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DE19632115C1 - Combination chip module for smart cards allowing both contacting- and contactless communication with external data station - Google Patents

Combination chip module for smart cards allowing both contacting- and contactless communication with external data station

Info

Publication number
DE19632115C1
DE19632115C1 DE1996132115 DE19632115A DE19632115C1 DE 19632115 C1 DE19632115 C1 DE 19632115C1 DE 1996132115 DE1996132115 DE 1996132115 DE 19632115 A DE19632115 A DE 19632115A DE 19632115 C1 DE19632115 C1 DE 19632115C1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
chip
contact
module
station
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1996132115
Other languages
German (de)
Inventor
Michael Huber
Peter Stampka
Manfred Fries
Josef Heitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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    • H01L2924/19042Component type being an inductor

Abstract

This invention concerns a combination chip module for transmission of electrical signals or data with or without contact to an external read-write station with an elongation-resistant, electrically insulated substrate (2), on or in which one or more integrated semiconductor circuits are arranged. The circuits are connected, via connecting terminals (6), a) to one or more couplers of an interface circuit which is either separate orin integrated form and provided in the chip module (1), which interface circuit enables contactless bidirectional data communication between the chip module (1) and the external read-write station, and b) to electrically conducting contact surfaces (8) provided on one side of the substrate (2), which contact surfaces (8) enable bidirectional data communication with contact, between the chip module (1) and the external read-write station. The one or more couplers have metal printed conductors which are also formed on the side of the substrate (2) facing the contact surfaces (8).

Description

Die Erfindung bezieht sich auf ein Kombinations-Chipmodul nach dem Oberbegriff des Patentanspruchs 1, ein Verfahren zur Herstellung eines Kombinations-Chipmoduls nach dem Oberbe griff des Patentanspruchs 13, sowie die Verwendung derartiger Kombinations-Chipmodule in Chipkarten. The invention relates to a combination chip module according to the preamble of claim 1, a method for producing a chip module according to the combination Oberbe handle of claim 13, as well as the use of such combination chip modules in smart cards.

Chipmodule werden bei der Herstellung von Chipkarten als fer tigungstechnisch abgeschlossene Zwischenerzeugnisse produ ziert und unabhängig zu Enderzeugnissen weiter verarbeitet. Chip modules sheet produ as manufac turing technically completed intermediate products in the production of chip cards and processed independently in the final products. Unter einem Chipmodul wird hierbei eine Anordnung verstanden, bei der auf oder in einem elektrisch isolierenden Träger eine oder mehrere integrierte Halbleiterschaltungen in Form von Chips oder integrierten Schaltkreisen angeordnet sind, die mit einem auf einer Seite oder auf beiden Seiten des Trägers vorgesehenen Leiterbahnsystem über Verwendungsanschlüsse ver bunden sind, wobei der Träger in der Regel einen flexiblen Film darstellt, auf dem der eigentliche Halbleiterchip mon tiert wird, und auf welchem sich die meist vergoldeten Kon taktflächen der Chipkarte befinden. Under a chip module, an arrangement is understood to mean, in which one or more integrated semiconductor circuits in the form of chips or integrated circuits are arranged on or in an electrically insulating support with a provided on one side or on both sides of the carrier strip conductor system using terminals ver are connected, wherein the carrier generally is a flexible film on which the actual semiconductor chip mon advantage is, and on which the gold-plated usually con tact surfaces are the chip card. Unter einer Kombinations-Chipkarte bzw. einem Kombinations-Chipmodul wird eine Anord nung verstanden, welche sowohl für eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine Lese-Schreibstation erlaubt, und welche zu diesem Zweck neben den für eine kontaktbehaftete Übertragung dienenden Kontaktflächen darüber hinaus mit den zur kontakt losen Übertragung von Signalen benötigten Bauelementen wie Übertragungsspulen oder Kondensatorplatten ausgestattet sind. Under a combination chip card or a combination chip module a Anord voltage is understood that allows for both a contactless and a contact-type transmission of electrical signals or data to a read-write station, and which for this purpose in addition to the contact-type for a transmission serving contact surfaces are also equipped with the needed for the contactless transmission of signals components such as transmission coils or capacitor plates. Neben den derzeit typischen Anwendungsfeldern solcher Chip karten in der Form von Krankenversichertenkarten, Gleitzei terfassungskarten, Telefonkarten und dergleichen ergeben sich zukünftig insbesondere Anwendungen im öffentlichen Personen nahverkehr, Skilift, Freibad, usw., wo in möglichst kurzer Zeit möglichst viel Personen erfaßt werden müssen. In addition to the currently typical fields of application of such chip cards terfassungskarten in the form of health insurance cards, Gleitzei, telephone cards and the like arise in the future in particular applications in public mass transit, ski lift, swimming pool, etc. where as much people must be detected as quickly as possible. Bei sol chen Anwendungen bietet die kontaktlose Übertragung von elek trischen Signalen gegenüber der Kontaktbehafteten den Vor teil, daß gegenüber der ersteren Möglichkeit die Chipkarte nicht unbedingt in die Lese-Schreibstation eingeführt werden muß, sondern berührungslos über eine Entfernung von bis zu einigen Metern funktioniert. In sol chen applications, the contactless transmission of elec tric signals relative to the contact afflicted provides in part the on that compared to the first option, the smart card need not necessarily be inserted into the read-write station but without contact work over a distance of up to several meters. Die kontaktlose Signalübertra gung erfordert jedoch aufwendige Schaltungen mit Koppelele menten, die eine Signalübertragung ermöglichen, wobei sich wegen der flachen Bauform der Chipkarte am ehesten die kapa zitive und die induktive Kopplung eignen. However, the contactless supply Signalübertra requires complicated circuits Koppelele elements that allow a signal transmission, wherein the most likely kapa zitive and the inductive coupling are suitable because of the flat design of the smart card. Derzeit erfolgt bei den meisten kontaktlosen Karten die Übertragung auf indukti vem Wege, mit dem sich sowohl die Daten wie auch die Energie übertragung realisieren lassen. Currently, the transfer to inductive vem ways in which both the data and the energy can be realized transfer takes place with most contactless cards. Hierbei sind im Kartenkörper eine oder mehrere Induktionsspulen integriert ausgebildet, die auf geeignete Weise mit der auf dem Halbleiterchip be findlichen Schaltung kontaktiert sind. Here, one or more induction coils are formed integrally in the card body, are contacted in a suitable manner with the loading on the semiconductor chip-sensitive circuit. Die Übertragung von elektrischen Signalen erfolgt nach dem Prinzip des lose ge koppelten Transformators, wobei die Trägerfrequenz beispiels weise im Bereich zwischen 100 und 300 kHz oder bei einigen MHz, insbesondere der Industriefrequenz von 13,56 MHz liegt. The transmission of electrical signals according to the principle of the loosely coupled transformer ge, wherein the carrier frequency of example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz. Hierfür werden Induktionsspulen mit einem gegenüber der Grundfläche des Halbleiterchips von in der Größenordnung etwa 10 mm² wesentlich größeren Spulenflächen von typischerweise etwa 30 bis 40 cm² benötigt, wobei die Induktionsspule in der Regel nur wenige Windungen aufweist und flach ausgebildet ist. For this purpose induction coils are required cm² with respect to the base area of ​​the semiconductor chip from mm² in the order of about 10 substantially larger coil areas of typically from about 30 to 40, wherein the induction coil has usually only a few turns and is formed flat. Bei den derzeit auf dem Markt verfügbaren Kombinations-Chipkarten bzw. Kombinations-Chipmodulen ist es bekannt, zum einem geätzte Spulen innerhalb einer Inlettfolie, und zum An deren gewickelte Spulen innerhalb einer Inlettfolie oder ge wickelte Spulen innerhalb des Kartenkörpers vorzusehen, die durch geeignete Verbindungstechniken mit dem Chipmodul elek trisch verbunden werden müssen. In the currently available on the market combination smart card or combination chip modules, it is known for an etched coil within an internal foil, and on the wound coils within an internal foil or Ge-wound coils provided within the card body, with by suitable connecting techniques must be connected to the chip module elec tric. Bei einer weiteren bekannten Möglichkeit zur Herstellung einer Kombinations-Chipkarte wer den die Windungen der Induktionsspule unmittelbar vom Halb leiterchip abgestützt und mit diesem verbunden. In another known possibility for the preparation of a combination IC card who is the turns of the induction coil conductor chip supported directly by half and is connected thereto.

Aus der EP 0710919 A2 ist ein kontaktloses Chipmodul mit einer draht gewickelten Spule bekannt geworden, die selbsttragend ist und den Träger für den integrierten Schaltkreis bildet. From EP 0710919 A2 a contactless chip module with a wire-wound coil has become known which is self-supporting and forms the support for the integrated circuit. Allen derzeit verfügbaren Kombinations-Chipkarten bzw. Kombinati ons-Chipmodulen gemeinsam sind die auf Grund der relativ kom plexen Herstellungsverfahren hohen Kosten, die nicht von al len gewünschten Anwendungsbereichen getragen werden können. All currently available combination smart card or combination Nati ons chip modules are common to the high due to the relatively com plex manufacturing process costs that are not desired by al len applications can be worn.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Kombinations-Chipmodul insbesondere zur Verwendung in einer Chipkarte für sowohl eine kontaktlose als auch eine kontakt behaftete Übertragung von elektrischen Signalen bzw. Daten an eine Lese-Schreibstation zur Verfügung zu stellen, welche ge genüber den bisherigen Kombinations-Chipkarten bzw. Kombina tions-Chipkarten-Modulen wesentlich einfacher und damit ko stengünstiger hergestellt werden kann. The present invention has for its object to provide a combination chip module in particular for use in a smart card for both a contactless and a contact-type transmission of electrical signals or data to a read-write station available, which ge genüber the previous combination can be produced -Chipkarten or Kombina tions smart card modules much easier and therefore ko stengünstiger.

Diese Aufgabe wird durch ein Kombinations-Chipmodul gemäß An spruch 1 und ein Verfahren zur Herstellung eines Kombinati ons-Chipmoduls gemäß Anspruch 13 gelöst. This object is achieved by a combination chip module according to claim 1. and a method for producing a combi Nati ons-chip module according to claim. 13

Erfindungsgemäß ist vorgesehen, daß das oder die mehreren Koppelelemente metallische Leiterbahnen aufweisen, die gleichfalls auf der den Kontaktflächen zugewiesenen Seite des Trägers ausgebildet sind. According to the invention it is provided that the or more coupling elements comprise metallic conductor tracks, which are also formed on the contact surfaces assigned to the side of the support. Dem Prinzip der Erfindung folgend kann hierbei vorgesehen sein, daß die Leiterbahnen des oder der mehreren Koppelelemente und die metallischen Kontaktflä chen in der gleichen Ebene angeordnet und aus demselben Mate rial bzw. denselben Materialien gefertigt sind. can follow the principle of the invention be provided here that the conductor tracks of the or more coupling elements and the metallic Kontaktflä surfaces arranged in the same plane and are made of the same mate rial or the same materials.

Durch kostenreduzierendes Gestalten bei Erzielung einer Mul tifunktionalbauweise werden erfindungsgemäß die Leiterbahnen des Koppelelementes sonach auf die Kontaktseite des Chipkar ten-Moduls verlagert. Through cost-reducing figures in achieving Mul tifunktionalbauweise the conductor tracks of the coupling element are CIRCUMSTANCES shifted to the contact side of the Chipkar th module according to the invention. Eine besonders einfach und kostengün stig herzustellende Anordnung ergibt sich hierbei, wenn der Träger auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen ist, aus welcher die Leiterbahnen des oder der mehreren Koppelelemente und die Kontaktflächen durch Strukturierung vorzugsweise vermittels Ätzprozessen un ter Verwendung geeigneter Ätzmasken in einem Arbeitsgang ge fertigt werden. , A particularly simple and kostengün stig produced arrangement is obtained in this case when the carrier is provided on its one side with a thin, continuous metal coating, from which the conductor tracks of the one or more coupling elements and the contact surfaces by patterning preferably by means of etching processes un ter using suitable etching masks ge in one step are prepared.

Die Erfindungskonzeption bringt folgende wesentliche Vorteile gegenüber dem Stand der Technik mit sich: The inventive concept has the following significant advantages over the prior art with it:

  • - durch die Verlagerung der Leiterbahnen des wenigstens einen Koppelelementes auf die Seite der Kontaktflächen des Chip moduls eröffnet sich die Möglichkeit der gleichzeitigen Fertigung dieser beiden Bestandteile und damit eine erheb liche Einsparung von Herstellkosten; - by shifting the conductor tracks of at least one coupling element on the side of the contact areas of the chip module opens up the possibility of simultaneous production of these two components and thus a fixed Liche saving of production costs;
  • - es besteht maximale Designfreiheit beim Layout sowohl der metallischen Leiterbahnen, als auch des Kontaktflächenbe reiches; - there is maximum freedom of design in the layout of both the metallic wires, as well as the Kontaktflächenbe rich;
  • - auch relativ große Halbleiterchips bzw. integrierte Schalt kreise sind einsetzbar; - even relatively large semiconductor chips or integrated switching circuits are used;
  • - keine wesentlichen Mehrkosten für die Fertigung der Leiter bahnen für das wenigstens eine Koppelelement, da die zur Fertigung der Kontaktflächen benötigte Ätzmaske lediglich hinsichtlich des Layout-Designs geändert werden muß; - no significant additional costs for the manufacture of printed conductors for the at least one coupling element, as must be altered for the production of the contact surfaces etching mask required only with respect to the layout design;
  • - mit Ausnahme der beiden Zusatzkontaktierungsschritte für den elektrischen Anschluß der metallischen Leiterbahnen des wenigstens einen Koppelelementes an die wenigstens eine integrierte Halbleiterschaltung sind keine Änderungen beim Ablauf des Fertigungsprozesses erforderlich; - with the exception of the two Zusatzkontaktierungsschritte for the electrical connection of the metallic wires of the at least one coupling element to the at least one integrated semiconductor circuit are no changes in the sequence of the manufacturing process is required;
  • - durch die Verlagerung des Koppelelementes an die Außenseite des Chipmoduls kann eine kompakte Anordnung mit minimalster Bauhöhe erzielt werden; - by the displacement of the coupling element to the outside of the chip module, a compact arrangement can be achieved with minimal height;
  • - vor der endgültigen, abschließenden Formgebung ist ein dy namischer und statischer Funktionstest möglich, was beson ders bei Verwendung von Endlosfilmen als Träger wichtig ist, da zugleich Handling und Aussondern defekter Chipmodu le erleichtert wird. - before the final, final forming a dy namischer and static function test is possible, what is special DERS when using endless films as supports important because at the same time handling and discarding defective Chipmodu le easier.

Die Erfindung betrifft ferner auch Chipmodul-Einheiten, die aus mehreren hintereinander und/oder nebeneinander in glei chen Abständen angeordneten Chipmodulen mit gemeinsamen Trä ger, vorzugsweise einem streifenförmigen Träger, bestehen; The invention further relates to chip module units consisting of a plurality of series and / or arranged side by side in sliding surfaces intervals chip modules with common Trä ger, preferably a strip-shaped carrier, are made; derartige Chipmodul-Einheiten zeichnen sich durch besonders erleichtertes Handling und Vorteile beim elektrischen Funkti onstest aus. Such a chip module units are distinguished by particularly facilitated handling and advantages of the electrical functi onstest from.

Die Erfindung erstreckt sich ferner auch auf entsprechende Chipkarten, die erfindungsgemäße Chipmodule bzw. Chipmodul-Einheiten enthalten. The invention further extends also to the corresponding smart card, the chip modules according to the invention or chip module units. Durch Verwendung von natürlichen Werk stoffen, beispielsweise Pappe, Papier oder Textilmaterialien für die Herstellung des Kartenkörpers kann im Gegensatz zur Verwendung von Kunststoffmaterialien der Preis pro Chipkarte weiterhin deutlich reduziert werden. materials by using natural plant, such as cardboard, paper or textile materials for the production of the card body can still be contrary to the use of plastic materials, the price per chip card significantly reduced.

Für den bevorzugten Anwendungsbereich der erfindungsgemäßen Chipmodule für Chipkarten wird ein Träger verwendet, der in Form eines endlosen Streifens oder entsprechender Streifenab stände eingesetzt wird und aus dem die Chipmodule nach der Fertigstellung auf die endgültige Form ausgestanzt werden. For the preferred application of the chip modules according to the invention for chip cards, a carrier is used, the stands in the form of an endless strip or corresponding Streifenab is inserted and from which the chip modules are punched out on the final shape after completion. Besonders günstig ist hierbei die Verwendung endloser Träger filmstreifen, die beiderseits eine Randperforation aufweisen und sich besonders vorteilhaft für die Serienproduktion der Chipmodule eignen, da sie die Positionierung in automatisier ten Produktionsvorrichtungen erleichtern. the use of endless carrier is particularly advantageous in this film strip, which on both sides have an edge perforation and is particularly advantageously suitable for the mass production of the chip modules, since they facilitate the positioning in automatable th production devices. Alternativ dazu kann der Träger auch in Bogenform verwendet werden, wobei dann die Chipmodule gegebenenfalls auch in mehreren paralle len Reihen vorgesehen werden, aus denen im letzten Herstel lungsschritt einzelne Chipmodule bzw. auch Chipmoduleinheiten mit mehreren Chipmodulen ausgeschnitten oder ausgestanzt wer den können. Alternatively, the carrier can also be used in sheet form, wherein the chip modules then optionally be provided in a plurality of paralle len rows from which treatment step single chip modules or even chip module units with a plurality of chip modules cut out or punched out in the last herstel who can.

Geeignete Materialien für den Träger sind beispielsweise Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES), Po lyparabansäure (PPA), Polyvinylclorid (PVC), Polycarbonat, Kapton und/oder Acrylnitril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hochschlagzähes Thermoplastmaterial. Suitable materials for the support are, for example, epoxy resin, polyimide, polyester, polyether sulfone (PES), Po lyparabansäure (PPA), polyvinyl chloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or the like high impact thermoplastic material. Der Träger weist, sofern er in Form eines elastischen, flexiblen Trägerfilms eingesetzt wird, günstigerweise eine Dicke im Be reich von etwa 25 µm bis etwa 200 µm auf. The carrier includes, unless it is used in the form of a resilient, flexible support film suitably has a thickness in the range of approximately 25 microns to about 200 microns.

Insbesondere bei der Verwendung von Endlosstreifen (Tapes) für den Träger ist es aus produktionstechnischen Gründen be sonders günstig, wenn der Träger auf einer Seite mit einer Metallfolie, insbesondere einer Kupferfolie beschichtet ist, aus welcher durch Strukturierung vermittels an sich bekannter Halbleitertechnologieverfahren sowohl die Leiterbahnen des Koppelelementes, als auch die Kontaktflächen gefertigt wer den. In particular, in the use of continuous strips (tapes) for the carrier, it is advantageous for production reasons be Sonders, when the support is coated on one side with a metal foil, in particular a copper foil, from which by patterning by means of a known semiconductor technology process, both the conductor tracks of the coupling element, and the contact surfaces made who the. Besonders kostengünstig kann dies durch strukturiertes Ätzen der Metallfolie unter Einsatz einer geeignet entworfe nen Ätzmaske erfolgen, günstigerweise bereits auf Seiten des Herstellers des Endlosfilm-Trägerbandes. Particularly cost this can be done through structured etching the metal foil using a suitable entworfe nen etching mask, conveniently already on the part of the manufacturer of the continuous film carrier tape.

Aus produktionstechnischen Gründen und im Sinne optimaler elektrischer Eigenschaften sowie möglichst langer Lebensdauer kann die auf der einen Seite des Trägers vorgesehene Metall beschichtung auch aus mehreren unterschiedlichen dünnen Me tallagen bestehen, wobei wenigstens eine Lage der Beschich tung insbesondere Kupfer aufweist. For production reasons, and in terms of optimal electrical characteristics as well as long life as possible the intended on the one side of the support metal can coating from a plurality of different thin Me consist valleys, wherein at least one layer of the Beschich tung particular comprises copper. Ein bevorzugter Schicht aufbau einer solchen Metallbeschichtung kann, ausgehend von der äußeren Kontaktseite des Chipmoduls bis zur Chipseite, beispielsweise folgendermaßen aussehen: eine dünne, bei spielsweise 0,1 µm starke, bondfähige Au-Schicht, eine etwa 3 µm bis 5 µm dünne, als Diffusionsbarriere gegen Kupfer wir kende Ni-Schicht, ein strukturgeätztes Kupfer-Band der Stärke von vorzugsweise 15 µm bis 70 µm; A preferred layer structure of such a metal coating may, starting from the outer contact side of the chip module until the chip side, look, for example, as follows: a thin, strong at play, 0.1 microns, bondable Au layer, an about 3 .mu.m to 5 .mu.m thin, as a diffusion barrier against copper we kende Ni layer, a copper strukturgeätztes band of the thickness of preferably 15 .mu.m to 70 .mu.m; der eigentliche Träger in Form eines Kunststoffbandes der Stärke von beispielsweise 100 µm, vorzugsweise aus Epoxialharz, Kapton und dergleichen; the actual support in the form of a plastic tape of thickness of for example 100 microns, preferably from Epoxialharz, Kapton and the like; so wie eine etwa 0,1 µm dünne bondfähige Schicht in den Ausspa rungen bzw. Bondlöchern der Kunststoff-Trägerschicht, bei spielsweise bestehend aus Au, AuCo, Ag und dergleichen. as an approximately 0.1 micron thin bondable layer in the Ausspa stanchions or bonding holes of the plastic carrier layer, wherein the pitch consisting of Au, AuCo, Ag and the like.

Um elektrische Kurzschlüsse beim Auflegen des Chipmoduls auf leitende Oberflächen, beispielsweise Kontaktspitzen der ex ternen Lese-Schreibstation zu vermeiden, kann optional wenig stens ein Teil der Modulkontaktseite mit elektrisch isolie renden Lack durch geeignete Fertigungsschritte überzogen wer den. In order to avoid electrical short circuits when placing the chip module on conductive surfaces, for example contact tips of the ex ternal read-write station, may optionally little least a portion of module contact side with electrically isolie leaders paint by suitable manufacturing steps covered who the. Zweckmäßigerweise sind hierbei insbesondere die Leiter bahnen des wenigstens einen Koppelelementes auf ihrer dem Träger abgewandten Oberfläche mit einer elektrisch isolieren den Schutzschicht überzogen. Conveniently, the conductor tracks are in this case in particular the coated at least one coupling element on its side remote from the carrier surface with an electrically insulate the protective layer.

Der elektrische Anschluß der integrierten Halbleiterschal tungen an die Leiterbahnen des Koppelelementes und/oder der Kontaktflächen kann an sich nach beliebigen, bekannten Ver fahren erfolgen, insbesondere durch Drahtbonden (Wire-Bon ding), durch automatisiertes Filmbonden (TAB, Tape Automated Bonding) oder durch Oberflächenbefestigung von integrierten SMD-(Surface Mounted Device)-Halbleiterschaltungen. The electrical connection of the semiconductor integrated scarf obligations to the conductor tracks of the coupling element and / or the contact surfaces can be made to ride on itself by any of known processes, especially by wire bonding (wire Bon ding), through automated bonding (TAB Tape Automated Bonding) or by surface mounting of integrated SMD (surface Mounted Device) -Halbleiterschaltungen. Im Sinne einer möglichst kostengünstigen Herstellung wird einer Kon taktierung vermittels Bonddrähten mit den Verbindungsan schlüssen der integrierten Halbleiterschaltungen der Vorzug gegeben, wobei in diesem Falle im Träger Bondlöcher ausgebil det sind, durch welche die Bonddrähte geführt sind. In terms of a cost-effective way producing a clocking of Kon is by means of bonding wires to the connecting terminals of the semiconductor integrated circuits circuits given preference, wherein ausgebil det in this case, in the carrier Bond holes through which the bonding wires are guided.

Bei einer besonders bevorzugten Ausbildung der Erfindung ist vorgesehen, daß das oder die mehreren Koppelelemente eine Induktionsspule mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halbleiterschaltun gen tragenden Halbleiterchips größeren Spulenumfang aufwei sen, und die Leiterbahnen der Induktionsspule streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen angeordnet sind. In a particularly preferred embodiment of the invention it is provided that the one or more coupling elements with respect to the outer dimensions of the one or more integrated Halbleiterschaltun gen-bearing semiconductor chips larger coil circumference sen an induction coil aufwei, and the conductor tracks of the induction coil strip-shaped adjacent to one another without crossing, and are disposed adjacent to the contact surfaces. Besonders günstige geometri sche Verhältnisse liegen hierbei vor, wenn die Enden der Lei terbahnen zu Kontaktanschlüssen verbreitert sind, welche in nerhalb der von den Kontaktflächen beanspruchten Grundfläche liegen. Particularly favorable geometric specific ratios are considered to exist when the ends of Lei terbahnen are widened to contact terminals, which are located in the claimed nerhalb of the contact surfaces of the base.

Weitere Merkmale, Vorteile und Zweckmäßigkeiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung eines Ausfüh rungsbeispieles der Erfindung anhand der Zeichnung. Further features, advantages and expediencies of the invention will become apparent from the following description of exporting approximately example of the invention with reference to the drawing. Es zeigt: It shows:

Fig. 1 eine schematische Schnittdarstellung eines Kombinati ons-Chipmoduls zur Verwendung in einer Kombinations-Chipkarte gemäß einem Ausführungsbeispiel der Erfin dung; Fig. 1 is a schematic sectional view of a combined Nati ons-chip module for use in a combination IC card according to an embodiment of the dung OF INVENTION;

Fig. 2 eine vergrößerte Darstellung der Einzelheit X aus Fig. 1; Fig. 2 is an enlarged representation of the detail X of FIG. 1; und and

Fig. 3 eine schematische Unteransicht eines Kombinations-Chipmoduls nach dem Ausführungsbeispiel der Erfin dung. Fig. 3 dung is a schematic bottom view of a combination-chip module according to the embodiment of the OF INVENTION.

Das in den Fig. 1 bis 3 dargestellte Ausführungsbeispiel der Erfindung umfaßt ein Kombinations-Chipmodul 1 für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine (nicht näher dargestellte) externe Lese-Schreibstation, mit einem dehnfe sten, elektrisch isolierenden Kunststoffträger 2 , auf dem vermittels einer Klebe- bzw. Haftschicht 3 ein vorzugsweise aus Silizium-Grundmaterial bestehender Halbleiterchip 4 befe stigt ist, auf dessen Hauptoberfläche 5 wenigstens eine (nicht näher dargestellte) integrierte Halbleiterschaltung ausgebildet ist, die über Verbindungsanschlüsse 6 in der Form von auf der Hauptoberfläche 5 ausgebildeter elektrisch lei tender Padflächen und daran befestigter Bonddrähte 7 mit auf einer Seite des Trägers 2 vorgesehenen elektrisch leitenden Kontaktflächen 8 dauerhaft verbunden sind. The embodiment of the invention illustrated in FIGS. 1 to 3 comprises a composite chip module 1 for both a contactless and a contact-type transmission of electrical signals or data to a (not shown) external read-write station, having a dehnfe sten, electrically insulating plastic carrier 2, a preferably BEFE on the means of an adhesive or adhesive layer 3 of silicon base material existing semiconductor chip 4 is Stigt, on the main surface 5 of the semiconductor integrated circuit is formed at least one (not shown) connected via connecting terminals 6 in the form of 5 formed on the main surface electrically lei tender pad surfaces and attached thereto bonding wires 7 are connected permanently provided on a side of the substrate 2 are electrically conductive pads. 8 Die Kontaktflächen 8 sind in ihren Abmessungen und Anordnungen nach vorgegebenen ISO-Standardvorgaben ausgebildet und dienen zur kontaktbehaf teten Übertragung von elektrischen Signalen an eine mit Kon taktspitzen ausgestattete externe Lese-Schreibstation. The contact surfaces 8 are formed in their dimensions and configurations according to predetermined ISO standard requirements and are used to kontaktbehaf ended transmission of electrical signals to a clock with acute Kon equipped external read-write station. Eben falls auf der den Kontaktflächen 8 zugewiesenen Seite des Trägers 2 und in der gleichen Ebene angeordnet und aus dem selben Material gefertigt sind metallische Leiterbahnen 9 , die die Windungen einer Induktionsspule 10 mit einem gegen über den äußeren Abmessungen des Halbleiterchips 4 größeren Spulenumfang darstellen, wobei die Leiterbahnen 9 der Induk tionsspule 10 streifenförmig nebeneinander liegend, kreu zungsfrei und benachbart zu den Kontaktflächen 8 angeordnet sind, wie dies insbesondere aus der Rückansicht gemäß Fig. 3 ersichtlich ist. Layer if disposed on the contact surfaces 8 of the assigned side of the carrier 2 and in the same plane and made of the same material are metallic conductor tracks 9, which represent the turns of an induction coil 10 with a greater relative to the outer dimensions of the semiconductor chips 4 bobbin circumference, wherein the conductor tracks 9 of the Induk tion coil 10 strip-shaped juxtaposed kreu wetting free and are disposed adjacent to the contact surfaces 8, as can be seen in particular from the rear view of FIG. 3. Die Enden der Leiterbahnen 9 sind zu Kon taktanschlüssen 11 (Anschlußpads der Spulen) verbreitert, welche innerhalb der von den Kontaktflächen 8 beanspruchten Grundfläche liegen. The ends of the conductor tracks 9 are Kon clock terminals 11 (terminal pads of the coil) is widened, which lie within the space occupied by the contact surfaces 8 of the base. Über diese Kontaktanschlüsse 11 ist die Induktionsspule 10 elektrisch mit einer der wenigstens einen auf der Hauptoberfläche 5 des Halbleiterchips 4 ausgebildeten integrierten Halbleiterschaltung verbunden, vorzugsweise ebenfalls über Bonddrähte, welche in den Figuren der Über sichtlichkeit halber allerdings nicht näher dargestellt sind. This contact terminals 11, the induction coil 10 is electrically connected to one of the at least one formed on the main surface 5 of the semiconductor chip 4, the semiconductor integrated circuit, preferably also by means of bonding wires which sichtlichkeit in the figures of the above are not shown in detail sake, however.

Die Fig. 2 zeigt in einer vergrößerten Darstellung die Ein zelheit "X" gemäß Fig. 1 nähere Einzelheiten des Schichtauf baues von dem Träger 12 und der aus mehreren Einzellagen be stehenden Metallbeschichtung. Fig. 2 shows an enlarged view of the A zelheit "X" in FIG. 1 for further details of the layer on the building from the carrier 12 and be of a plurality of individual layers separate metal coating. Diese umfaßt etwa 0,1 µm star ke Au-, AuCo-, Ag- oder dergleichen Metallagen 12 und 13 , eine etwa 15 µm bis etwa 70 µm starke Kupferfolie 14 , sowie zu beiden Seiten der Kupferfolie 14 aufgebrachte, jeweils et wa 3 bis etwa 5 µm starke Ni-Schichten 15 und 16 , welche als Diffusionsbarriere gegen Kupfer wirken. This includes about 0.1 micron star ke Au, AuCo-, Ag or the like metal layers 12 and 13, an about 15 .mu.m to about 70 .mu.m thick copper foil 14 and 14 applied to both sides of the copper foil, respectively et wa 3 to about 5 microns thick Ni layers 15 and 16 which act as a diffusion barrier against copper. Zusätzlich sind die Leiterbahnen 9 sowie gegebenenfalls die Kontaktanschlüsse 11 der Induktionsspule auf ihrer dem Träger 2 abgewandten Ober fläche mit einer elektrisch isolierenden Schutzschicht 17 überzogen, beispielsweise einer Kunststoffschicht mit günsti gen tribologischen Eigenschaften. In addition, the conductor tracks 9 and, optionally, the contact terminals 11 of the induction coil on its upper surface facing away from the carrier 2 with an electrically insulating protective layer 17 coated, for example, a plastic layer with günsti gen tribological properties.

Zum Schutz des mechanisch empfindlichen Halbleiterchips 4 kann ein den Halbleiterchip 4 umgebender Stützrahmen 17 vor gesehen sein, der vorzugsweise durch Klebeverbindung mit dem Träger 2 befestigt ist, wobei das Chipmodul 1 des weiteren mit einer den Halbleiterchip 4 und die Bonddrähte 7 überdeckende Verkapselung vorgesehen sein kann, welche schematisch mit dem Bezugszeichen 18 angedeutet ist. For protecting the mechanically sensitive semiconductor chips 4 may be 4 surrounding support frame 17 before seen a semiconductor chip, which is preferably attached by adhesive bonding to the carrier 2, wherein the chip module 1 may further be provided with a semiconductor chip 4 and the bonding wires 7 covering encapsulation which is schematically indicated by the reference numeral 18th

Claims (27)

1. Kombinations-Chipmodul für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Si gnalen bzw. Daten an eine externe Lese-Schreibstation, mit einem dehnfesten, elektrisch isolierenden Träger ( 2 ), auf oder in dem eine oder mehrere integrierte Halbleiterschaltun gen angeordnet sind, die über Verbindungsanschlüsse ( 6 ) zum Einen mit einem oder mehreren Koppelelementen einer separat oder in integrierter Form in dem Chipmodul ( 1 ) vorgesehenen Schnittstellenschaltung, welche eine kontaktlose bidirektio nale Datenkommunikation zwischen dem Chipmodul ( 1 ) und der externen Lese-Schreibstation ermöglicht, und zum Anderen mit auf einer Seite des Trägers ( 2 ) vorgesehenen elektrisch lei tenden Kontaktflächen ( 8 ), welche eine kontaktbehaftete bidi rektionale Datenkommunikation zwischen dem Chipmodul ( 1 ) und der externen Lese-Schreibstation ermöglicht, verbunden sind, dadurch gekennzeichnet, daß das oder die mehreren Koppelelemente metallische L Disposed 1. Combination chip module for both a contactless and a contact-type transmission of electrical Si gnalen or data to an external read-write station, having a stretch-resistant, electrically insulating carrier (2), on or in the one or more integrated Halbleiterschaltun gen are, the via connection terminals (6) on the one provided with one or more coupling elements of a separately or in integrated form on the chip module (1) interface circuit, which enables contactless DIRECT BI-dimensional data communication between the chip module (1) and the external read-write station, provided and on the other with one side of the carrier (2) electrically lei Tenden contact surfaces (8) which permits a contact-type bidi-directional data communication between the chip module (1) and the external read-write station are connected, characterized in that the or the plurality of coupling elements metallic L eiterbahnen ( 9 ) aufweisen, die gleichfalls auf der den Kontaktflächen ( 8 ) zu gewiesenen Seite des Trägers ( 2 ) ausgebildet sind. pus tracks (9), which likewise are formed on the contact surfaces (8) to be rejected side of the support (2).
2. Kombinations-Chipmodul nach Anspruch 1, dadurch gekenn zeichnet, daß die Leiterbahnen ( 9 ) des oder der mehreren Koppelelemente und die metallischen Kontaktflächen ( 8 ) in der gleichen Ebene angeordnet und aus demselben Material bzw. denselben Materialien gefertigt sind. 2. Combination chip module according to claim 1, characterized in that the conductor tracks (9) of the arranged or more coupling elements and the metallic contact surfaces (8) in the same plane and made of the same material or the same materials.
3. Kombinations-Chipmodul nach Anspruch 1 oder 2, dadurch ge kennzeichnet, daß der Träger ( 2 ) auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen ist, aus welcher die Leiterbahnen ( 9 ) des oder der mehreren Koppe lelemente und die Kontaktflächen ( 8 ) durch Strukturierung ge fertigt sind. 3. Combination chip module according to claim 1 or 2, characterized in that the carrier (2) is provided on its one side with a thin, continuous metal coating, from which the conductors (9) of the one or more Koppe lelemente and the contact surfaces (8) are produced by patterning ge.
4. Kombinations-Chipmodul nach Anspruch 3, dadurch gekenn zeichnet, daß der auf seiner einen Seite mit der Metallbe schichtung versehene Träger ( 2 ) als Trägerfilm in Form eines endlosen Streifens oder eines entsprechenden Streifenab schnitts ausgebildet ist. 4. Combination-chip module according to claim 3, characterized in that the carrier coating provided on its one side with the Metal working (2) is formed as a base film in the form of an endless strip or a corresponding Streifenab section.
5. Kombinations-Chipmodul nach einem der Ansprüche 1 oder 4, dadurch gekennzeichnet, daß der Träger ( 2 ) aus Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES), Polyparabansäure (PPA), Polyvinylclorid (PVC), Polycarbonat, Kapton und/oder Acrylnitril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hochschlagzähes Thermoplastmaterial besteht und gegebenen falls mit einem Verstärkungsmaterial, insbesondere bestehend aus Glasfasern verstärkt ist. 5. Combination chip module according to any one of claims 1 or 4, characterized in that the support (2) made of epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinyl chloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or the like high impact thermoplastic material and, where appropriate reinforced with a reinforcing material, in particular consisting of glass fibers.
6. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß der Träger ( 2 ) eine Stärke von etwa 25 µm bis etwa 200 µm besitzt. 6. Combination chip module according to any one of claims 1 to 5, characterized in that the carrier (2) has a thickness of about 25 microns to about 200 microns.
7. Kombinations-Chipmodul nach einem der Ansprüche 3 bis 6, dadurch gekennzeichnet, daß die auf der einen Seite des Trä gers ( 2 ) angeordnete Metallbeschichtung Kupfer aufweist. 7. Combination chip module according to any one of claims 3 to 6, characterized in that on one side of the Trä gers (2) has arranged metal coating of copper.
8. Kombinations-Chipmodul nach einem der Ansprüche 3 bis 7, dadurch gekennzeichnet, daß die auf der einen Seite des Trä gers ( 2 ) vorgesehene Metallbeschichtung aus mehreren dünnen Metallagen ( 12 , 13 ) besteht. 8. Combination chip module according to any one of claims 3 to 7, characterized in that on one side of the Trä gers (2) provided metal coating of a plurality of thin metal layers (12, 13).
9. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß die Leiterbahnen ( 9 ) des oder der mehreren Koppelelemente auf ihrer dem Träger ( 2 ) abge wandten Oberfläche mit einer elektrisch isolierenden Schutz schicht ( 17 ) überzogen sind. 9. Combination chip module according to any one of claims 1 to 8, characterized in that the conductor tracks (9) of the one or more coupling elements on its side facing the support (2) facing abge surface with an electrically insulating protective layer (17) are coated.
10. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß die elektrisch leitenden Kon taktflächen ( 8 ) und/oder die Leiterbahnen ( 9 ) des oder der mehreren Koppelelemente vermittels Bonddrähten mit den Ver bindungsanschlüssen ( 6 ) der einen oder mehreren integrierten Halbleiterschaltungen kontaktiert sind, wobei im Träger Bond löcher ausgebildet sind, durch welche die Bonddrähte geführt sind. 10. Combination chip module according to any one of claims 1 to 9, characterized in that the electrically conductive con tact surfaces (8) and / or the conductor tracks (9) of the one or more coupling elements by means of bonding wires with the Ver connection terminals (6) of the one or are contacted by a plurality of semiconductor integrated circuits, are formed in the carrier Bond holes through which the bonding wires are guided.
11. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß das oder die mehreren Koppelele mente eine Induktionsspule mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halb leiterschaltungen tragenden Halbleiterchips ( 4 ) größeren Spu lenumfang aufweist, und die Leiterbahnen ( 9 ) der Indukti onsspule streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen ( 8 ) angeordnet sind. 11. Combination chip module according to any one of claims 1 to 10, characterized in that the or more Koppelele mente an induction coil with a respect to the outer dimensions of the conductor circuits, one or more semiconductor integrated bearing semiconductor chips (4) of larger Spu comprises circumference, glycemic and the conductor tracks (9) of the Indukti onsspule strip-shaped adjacent to one another, without crossing and adjacent to the contact surfaces (8).
12. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, daß die Enden der Leiterbahnen ( 9 ) zu Kontaktanschlüssen ( 11 ) verbreitert sind, welche innerhalb der von den Kontaktflächen ( 8 ) beanspruchten Grundfläche lie gen. 12. Combination chip module according to any one of claims 1 to 11, characterized in that the ends of the conductors (9) to contact terminals (11) are widened, which gene within the claimed from the contact surfaces (8) base area lie.
13. Verfahren zur Herstellung eines Kombinations-Chipmoduls für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine ex terne Lese-Schreibstation, mit den Schritten: 13. A method for producing a chip module combination for both a contactless and a contact-type transmission of electrical signals or data to an ex ternal read-write station, comprising the steps of:
  • - Bestücken eines dehnfesten, elektrisch isolierenden Trägers ( 2 ), auf dem auf einer Seite elektrisch leitende Kontakt flächen ( 8 ) vorgesehen sind, mit einer oder mehreren inte grierten Halbleiterschaltungen, - fitting a stretch-resistant, electrically insulating carrier (2), are provided on the electrically conductive contact surfaces on one side (8), with one or more inte grated semiconductor circuits,
  • - Ausbilden bzw. Anordnen wenigstens eines Koppelelementes einer separat oder in integrierter Form in dem Chipmodul ( 1 ) vorgesehenen Schnittstellenschaltung, welche eine kon taktlose bidirektionale Datenkommunikation zwischen dem Chipmodul ( 1 ) und der externen Lese-Schreibstation ermög licht, - provided for forming and placing at least one coupling element of a separately or in integrated form on the chip module (1) interface circuit, which made a kon tactless bidirectional data communication between the chip module (1) and the external read-write station light,
  • - elektrisches Verbinden der wenigstens einen integrierten Halbleiterschaltung an die elektrisch leitenden Kontaktflä chen ( 8 ) und des wenigstens einen Koppelelementes über Ver bindungsanschlüsse ( 6 ), dadurch gekennzeichnet, daß das oder die mehreren Koppelelemente als metallische Leiter bahnen ( 9 ) auf der den Kontaktflächen ( 8 ) zugewiesenen Seite des Trägers ( 2 ) ausgebildet werden. - electrically connecting the at least one semiconductor integrated circuit surfaces at the electrically conductive Kontaktflä (8) and the connection terminals at least one coupling element via Ver (6), characterized in that the one or more coupling elements tracks as a metallic conductor (9) on the contact surfaces ( 8) allocated side of the carrier (2) are formed.
14. Verfahren nach Anspruch 13, dadurch gekennzeichnet, daß die Leiterbahnen ( 9 ) des wenigstens einen Koppelelementes und die metallischen Kontaktflächen ( 8 ) in der gleichen Ebene an geordnet und aus demselben Material bzw. denselben Materiali en gefertigt werden. 14. The method according to claim 13, characterized in that the conductor tracks (9) of the at least one coupling element and the metallic contact surfaces (8) arranged in the same plane and are made of the same material or the same Materiali s.
15. Verfahren nach Anspruch 13 oder 14, dadurch gekennzeich net, daß der Träger ( 2 ) auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen wird, aus welcher die Leiterbahnen ( 9 ) des wenigstens einen Koppelele mentes und die Kontaktflächen ( 8 ) durch Strukturierung gefer tigt werden. 15. The method of claim 13 or 14, characterized in that the carrier (2) is provided on its one side with a thin, continuous metal coating, from which the conductors (9) of the at least one Koppelele moment and also the contact surfaces (8) be taken gefer by structuring.
16. Verfahren nach einem der Ansprüche 13 bis 15, dadurch ge kennzeichnet, daß der auf seiner einen Seite mit der Metall beschichtung versehene Träger ( 2 ) als Trägerfilm in Form ei nes endlosen Streifens oder eines entsprechenden Streifenab schnitts ausgebildet wird. 16. The method according to any one of claims 13 to 15, characterized in that the section is formed on its one side with a metal coating provided carrier (2) as a base film in the form ei nes endless strip or a corresponding Streifenab.
17. Verfahren nach einem der Ansprüche 8 bis 11, dadurch ge kennzeichnet, daß der Träger ( 2 ) aus Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES), Polyparabansäure (PPA), Po lyvinylclorid (PVC), Polycarbonat, Kapton und/oder Acrylni tril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hoch schlagzähes Thermoplastmaterial gefertigt und gegebenenfalls mit einem Verstärkungsmaterial, insbesondere bestehend aus Glasfasern verstärkt wird. 17. The method according to any one of claims 8 to 11, characterized in that the support (2) made of epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), Po lyvinylclorid (PVC), polycarbonate, and Kapton / or Acrylni optionally reinforced in particular consisting of glass fibers tril-butadiene-styrene copolymer (ABS) or the like high impact thermoplastic material and with a reinforcing material.
18. Verfahren nach einem der Ansprüche 13 bis 17, dadurch ge kennzeichnet, daß der Träger ( 2 ) eine Stärke von etwa 25 µm bis etwa 200 µm besitzt. 18. The method according to any one of claims 13 to 17, characterized in that the carrier (2) has a thickness of about 25 microns to about 200 microns.
19. Verfahren nach einem der Ansprüche 15 bis 18, dadurch ge kennzeichnet, daß die auf der einen Seite des Trägers ( 2 ) angeordnete Metallbeschichtung Kupfer aufweist. 19. A method according to any one of claims 15 to 18, characterized in that on one side of the carrier (2) has arranged metal coating of copper.
20. Verfahren nach einem der Ansprüche 15 bis 19, dadurch ge kennzeichnet, daß die auf der einen Seite des Trägers ( 2 ) vorgesehene Metallbeschichtung aus mehreren dünnen Metalla gen besteht. 20. The method according to any one of claims 15 to 19, characterized in that on one side of the carrier (2) provided metal coating consists of several thin Metalla gene.
21. Verfahren nach einem der Ansprüche 13 bis 20, dadurch ge kennzeichnet, daß die Leiterbahnen ( 9 ) des wenigstens einen Koppelelementes auf der dem Träger ( 2 ) abgewandten Oberfläche mit einer elektrisch isolierenden Schutzschicht überzogen werden. 21. The method according to any one of claims 13 to 20, characterized in that the conductor tracks (9) of the at least one coupling element on the support (2) facing away from the surface with an electrically insulating protective layer are coated.
22. Verfahren nach einem der Ansprüche 13 bis 21, dadurch ge kennzeichnet, daß die elektrisch leitenden Kontaktflächen ( 8 ) und/oder die Leiterbahnen ( 9 ) des wenigstens einen Koppelelementes vermittels Bonddrähten mit den Verbindungsan schlüssen ( 6 ) der einen oder mehreren integrierten Halblei terschaltungen kontaktiert werden, wobei im Träger ( 2 ) Bond löcher ausgebildet werden, durch welche die Bonddrähte ( 7 ) geführt werden. 22. The method according to any one of claims 13 to 21, characterized in that the electrically conductive contact surfaces (8) and / or the conductor tracks (9) of the circuits at least one coupling element by means of bonding wires to the connecting terminals (6) of the one or more integrated semiconducting terschaltungen be contacted, wherein the carrier (2) Bond holes are formed, which are guided through the bonding wires (7).
23. Verfahren nach einem der Ansprüche 13 bis 22, dadurch ge kennzeichnet, daß das wenigstens eine Koppelelement eine In duktionsspule ( 10 ) mit einem gegenüber den äußeren Abmessun gen eines die eine oder mehreren integrierten Halbleiter schaltungen tragenden Halbleiterchips ( 4 ) größeren Spulenum fang aufweist, und die Leiterbahnen ( 9 ) der Induktionsspule ( 10 ) streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen ( 8 ) angeordnet werden. 23. The method according to any one of claims 13 to 22, characterized in that the at least one coupling element fang an in induction coil (10) with a gene from the outer Abmessun of the one or more semiconductor integrated circuits, bearing semiconductor chips (4) of larger Spulenum comprising , and the conductor tracks (9) of the induction coil (10) are arranged in strip form lying side by side, without crossing and adjacent to the contact surfaces (8).
24. Verfahren nach einem der Ansprüche 13 bis 23, dadurch ge kennzeichnet, daß die Enden der Leiterbahnen ( 9 ) zu Kon taktanschlüssen ( 11 ) verbreitert werden, welche innerhalb der von den Kontaktflächen ( 8 ) beanspruchten Grundfläche liegen. 24. The method according to any one of claims 13 to 23, characterized in that the ends of the conductor tracks (9) to clock terminals Kon (11) to be widened, which are within the of the contact surfaces (8) claimed base.
25. Kombinations-Chipmodul-Einheit, gekennzeichnet durch meh rere hintereinander angeordnete Kombinations-Chipmodule ( 1 ) nach einem der Ansprüche 1 bis 12 mit gemeinsamem, einstücki gem Träger ( 2 ). 25. Combination chip module unit, characterized by meh eral arranged one behind another combination chip modules (1) according to one of claims 1 to 12 with a common, einstücki gem support (2).
26. Verwendung der Kombinations-Chipmodule ( 1 ) nach einem der Ansprüche 1 bis 12 sowie der Kombinations-Chipmodul-Einheiten nach Anspruch 25 zur Herstellung von Chipkarten oder ähnli chen Datenträgern. 26. Use of the combination chip modules (1) according to any one of claims 1 to 12 as well as the combination chip module units according to claim 25 for producing chip cards or ähnli chen disks.
27. Chipkarte, gekennzeichnet durch mindestens ein Kombinati ons-Chipmodul ( 1 ) nach einem der Ansprüche 1 bis 12 oder min destens eine Kombinations-Chipmodul-Einheit nach Anspruch 25. 27. Chip card, characterized by at least a combination Nati ons-chip module (1) according to any one of claims 1 to 12 or a combination least min-chip module assembly according to claim 25th
DE1996132115 1996-08-08 1996-08-08 Combination chip module for smart cards allowing both contacting- and contactless communication with external data station Expired - Fee Related DE19632115C1 (en)

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US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
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US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
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