DE4337513C2 - Arrangement for heating a bond point in gold wire thermosonic wire bonding - Google Patents

Arrangement for heating a bond point in gold wire thermosonic wire bonding

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Publication number
DE4337513C2
DE4337513C2 DE4337513A DE4337513A DE4337513C2 DE 4337513 C2 DE4337513 C2 DE 4337513C2 DE 4337513 A DE4337513 A DE 4337513A DE 4337513 A DE4337513 A DE 4337513A DE 4337513 C2 DE4337513 C2 DE 4337513C2
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Germany
Prior art keywords
arrangement
bond
bonding
heating
wire
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Expired - Fee Related
Application number
DE4337513A
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German (de)
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DE4337513A1 (en
Inventor
Ralph Dipl Ing Binner
Robert Dipl Ing Hagen
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Siemens AG
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Siemens AG
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Priority to DE4337513A priority Critical patent/DE4337513C2/en
Publication of DE4337513A1 publication Critical patent/DE4337513A1/en
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Publication of DE4337513C2 publication Critical patent/DE4337513C2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/7865—Means for transporting the components to be connected
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    • H01L2224/8521—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/85214—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
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    • H01L2924/01079—Gold [Au]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Optical Couplings Of Light Guides (AREA)

Description

Die Erfindung betrifft eine Anordnung zum Erwärmen einer Bondstelle beim Golddraht-Thermosonic-Wirebonden mittels ei­ nes von einem Laser stammenden, über einen flexibel ausgebil­ deten Lichtwellenleiter und eine Fokussieroptik geführten La­ serstrahls.The invention relates to an arrangement for heating a Bonding point in gold wire thermosonic wire bonding using an egg nes from a laser, via a flexibly trained optical fiber and a focusing optics guided La serstrahls.

Eine solche Anordnung ist aus der DD 249 570 A1 bekannt. Um bei dieser bekannten Anordnung den Laserstrahl auf verschie­ dene Bondstellen fokussieren zu können ist dort jedoch eine aufwendige elektromechanische Steuerung vorgesehen.Such an arrangement is known from DD 249 570 A1. Around in this known arrangement, the laser beam on different However, being able to focus their bond points is one elaborate electromechanical control provided.

Die US 5,194,710 offenbart eine Anordnung zum Laser-Bonden bei integrierten Schaltkreisen mit einem modifizierten Stan­ dard-Bondgerät. Bei dieser Anordnung wird jedoch die Energie zum Verschweißen der zu verbindenden Teile ausschließlich durch den Laser geliefert.US 5,194,710 discloses an arrangement for laser bonding for integrated circuits with a modified Stan dard bond device. With this arrangement, however, the energy for welding the parts to be connected exclusively delivered by the laser.

Die DE 41 05 875 C1 beschreibt eine Einrichtung zum Laserlö­ ten von Feinkontakten vorbeloteter mikroelektronischer Bau­ elemente mittels eines Laser-Bestückungskopfes, der programm- und rechnergesteuert von einem Vier- oder Sechsachsenroboter oder XY-Tisch getragen und geführt wird.DE 41 05 875 C1 describes a device for laser solving Micro contacts of pre-soldered microelectronic construction elements by means of a laser assembly head, the program and computer controlled by a four or six axis robot or XY table is carried and guided.

Zur Ausführung der elektrisch leitfähigen Verbindungen von einem Chip zu einem Systemträger wird in der Halbleiter­ montage überwiegend das Wirebonden eingesetzt. Im wesent­ lichen unterscheidet man zwei grundsätzliche Verfahren, das Aluminiumdraht-Ultraschall-Wedge-Wedge-Bondverfahren und das Golddraht-Thermosonic-Nailhead-Wedge-Bondverfahren, das im folgenden Thermosonic-Bondverfahren genannt wird. Das domi­ nierende Verfahren mit einem Anteil von etwa 80% ist dabei das Thermosonic-Bondverfahren mit Reinstgolddraht. Die Gründe dafür liegen vor allem in der höheren Kontaktiergeschwindig­ keit und in der höheren Verfahrenszuverlässigkeit gegenüber dem Aluminiumdraht-Ultraschall-Wedge-Wedge-Bondverfahren.To make the electrically conductive connections from a chip becomes a leadframe in the semiconductor assembly mainly used wire bonding. In essence There are two basic procedures, the Aluminum wire ultrasonic wedge-wedge bonding process and that Gold wire thermosonic nailhead wedge bonding process, which in the following thermosonic bonding process is called. The domi ning process with a share of about 80%  the thermosonic bonding process with pure gold wire. The reasons this is mainly due to the higher contact speed speed and in the higher process reliability the aluminum wire ultrasonic wedge-wedge bonding process.

Beim Thermosonic-Bondverfahren wird unter Einbringung eines definierten Energiebetrages an einer Bondstelle eine Mikro­ verschweißung erreicht. Die Verschweißung der Verbin­ dungspartner erfolgt dabei unterhalb des Schmelzpunktes der beteiligten Metalle. Die benötigte Energie wird in drei Kom­ ponenten zugeführt, der Bondkraft, der Ultraschallenergie und der Temperatur. Die Temperatur wird durch Erwärmung des Substrates von unten zugeführt. Die einzelnen Komponenten lassen sich in relativ engen Grenzen gegeneinander substituieren. Die wichtigste und effektiv­ ste Komponente ist aber die Temperatur. Durch hohe Bond­ temperaturen können Schwankungen der anderen Bondtempera­ turen, schlechte Maschineneinstellungen und mangelnde Qua­ lität der Fügepartner größtenteils überspielt werden. Der Prozeß ist dabei sehr sensibel bezüglich einer Senkung der Bondtemperatur, was sich durch Qualitäts- und Zuver­ lässigkeitseinbußen äußert.In the thermosonic bonding process, a defined amount of energy at a bond point a micro welding reached. The welding of the connector partner takes place below the melting point of the involved metals. The energy required is in three com components supplied, the bonding force, the ultrasonic energy and the temperature. The temperature is increased by heating the Substrate fed from below. The  individual components can be within relatively narrow limits substitute against each other. The most important and effective The most important component is the temperature. Through high bond Temperatures can fluctuate in other bond temperatures doors, poor machine settings and a lack of quality the majority of the joining partners. Of the The process is very sensitive to a reduction the bond temperature, which is reflected in quality and reliability loss of casualness.

Bei der herkömmlichen Chipmontage stellt die Temperaturbe­ lastung durch das Wirebonden weder für den meist durch eine Metallegierung gegebenen Systemträger, noch für den Chip, noch für die verwendeten Kleber ein Problem dar. Die Einführung neuer innovativer Aufbautechniken, bei denen temperaturempfindliche Materialien Verwendung finden, wie z. B. Die-Bondfolien beim Lead-on-Chip (LOC)-Die-Bonden oder Substratmaterialien bei Chip-on-Bord- und Smart-Card- Anwendungen, sind die bisher üblichen Verfahrenstemperatu­ ren von 240°C bis 270°C nicht mehr erlaubt. Erlaubt sind lediglich Temperaturen bis zu 170°C. Das hat die bereits erwähnten Zuverlässigkeits- und Qualitätseinbußen zur Folge.In conventional chip assembly, the temperature is load by wirebonding neither for the most part a metal alloy system carrier, still for the Chip, still a problem for the glue used Introduction of new innovative construction techniques in which temperature sensitive materials are used, such as e.g. B. Die-Bond foils for Lead-on-Chip (LOC) -Die bonding or substrate materials for chip-on-board and smart card Applications are the usual process temperatures ren from 240 ° C to 270 ° C no longer allowed. Allowed are only temperatures up to 170 ° C. It already has mentioned reliability and quality losses Episode.

Die Aufgabe vorliegender Erfindung ist es also, eine Anordnung zum Erwärmen einer Bondstelle beim Golddraht-Ther­ mosonic-Wirebonden anzugeben, die einerseits den nöti­ gen Energiebetrag zur Verfügung stellt, ohne die tempera­ turempfindlichen Materialien zu beschädigen oder zu zer­ stören und andererseits die erwähnten Zuverlässigkeits- und Qualitätseinbußen nicht zur Folge hat.The object of the present invention is therefore a Arrangement for heating a bond at the gold wire therm to specify mosonic wire bonds, which on the one hand provide the necessary provides the amount of energy without the tempera damaging or destroying sensitive materials disrupt and on the other hand the reliability and Does not result in loss of quality.

Die Aufgabe wird gelöst durch eine Anordnung zum Erwärmen einer Bondstelle beim Golddraht-Thermosonic-Wirebonden mittels eines von einem Laser stammenden, über einen flexibel ausgebildeten Lichtwellenleiter und eine Fokussieroptik geführten Laserstrahls, wobei die Fokussieroptik an dem eine Kapillare aufweisenden Bondkopfes eines Standerd-Bondgerätes angeordnet ist. Besonders vorteilhaft ist es, wenn der Laserstrahl an der Bondstelle einen Durchmesser von etwa 100 µm aufweist.The object is achieved by an arrangement for heating a bond point in gold wire thermosonic wire bonding  by means of one coming from a laser, one flexible trained optical fibers and a focusing optics guided laser beam, the focusing optics on the a bond head having a capillary of a standing bond device is arranged. It is particularly advantageous if the laser beam has a diameter at the bond site of about 100 microns.

Ein besonderer Vorteil der erfindungsgemäßen Anordnung ist die Verwendung eines Standard-Bondgeräts mit einem her­ kömmlichen Bondkopf, so daß keine Modifikationen eines solchen Bondgeräts erforderlich sind. Außerdem kann eine herkömmliche Kapillare verwendet werden, da die Führung des Laserstrahls nicht durch die Kapillare, sondern von der Seite her erfolgt.A particular advantage of the arrangement according to the invention is the use of a standard bond device with one conventional bond head, so that no modifications of a such bonding devices are required. In addition, a conventional capillaries can be used because the guide of the laser beam not through the capillary but from from the side.

Ein weiterer Vorteil besteht darin, daß die Führung des Laserstrahls durch den Bondkopf erfolgt und dadurch auf einen zusätzlichen x-y-Tisch mit Antrieb verzichtet werden kann. Außerdem erfolgt bei der erfindungsgemäßen Anordnung keine Beeinträchtigung durch Bedämpfung der mit Ultra­ schallfrequenz schwingenden Kapillare, da der Laserstrahl über einen Lichtwellenleiter berührungslos zugeführt wird.Another advantage is that the management of the Laser beam occurs through the bondhead and thereby on an additional x-y table with drive can be dispensed with can. In addition, in the arrangement according to the invention no impairment due to damping with Ultra sound frequency vibrating capillary because of the laser beam is supplied without contact via an optical fiber.

Die Erfindung wird nachfolgend anhand eines Ausführungs­ beispiels mit Hilfe einer Fig. näher erläutert. Dabei zeigt:The invention is explained in more detail below using an exemplary embodiment with the aid of a FIG . It shows:

Fig. 1 ein Standard-Bondgerät mit einem Standard-Bond­ kopf und einer daran befestigten Fokussieroptik, die über einen Lichtwellenleiter mit einem Laser verbindbar ist. Fig. 1 shows a standard bond device with a standard bond head and attached focusing optics, which can be connected to a laser via an optical fiber.

Fig. 1 zeigt ein Standard-Bondgerät 1 mit in x- und y-Richtung beweglichem Bondkopf. An dem Bondkopf 2 ist eine Kapillare 3 angeordnet, durch die ein Golddraht zur Bond­ stelle 4 geführt wird. An dem Bondkopf 2 ist eine Fokus­ sieroptik 5 angeordnet. Die Fokussieroptik 5 ist über eine hochflexiblen Lichtwellenleiter 6 mit einem nicht darge­ stellten herkömmlichen Laser verbindbar. Ein Laserstrahl 7 wird durch die Fokussieroptik 5 auf die Bondstelle gerich­ tet. Die Fokussieroptik 5 und der Lichtwellenleiter 6 müs­ sen leichtgewichtig ausgeführt sein, damit die eingestell­ ten dynamischen Eigenschaften des Bondkopfes 2 nicht beeinträchtigt werden. Die zeitliche Steuerung der Laser­ impulse kann durch ein Triggersignal, das an dem Bondgerät abgegriffen wird, vorgenommen werden. Fig. 1 shows a standard bonding apparatus 1 in the x- and y-direction moving bonding head. On the bond head 2 , a capillary 3 is arranged through which a gold wire to the bond point 4 is guided. A focusing optical system 5 is arranged on the bonding head 2 . The focusing optics 5 can be connected via a highly flexible optical waveguide 6 to a conventional laser, not shown. A laser beam 7 is tet by the focusing optics 5 on the bond point. The focusing optics 5 and the optical waveguide 6 must be lightweight, so that the set dynamic properties of the bonding head 2 are not impaired. The timing of the laser pulses can be carried out by a trigger signal that is tapped at the bonding device.

Claims (2)

1. Anordnung zum Erwärmen einer Bondstelle (4) beim Gold­ draht-Thermosonic-Wirebonden mittels eines von einem Laser stammenden, über einen flexibel ausgebildeten Lichtwellenleiter (6) und eine Fokussieroptik (5) geführten Laserstrahls (7), dadurch gekennzeichnet, daß die Fokussieroptik (5) an dem herkömmlichen, eine herkömmliche Kapillare (3) aufweisenden Bondkopf (2) eines Standard-Bondgeräts (1) angeordnet ist. 1. An arrangement for heating a bond point ( 4 ) in gold wire thermosonic wire bonding by means of a laser beam ( 6 ) and a focusing optics ( 5 ) and a focusing optics ( 5 ) guided laser beam ( 7 ), characterized in that the focusing optics ( 5 ) on the conventional, conventional capillary ( 3 ) having bond head ( 2 ) of a standard bonding device ( 1 ) is arranged. 2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß der Laserstrahl (7) an der Bondstelle (4) einen Durchmes­ ser von etwa 100 µm aufweist.2. Arrangement according to claim 1, characterized in that the laser beam ( 7 ) at the bond point ( 4 ) has a diameter of about 100 microns water.
DE4337513A 1993-11-03 1993-11-03 Arrangement for heating a bond point in gold wire thermosonic wire bonding Expired - Fee Related DE4337513C2 (en)

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DE10205609A1 (en) * 2002-02-11 2003-08-28 Infineon Technologies Ag Arrangement for wire bonding and method for producing a bond connection

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DE19814118A1 (en) * 1998-03-30 1999-10-14 F&K Delvotec Bondtechnik Gmbh Device for thermocompression bonding, and thermocompression bonding
DE10205609A1 (en) * 2002-02-11 2003-08-28 Infineon Technologies Ag Arrangement for wire bonding and method for producing a bond connection

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