards

Info

Publication number
DE4428732C1
DE4428732C1 DE19944428732 DE4428732A DE4428732C1 DE 4428732 C1 DE4428732 C1 DE 4428732C1 DE 19944428732 DE19944428732 DE 19944428732 DE 4428732 A DE4428732 A DE 4428732A DE 4428732 C1 DE4428732 C1 DE 4428732C1
Authority
DE
Germany
Prior art keywords
coils
cards
coil
chip
chip cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19944428732
Other languages
German (de)
Inventor
Hans-Diedrich Kreft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Angewandte Digital Elektronik GmbH
Original Assignee
Angewandte Digital Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Angewandte Digital Elektronik GmbH filed Critical Angewandte Digital Elektronik GmbH
Priority to DE19944428732 priority Critical patent/DE4428732C1/en
Priority to DE19580862T priority patent/DE19580862D2/en
Priority to PCT/DE1995/001052 priority patent/WO1996005572A1/en
Priority to AU32191/95A priority patent/AU3219195A/en
Application granted granted Critical
Publication of DE4428732C1 publication Critical patent/DE4428732C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

The coil is embedded in the plastic of the chip card. Individual coils (9,10) are carried in the form of conducting track windings on mechanically flexible carrier elements combined to form a flat strip. When the strip is folded together at marked positions (17) the inductance of the coils laid one on top of the other is increased, whereby holes formed in the foil at defined, repetitive positions, can be used to make electrical connections to the coils.

Description

Die Erfindung bezieht sich auf ein Verfahren zur Anordnung von Spulen zum Zwecke der Erhöhung ihrer Induktivität in Chipkarten.The invention relates to a method for arranging coils for the purpose of increasing their inductance in chip cards.

Es sind Plastikkarten als Chipkarten bekannt, welche kontaktfrei mit Schreib/Lesegeräten Energie und Daten austauschen. Diese Karten werden für vielfache Anwendungen wie beispielsweise Identifikationszwecke, Zutrittskontrollkarten eingesetzt. Ein Überblick über solche Karten und deren Anwendungen ist in drei Ausgaben der Elektronik Jahrgang 13 zusammengestellt.Plastic cards are known as chip cards, which are contact-free Exchange readers / writers of energy and data. These cards will be for multiple applications such as identification purposes, Access control cards used. An overview of such cards and their Applications is compiled in three editions of electronics year 13.

Der Erfindung liegt die Aufgabe zugrunde, in einfacher Weise Spulenanordnungen zu schaffen, die in Chipkarten durch elektrische Verbindung in ihrer Wirkung zu kombinieren sind und den begrenzten Raum in einer Karte optimal nutzen.The invention has for its object in a simple manner coil arrangements to create that in smart cards by electrical connection in their Effect to combine and the limited space in one card optimal use.

Diese Aufgabe wird durch die in dem Anspruch angegebenen Merkmale gelöst und wird nachfolgend in einer Ausführungsform beschrieben:This object is achieved by the features specified in the claim solved and is described below in one embodiment:

Fig. 1 zeigt schematisch die Spulen 9, 10 auf derselben Seite der Folie (wobei die Spulen in üblicher und bekannter Weise durch eine Isolierschicht geschützt sind). Es können auch Spulen auf der gegenüberliegenden Seite der Folie angeordnet werden. Die Spulen sind auf der Folie so angeordnet, daß ihre beiden Enden bei Faltung (an den Kontaktflächen 1, 2 und 3, 4) in der gewünschten Weise zueinander passen. Werden beispielsweise die Spulen 9, 10 übereinandergelegt, setzt sich der Drehsinn der einen Spule in der anderen Spule fort. Die Kontaktenden der Spulen können an den vorgegebenen Löchern in der Folie zusammentreffen, und bei Verbindung mit einem leitfähigen und fließfähigen Material sind die Spulen elektrisch verbindbar, womit sich eine Verdoppelung der induktiven Wirkung einer Spule ergibt. Die Verbindung der Kontaktflächen 2, 4 kann beispielsweise auch über eine Schaltung in dem elektronischen Chip einer Chipkarte erfolgen, an den die Spulenenden angeschlossen werden. Fig. 1 shows schematically the coils 9, 10 on the same side of the film (the coils are protected in the usual and known manner by an insulating layer). Coils can also be arranged on the opposite side of the film. The coils are arranged on the film so that their two ends when folded (on the contact surfaces 1, 2 and 3, 4 ) fit together in the desired manner. If, for example, the coils 9, 10 are placed one on top of the other, the direction of rotation of one coil continues in the other coil. The contact ends of the coils can meet at the predetermined holes in the film, and when connected to a conductive and flowable material, the coils can be electrically connected, thus doubling the inductive effect of a coil. The contact areas 2, 4 can also be connected, for example, via a circuit in the electronic chip of a chip card to which the coil ends are connected.

Die Erfindung betrifft gemäß dem Anspruch ein Verfahren zur Anordnung von Spulen für kontaktfreie Chipkarten (Smartcard), welche Spulen 9, 10 zur elektromagnetischen Kopplung der Karten mit ihrer Umwelt enthalten. Es werden Spulenanordnungen beschrieben, welche die Spulenwirkung einer Spule auf einem Trägerelement durch Übereinanderlegen von Trägerelementen vervielfacht. Durch das Übereinanderlegen der Trägerelemente wird die Dicke der Karte zur Erhöhung der Spulenwirkung ausgenutzt. Karten können derart auf kleinem Raum mehr Leistung von einem Sender empfangen. Es können Daten über größere Entfernung übertragen werden.According to the claim, the invention relates to a method for arranging coils for contactless smart cards (smart cards), which contain coils 9, 10 for electromagnetic coupling of the cards with their environment. Coil arrangements are described which multiply the coil effect of a coil on a carrier element by superimposing carrier elements. By superimposing the carrier elements, the thickness of the card is used to increase the coil effect. In this way, cards can receive more power from a transmitter in a small space. Data can be transmitted over a greater distance.

Das Trägermaterial kann beispielsweise auf einer Rolle 16 aufgewickelt werden und kann an bestimmten vorgegebenen Stellen 17 zum Zwecke der Übereinanderlegung gefaltet werden. Die konzentrisch angeordneten Leiterbahnen können so angeordnet werden, daß bei Faltung des Bandes, die richtigen Punkte der Spulen an markierten Stellen übereinanderliegen. Die Erfindung beschreibt ferner ein Verfahren zur elektrischen Verbindung der einzelnen Spulen an vorgegebenen Stellen durch eingebrachte Löcher in dem flexiblen Trägermaterial.The carrier material can, for example, be wound up on a roll 16 and can be folded at certain predetermined locations 17 for the purpose of being superimposed. The concentrically arranged conductor tracks can be arranged so that when the tape is folded, the correct points of the coils lie one above the other at marked points. The invention further describes a method for the electrical connection of the individual coils at predetermined locations through holes made in the flexible carrier material.

In den Fig. 2 bis 4 sind durch die Bezugszeichen
13, 14 jeweils ein Trägerelement,
15 ein Loch,
16 eine Rolle, und
17 eine Stelle
bezeichnet.In Figs. 2 to 4 are designated by the reference numeral
13, 14 each a carrier element,
15 a hole,
16 a role, and
17 one digit
designated.

Claims (1)

Verfahren zur Einbringung von Spulenanordnungen in Chipkarten, wobei die Spulenanordnungen zum Zweck der Übertragung von elektromagnetischen Signalen und Leistung zwischen Chipkarten und externen Geräten in das Plastik der IC-Karte einzubetten sind, dadurch gekennzeichnet, daß einzelne Spulen (9, 10) in Form von Leiterbahnwindungen auf mechanisch biegbaren, flexiblen Trägerelementen (13, 14) galvanisch aufgetragen und die Trägerelemente in einem flächigen, zusammenhängenden Band angeordnet sind, und daß bei Zusammenfalten des Bandes an markierten Stellen (17) sich eine Verstärkung der Induktivität der übereinandergelegten Spulen ergibt, wobei Löcher, welche in der Folie an definierten, wiederkehrenden Stellen angebracht sind, zur elektrischen Verbindung der Spulen verwendet werden können.Method for introducing coil arrangements in chip cards, the coil arrangements being embedded in the plastic of the IC card for the purpose of transmitting electromagnetic signals and power between chip cards and external devices, characterized in that individual coils ( 9, 10 ) in the form of conductor turns galvanically applied to mechanically bendable, flexible carrier elements ( 13, 14 ) and the carrier elements are arranged in a flat, coherent band, and that when the band is folded up at marked points ( 17 ) there is an increase in the inductance of the superposed coils, holes, which are attached in the film at defined, recurring locations, can be used for the electrical connection of the coils.
DE19944428732 1994-08-15 1994-08-15 Multilayer chip card coil for contactless chip cards Expired - Fee Related DE4428732C1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19944428732 DE4428732C1 (en) 1994-08-15 1994-08-15 Multilayer chip card coil for contactless chip cards
DE19580862T DE19580862D2 (en) 1994-08-15 1995-08-04 Multi-layer chip card coils for contactless chip cards
PCT/DE1995/001052 WO1996005572A1 (en) 1994-08-15 1995-08-04 Multi-layered chip card coils for contactless chip cards
AU32191/95A AU3219195A (en) 1994-08-15 1995-08-04 Multi-layered chip card coils for contactless chip cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19944428732 DE4428732C1 (en) 1994-08-15 1994-08-15 Multilayer chip card coil for contactless chip cards

Publications (1)

Publication Number Publication Date
DE4428732C1 true DE4428732C1 (en) 1996-01-04

Family

ID=6525623

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19944428732 Expired - Fee Related DE4428732C1 (en) 1994-08-15 1994-08-15 Multilayer chip card coil for contactless chip cards
DE19580862T Expired - Fee Related DE19580862D2 (en) 1994-08-15 1995-08-04 Multi-layer chip card coils for contactless chip cards

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19580862T Expired - Fee Related DE19580862D2 (en) 1994-08-15 1995-08-04 Multi-layer chip card coils for contactless chip cards

Country Status (3)

Country Link
AU (1) AU3219195A (en)
DE (2) DE4428732C1 (en)
WO (1) WO1996005572A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756244A2 (en) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
DE19641406A1 (en) * 1996-10-08 1998-04-09 Pav Card Gmbh Smart card and communication method
EP0991014A2 (en) * 1998-09-30 2000-04-05 Toppan Forms Co., Ltd Conductive paste and method of forming antenna for transponder
WO2001046904A1 (en) * 1999-12-22 2001-06-28 Flexchip Ag Method for producing contactable conductor loops for transponders
WO2004012138A1 (en) * 2002-07-25 2004-02-05 Giesecke & Devrient Gmbh Data support with transponder coil
EP1739598A1 (en) * 2005-04-25 2007-01-03 LINTEC Corporation Antenna circuit, IC inlet, IC tag and IC card, as well as manufacturing method of IC card
EP1751722A2 (en) * 2004-04-20 2007-02-14 Alcoa Closure Systems International, Inc. Method of forming circuit assembly
WO2020033533A1 (en) * 2018-08-07 2020-02-13 Avery Dennison Retail Information Services, Llc Overlapping coil structures formed by folding for compact rfid tags
US11798901B1 (en) 2018-10-31 2023-10-24 Avery Dennison Retail Information Services Llc Wafer-scale integration with alternative technology wafer processes that can be folded into three-dimensional packaging

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011003754A1 (en) * 2011-02-08 2012-08-09 Bolzenschweißtechnik Heinz Soyer GmbH Winding element, useful for forming a winding packet for a transformer, comprises connecting elements, and an insulating element arranged between two windings

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824870A1 (en) * 1987-09-28 1989-04-13 Mitsubishi Electric Corp SYSTEM FOR CONTACT-FREE INFORMATION TRANSFER BETWEEN AN IC CARD AND A CARD READING / WRITING DEVICE AND IC CARD
DE3111516C2 (en) * 1981-03-24 1990-04-05 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
DE4328100A1 (en) * 1992-08-21 1994-02-24 Mitsubishi Electric Corp Signal receiving coil and contactless type IC card using the signal receiving coil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156311A (en) * 1979-05-24 1980-12-05 Kokusai Electric Co Ltd Inductance element
FR2679374B1 (en) * 1991-07-17 1993-12-31 Accumulateurs Fixes Et Traction TRANSFORMER WINDING CONSISTING OF AN INSULATING TAPE COMPRISING ELECTRICALLY CONDUCTIVE PATTERNS.
DE9115582U1 (en) * 1991-12-16 1992-12-17 Siemens Ag, 8000 Muenchen, De

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3111516C2 (en) * 1981-03-24 1990-04-05 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
DE3824870A1 (en) * 1987-09-28 1989-04-13 Mitsubishi Electric Corp SYSTEM FOR CONTACT-FREE INFORMATION TRANSFER BETWEEN AN IC CARD AND A CARD READING / WRITING DEVICE AND IC CARD
DE4328100A1 (en) * 1992-08-21 1994-02-24 Mitsubishi Electric Corp Signal receiving coil and contactless type IC card using the signal receiving coil

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756244A3 (en) * 1995-07-26 1998-12-09 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
EP0756244A2 (en) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
DE19641406A1 (en) * 1996-10-08 1998-04-09 Pav Card Gmbh Smart card and communication method
DE19641406C2 (en) * 1996-10-08 2001-03-08 Pav Card Gmbh Smart card
EP1484713A1 (en) * 1998-09-30 2004-12-08 Toppan Forms Co., Ltd Conductive paste and method of forming an antenna for transponder
EP0991014A2 (en) * 1998-09-30 2000-04-05 Toppan Forms Co., Ltd Conductive paste and method of forming antenna for transponder
EP0991014A3 (en) * 1998-09-30 2003-06-18 Toppan Forms Co., Ltd Conductive paste and method of forming antenna for transponder
EP1484714A1 (en) * 1998-09-30 2004-12-08 Toppan Forms Co., Ltd Conductive paste and method of forming antenna for transponder
EP1475743A1 (en) * 1998-09-30 2004-11-10 Toppan Forms Co., Ltd Conductive paste and method of forming antenna for transponder
WO2001046904A1 (en) * 1999-12-22 2001-06-28 Flexchip Ag Method for producing contactable conductor loops for transponders
DE10233927A1 (en) * 2002-07-25 2004-02-12 Giesecke & Devrient Gmbh Data carrier with transponder coil
WO2004012138A1 (en) * 2002-07-25 2004-02-05 Giesecke & Devrient Gmbh Data support with transponder coil
EP1751722A2 (en) * 2004-04-20 2007-02-14 Alcoa Closure Systems International, Inc. Method of forming circuit assembly
EP1751722A4 (en) * 2004-04-20 2009-03-25 Alcoa Closure Systems Int Inc Method of forming circuit assembly
EP1739598A1 (en) * 2005-04-25 2007-01-03 LINTEC Corporation Antenna circuit, IC inlet, IC tag and IC card, as well as manufacturing method of IC card
US7434739B2 (en) 2005-04-25 2008-10-14 Lintec Corporation Antenna circuit, IC inlet, IC tag, and IC card, as well as manufacturing method of IC tag and manufacturing method of IC card
WO2020033533A1 (en) * 2018-08-07 2020-02-13 Avery Dennison Retail Information Services, Llc Overlapping coil structures formed by folding for compact rfid tags
US11798901B1 (en) 2018-10-31 2023-10-24 Avery Dennison Retail Information Services Llc Wafer-scale integration with alternative technology wafer processes that can be folded into three-dimensional packaging

Also Published As

Publication number Publication date
DE19580862D2 (en) 1999-04-15
AU3219195A (en) 1996-03-07
WO1996005572A1 (en) 1996-02-22

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