DE4232396A1 - Modular computer system in 3=dimensional SMD technology - contains parts formed on IC connector with two or more carrier boards connected by common edge boards. - Google Patents

Modular computer system in 3=dimensional SMD technology - contains parts formed on IC connector with two or more carrier boards connected by common edge boards.

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Publication number
DE4232396A1
DE4232396A1 DE19924232396 DE4232396A DE4232396A1 DE 4232396 A1 DE4232396 A1 DE 4232396A1 DE 19924232396 DE19924232396 DE 19924232396 DE 4232396 A DE4232396 A DE 4232396A DE 4232396 A1 DE4232396 A1 DE 4232396A1
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Germany
Prior art keywords
computer system
boards
connector
dimensional
common edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19924232396
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German (de)
Inventor
Friedrich Lauter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
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Application filed by Individual filed Critical Individual
Priority to DE19924232396 priority Critical patent/DE4232396A1/en
Publication of DE4232396A1 publication Critical patent/DE4232396A1/en
Withdrawn legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185Mounting of expansion boards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184Mounting of motherboards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/409Mechanical coupling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards

Abstract

The computer system is formed on an IC plug connector with 2 or more carrier boards arranged one above the other with edges connected by common edge boards. The central unit (1), power supply (2) and peripherals (3), e.g. external mass storage are designed to enable a standard, spatially dense computer system without further electronic components. ADVANTAGE - System dimensions are minimised for implementation of medium to small applications, and reliability is increased.

Description

Die Erfindung betrifft ein Rechnersystem, bestehend aus steckbaren Baugruppen, welche in einer 3dimensionalen SMD- Technik angefertigt sind und einen besonders kompakten Auf­ bau ermöglichen.The invention relates to a computer system consisting of plug-in modules, which are in a three-dimensional SMD Technology are made and a particularly compact on enable construction.

Nach dem derzeitigen Stand der Technik endet die Miniaturi­ sierung von universell verwendbaren Rechnersystemen bei Einplatinencomputern etwa in Scheckkartengröße, wobei für die jeweilige Anwendung eine zusätzliche Platine aufgebaut werden muß, die die weiteren Baugruppen, wie Stromversor­ gung, externer Massenspeicher und Anschlüsse für Randein­ heiten (Tastatur, Drucker etc.) aufnehmen.According to the current state of the art, miniatures end sation of universally usable computer systems Single board computers about the size of a credit card, whereby for the respective application built an additional circuit board must be the other assemblies, such as electricity supplier supply, external mass storage and connections for edge entry units (keyboard, printer, etc.).

Es wird gemäß Abb. 1 vorgeschlagen, auf dieser anwendungsspezifischen Platine die bei jedem Rechnersystem erforderlichen Einheiten, wie Zentraleinheit (1), Stromver­ sorgung (2) und externer Massenspeicher (3) etc. in stan­ dardisierter Form steckbar aufzusetzen.It is proposed according to Fig. 1, on this application-specific board, the units required for each computer system, such as central unit ( 1 ), power supply ( 2 ) and external mass storage device ( 3 ) etc. to be plugged in in a standardized form.

Die hierzu angewendete 3dimensionale SMD-Bauweise ist in Abb. 1 ebenfalls angegeben: Die Schaltung einer Baugruppe wird "stockwerkweise" aufgeteilt und an der "Außenwand" über eine Randplatine mit einander verbunden.The three-dimensional SMD design used for this is also shown in Fig. 1: The circuitry of a module is divided "by storey" and connected to one another on the "outer wall" via an edge board.

Die Randplatine trägt im einfachsten Fall parallele Leitun­ gen, welche über Lötung mit dem entsprechenden Randkontakt der einzelnen Trägerplatinen verbunden sind. Die Leitungen oder Randplatine können im übrigen auch mit einfachem Layout zum Beispiel zur versetzten Verbindung oder Durchkontaktie­ rung innerhalb derselben Seite oder auch über Eck variiert werden. Die unterste Ebene enthält im allgemeinen den Stec­ ker, die oberste Ebene eventuell weitere Steckverbindungen.In the simplest case, the edge board carries parallel lines gene, which via soldering with the corresponding edge contact of the individual carrier boards are connected. The lines or edge board can also have a simple layout for example for a staggered connection or via Varying within the same side or even corner will. The lowest level generally contains the Stec ker, the top level possibly further plug connections.

Abb. 5 zeigt die Anordnung von Lötanschlüssen (34) und ein Seitenteil der Randplatine (36) in Abwicklung, sowie die Lötkante (37) an der die Randplatine zusammengelötet ist und die Verbindungsleitungen (38), die die einzelnen "Stockwerke" des Bauteils verbinden. Der Aufbau wird er­ leichtert durch eine Markierungsecke (35) der Trägerpla­ tine, die der Lötkante der Randplatine korrespondiert, und Fixierungslöcher (39), die bei der Montage stecknadelgroße Stifte aufnehmen können, um die Lage der Trägerplatinen beim Löten zu fixieren. Fig. 5 shows the arrangement of solder connections ( 34 ) and a side part of the edge board ( 36 ) in development, as well as the soldering edge ( 37 ) on which the edge board is soldered together and the connecting lines ( 38 ) that connect the individual "floors" of the component . The structure is facilitated by a marking corner ( 35 ) of the carrier board, which corresponds to the soldering edge of the edge board, and fixing holes ( 39 ), which can accommodate pin-sized pins during assembly, to fix the position of the carrier boards during soldering.

Beim Layout der Baugruppe ist festzulegen, welche Seite der Trägerplatine die Lötanschlüsse (34) aufnehmen soll, d. h. von welcher Seite aus die Verbindung zwischen Trägerplatine und Randplatine durch Löten hergestellt werden soll. Die Außenseite der Randplatine kann zur Abschirmung der Bau­ gruppe dienen.When laying out the assembly, it must be determined which side of the carrier board is to accommodate the solder connections ( 34 ), ie from which side the connection between the carrier board and the edge board is to be made by soldering. The outside of the edge board can serve to shield the construction group.

Die Baugruppen (1), (2), (3) des Rechnersystems sind elek­ trisch und dimensionsmäßig so auf einander abgestimmt, daß ohne "Verschnitt" durch zusätzliche Bauteile oder räumliche Lücken ein breites Spektrum an mittleren und kleinen Anwen­ dungen mit minimalem Platzbedarf auf einer Grundplatine re­ alisiert werden kann.The assemblies ( 1 ), ( 2 ), ( 3 ) of the computer system are elec trically and dimensionally matched to one another so that a "wide range" of medium and small applications with minimal space requirements on one without "waste" due to additional components or spatial gaps Motherboard can be realized.

Für die Zentraleinheit (1) bedeutet dies: Der Mikrocontrol­ er (4) ist mit der Dip-Swich-Leitung (5) verbunden, um dem Anwender die Möglichkeit einer Voreinstellung zu geben. Für Programm und Daten ist ein SRAM-Speicher (6) integriert, und die zeitliche Steuerung kann durch einen Ohrenbaustein (8) (mit Alarm-Zeitvorgabe) vorgenommen werden. Ein exter­ ner Portbaustein (7) stellt zusätzliche Ein-/Ausgabelei­ tungen zur Verfügung. Der Reset-Baustein (9) erzeugt beim Einschalten den Reset-Impuls.For the central unit ( 1 ), this means that the microcontroller ( 4 ) is connected to the dip-swich line ( 5 ) in order to give the user the option of presetting. An SRAM memory ( 6 ) is integrated for the program and data, and the timing can be controlled using an ear module ( 8 ) (with alarm time specification). An external port module ( 7 ) provides additional input / output lines. The reset module ( 9 ) generates the reset pulse when switched on.

Diesen Standard-Funktionen entsprechen die am Stecker herausgeführten Verbindungsleitungen (10) bis (17), nämlich die Portleitungen des Mikrocontrolers (10) und des externen Ports (11), der Stromversorgung (12), der Pufferspannung (14) für SRAM und Ohrenbaustein, sowie der Watchdog-Leitung (16) mit den zugehörigen Kontroll-Leitungen (13), (15) und (17), die Programmfunktionen bei Ausfall der Spannung bzw. manuellen Bedienung auslösen können: Die Portleitungen (10) und (11) können direkt anwendungsspezifische Steuerungen vornehmen, während die Leitungen (12) bis (17) ebenfalls direkt mit dem Stromversorgungs-Baustein verbunden werden.The connecting lines ( 10 ) to ( 17 ) on the plug correspond to these standard functions, namely the port lines of the microcontroller ( 10 ) and the external port ( 11 ), the power supply ( 12 ), the buffer voltage ( 14 ) for SRAM and ear module, as well as the watchdog line ( 16 ) with the associated control lines ( 13 ), ( 15 ) and ( 17 ), which can trigger program functions in the event of a power failure or manual operation: The port lines ( 10 ) and ( 11 ) can directly Make application-specific controls while the lines ( 12 ) to ( 17 ) are also connected directly to the power supply module.

Das Betriebssystem zur Steuerung der Ein-/Ausgabeeinheiten (5) bis (9) wird im EPROM des Controlers mitgeliefert. Es unterstützt auch die Übertragung von Programm und Daten zwischen einem Personalcomputer und dem Computersystem, welches vom Personalcomputer aus aufgerufen werden kann, wenn beim Einschalten die Verbindung zwischen Personalcom­ puter und Computersystem besteht (master-slave beziehungs­ weise boot-Funktion).The operating system for controlling the input / output units ( 5 ) to ( 9 ) is included in the EPROM of the controller. It also supports the transfer of program and data between a personal computer and the computer system, which can be called up from the personal computer if the connection between the personal computer and the computer system exists when the computer is switched on (master-slave or boot function).

Im master-slave-Modus können mehrere Computersysteme an ei­ ner Leitung anhand der binären Codierung (5) programmtech­ nisch unterschieden werden. Vergleiche Abb. 6 (dezentrale Abfrage und Verbuchung mit einem Personalcomputer). In master-slave mode, several computer systems on one line can be differentiated in terms of program technology using the binary coding ( 5 ). Compare Fig. 6 (decentralized query and posting with a personal computer).

Der Stromversorgungs-Baustein (2) faßt lt. Abb. 3 verschie­ dene Bauelemente schaltungsmäßig zusammen, nämlichThe power supply module ( 2 ) summarizes according to Fig. 3 various components in terms of circuitry, namely

  • - (18) Laden des Pufferakkus durch den Netzadapter schnell beziehungsweise dauernd (Umschalten nach zum Beispiel 20 min. seit dem Anschalten des Adapters)- ( 18 ) Charging the buffer battery through the mains adapter quickly or continuously (switching after, for example, 20 minutes since switching on the adapter)
  • - (19) Überwachung der Spannung von Pufferakku und Puffer­ batterie- ( 19 ) Monitoring the voltage of the backup battery and backup battery
  • - (20) auswechselbare Pufferbatterie mit elektronischer Umschaltung der Spannungsversorgung der statischen Speicher von SRAM (6) und Ohrenbaustein (8)- ( 20 ) exchangeable buffer battery with electronic switching of the voltage supply of the static memory of SRAM ( 6 ) and ear module ( 8 )
  • - (21) Wachtdog-Funktion mit variabler Zeitüberwachung hinsichtlich der Steuerleitung (16)- ( 21 ) watchdog function with variable time monitoring with regard to the control line ( 16 )

wobei die oben beschriebenen Verbindungen zur Zentralein­ heit am Stecker herausgeführt werden zusammen mit dem An­ schluß des Netzadapters, welcher den für das Laden des Ak­ kus (und den eventuellen Pufferbetrieb) erforderlichen Gleichstrom liefert.the connections to the center described above unit on the connector together with the on conclusion of the power adapter, which is used for loading the Ak kus (and the possible buffer operation) required DC supplies.

Der externe Massenspeicher (3) ist lt. Abb. 4 alternativ zu den bekannten RAM-Karten ebenfalls in der 3dimensionalen SMD-Technik aufgebaut. Statt einer besonderen Steckertech­ nik und Bauform hat auch dieses Bauteil denselben Aufbau wie die Zentraleinheit (1) und die Stromversorgung (3).According to Fig. 4, the external mass storage device ( 3 ) is also constructed in 3 -dimensional SMD technology as an alternative to the known RAM cards. Instead of a special connector technology and design, this component also has the same structure as the central unit ( 1 ) and the power supply ( 3 ).

Zusätzlich zu den Bauelementen der bekannten Speichermo­ dulen, wie Adreßdecoder (23) und Speicherchips (25) ist ein sonst gesondert zu schaltender Demultiplexer (24) inte­ griert.In addition to the components of the known memory modules, such as address decoder ( 23 ) and memory chips ( 25 ), an otherwise separately switchable demultiplexer ( 24 ) is integrated.

Verbindungsleitungen (28) bis (32) können direkt mit den Portleitungen (10) und (11) der Zentraleinheit zusam­ mengeschaltet werden, wobei die high-bit-Leitung select 1/2 (32) das direkte Zusammenschalten mit weiteren Massenspei­ chern derselben Bauform möglich macht.Connection lines ( 28 ) to ( 32 ) can be connected directly to the port lines ( 10 ) and ( 11 ) of the central unit, whereby the high-bit line select 1/2 ( 32 ) enables direct connection to other mass storage devices of the same design makes.

Die Erfindung reduziert den konstruktiven und räumlichen Aufwand für die Realisierung mittlerer und kleiner Anwen­ dungen auf ein Minimum und erhöht dadurch gleichzeitig die Betriebssicherheit. Sie ermöglicht Lösungen, für die sonst fest verdrahtete Schaltungen erforderlich sind, beziehungs­ weise derzeit nur der Personalcomputer in Frage kommt.The invention reduces the constructive and spatial Effort for the realization of medium and small users to a minimum and at the same time increases the Operational safety. It enables solutions for otherwise Hardwired circuits are required currently only the personal computer comes into question.

BezugszeichenlisteReference list

 1 Zentraleinheit
 2 Stromversorgung
 3 Randeinheiten, Beispiel: externer Massenspeicher SRAM
 4 Mikrocontroler mit EPROM/OTP
 5 Dip-Switch-Anschluß
 6 SRAM-Speicher
 7 Port-Baustein
 8 RTC Uhrenbaustein
 9 Reset-Baustein
10 interne Ports der CPU (4)
11 externe Ports aus (7)
12 Stromversorgung
13 Kontroll-Leitung dazu
14 Pufferspannung
15 Kontroll-Leitung dazu
16 Watchdog-Leitung
17 Kontroll-Leitung dazu
18 Laden schnell/dauernd
19 überwachen Akku/Pufferbatterie
20 Pufferbatterie mit Umschalter
21 Watchdof-Funktion
22 Netz-Adapter
23 Adreßdecoder
24 Demultiplexer
25 RAM-Chips
26 Adressen/Daten
27 Adressen/high
28 Taktleitung
29 Chip enable
30 output enable
31 write enable
32 select 1/2
33 Trägerplatine (Lötseite)
34 Lötanschlüsse
35 Markierung
36 Seitenteil (Abwicklung)
37 Lötkante
38 Verbindungsleitungen
39 Fixierungslöcher
40 Personalcomputer (master)
41 Rechnersystem (slave) mit Adressierung über Dip-Switch und Anzeige-Display, sowie Abfrage-Tasten (Beispiel)
1 central unit
2 power supply
3 edge units, example: external mass storage SRAM
4 microcontrollers with EPROM / OTP
5 dip-switch connector
6 SRAM memories
7 port module
8 RTC clock module
9 Reset module
10 internal ports of the CPU ( 4 )
11 external ports off ( 7 )
12 Power supply
13 control line
14 buffer voltage
15 control line
16 Watchdog line
17 control line
18 Fast / permanent loading
19 monitor battery / backup battery
20 backup battery with switch
21 Watchdof function
22 power adapter
23 address decoder
24 demultiplexers
25 RAM chips
26 addresses / dates
27 addresses / high
28 clock line
29 Chip enable
30 output enable
31 write enable
32 select 1/2
33 carrier board (solder side)
34 solder connections
35 mark
36 side part (processing)
37 soldering edge
38 connecting lines
39 fixation holes
40 personal computers (master)
41 Computer system (slave) with addressing via dip switch and display, as well as query buttons (example)

Claims (2)

1. Rechnersystem und Teile desselben, dadurch gekennzeichnet,
- daß dieselben auf einer IC-Steckverbindung in einer 3dimensionalen SMD-Technik mit 2 oder mehr übereinander liegenden Trägerplatinen und gemeinsamer die Ränder verbin­ dender Randplatine aufgebaut sind.
1. computer system and parts thereof, characterized in that
- That the same are built on an IC connector in a three-dimensional SMD technology with 2 or more superimposed carrier boards and common edges connecting the edge board.
2. Rechnersystem und Teile desselben dadurch gekennzeichnet,
- daß die Baugruppen Zentraleinheit, Stromversorgung und Randeinheiten, wie externer Massenspeicher, so abgestimmt sind, daß der Aufbau eines Rechnersystems standardmäßig ohne weitere elektronische Bauelemente und in räumlich dichter Anordnung möglich ist.
2. Computer system and parts thereof characterized,
- That the modules central unit, power supply and peripheral units, such as external mass storage, are coordinated so that the construction of a computer system is possible as a standard without further electronic components and in a spatially dense arrangement.
DE19924232396 1992-09-26 1992-09-26 Modular computer system in 3=dimensional SMD technology - contains parts formed on IC connector with two or more carrier boards connected by common edge boards. Withdrawn DE4232396A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19924232396 DE4232396A1 (en) 1992-09-26 1992-09-26 Modular computer system in 3=dimensional SMD technology - contains parts formed on IC connector with two or more carrier boards connected by common edge boards.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924232396 DE4232396A1 (en) 1992-09-26 1992-09-26 Modular computer system in 3=dimensional SMD technology - contains parts formed on IC connector with two or more carrier boards connected by common edge boards.

Publications (1)

Publication Number Publication Date
DE4232396A1 true DE4232396A1 (en) 1993-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE19924232396 Withdrawn DE4232396A1 (en) 1992-09-26 1992-09-26 Modular computer system in 3=dimensional SMD technology - contains parts formed on IC connector with two or more carrier boards connected by common edge boards.

Country Status (1)

Country Link
DE (1) DE4232396A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016112885A1 (en) * 2015-01-14 2016-07-21 Harting It Software Development Gmbh & Co. Kg Electronic device, and methods for the production and use thereof

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EP0213205A1 (en) * 1984-12-28 1987-03-11 Micro Co., Ltd. Method of stacking printed circuit boards
DE3614689A1 (en) * 1986-04-30 1987-11-05 Siemens Ag Arrangement of electrical assemblies of different formats
DE3703364A1 (en) * 1987-02-04 1988-08-18 Atron Electronic Gmbh Arrangement of a printed circuit board fitting
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DE3821104A1 (en) * 1987-06-23 1989-01-05 Burr Brown Ltd TOPOGRAPHY OF A PRINTED CIRCUIT BOARD FOR INTELLIGENT HIGH-SPEED INDUSTRIAL CONTROL
DE3813396A1 (en) * 1988-04-21 1989-11-02 Bosch Gmbh Robert Housing for electronic apparatuses
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2037385A1 (en) * 1970-07-28 1972-02-03 North American Rockwell Electronic assembly
DE2947793A1 (en) * 1979-11-28 1981-07-23 Klaus Prof. Dr. 2863 Ritterhuda Haefner Modular hand-held micro-computer system - has miniature capsules containing electronic equipment e.g. tape recorder or printer
EP0213205A1 (en) * 1984-12-28 1987-03-11 Micro Co., Ltd. Method of stacking printed circuit boards
DE3614689A1 (en) * 1986-04-30 1987-11-05 Siemens Ag Arrangement of electrical assemblies of different formats
DE3703364A1 (en) * 1987-02-04 1988-08-18 Atron Electronic Gmbh Arrangement of a printed circuit board fitting
DE3735455A1 (en) * 1987-03-18 1988-09-29 Telefonbau & Normalzeit Gmbh ELECTRICAL COMPONENTS
DE3821104A1 (en) * 1987-06-23 1989-01-05 Burr Brown Ltd TOPOGRAPHY OF A PRINTED CIRCUIT BOARD FOR INTELLIGENT HIGH-SPEED INDUSTRIAL CONTROL
DE3813396A1 (en) * 1988-04-21 1989-11-02 Bosch Gmbh Robert Housing for electronic apparatuses
DE4108154A1 (en) * 1991-03-14 1992-09-17 Telefunken Electronic Gmbh ELECTRONIC ASSEMBLY AND METHOD FOR PRODUCING ELECTRONIC ASSEMBLIES

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016112885A1 (en) * 2015-01-14 2016-07-21 Harting It Software Development Gmbh & Co. Kg Electronic device, and methods for the production and use thereof

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