DE4230808A1 - SYSTEM FOR HANDLING AND PROCESSING A SUBSTRATE - Google Patents

Description

The invention relates to handling and Processing of thin substrates, e.g. carriers for magnetic disks or floppy disks. In particular relates the invention relates to an improved system for simultaneous processing of vertically aligned, disc-like substrates in succession in each case one of several processing stations.

It has become increasingly important to be thin Workpieces, for example carriers for magnetic disks, from a cassette into a vacuum processing system, through through and out of this back into a cassette transport. An exemplary system is in US-PS 49 81 408. This system includes a plurality of Substrate processing stations that accommodate two vertically aligned workpieces are designed and a Transport system include two simultaneously Workpieces from an entrance-side load lock sequentially through the multitude of processing stations an outlet-side load lock moves.

This system is available from Intevac, Inc., Santa Clara, California, commercially available device available. The market continuously demands higher output than at the moment available equipment, and workpieces smaller diameter should be able to be processed. In this relationship is the need of the computer industry to Preservation of ever smaller subsystems known to everyone.

In US-PS 43 11 427 and 47 49 465 are discloses similar vacuum processing systems, wherein individual substrates in a common evacuated  Environment are processed. In the cited patents as in many coating systems, which one Use substrate transport system, the numerous fixed and moving parts of the transport system often at least partly unintentionally together with the substrate coated. The desquamation of deposited material from that Transport system, especially of its moving parts, leads to the generation of particles which are the substrates can be harmful. This leads to the need for frequent and sometimes extensive maintenance work on the mentioned substrate transport systems.

The throughput potential of existing systems and the disclosed invention is directly through the Processing and transport cycle time determined. A decrease the transfer time of a substrate from one Processing station to another leads to one similar decrease in the time required for the system for the complete processing of a substrate. The Throughput potential also depends on the transfer time individual substrates from and to the cargo locks impaired. This transfer time, what ventilation and Pumping out the cargo lock includes, limits Throughput potential. Also, the quick ventilation and that rough vacuum pumping, which is more individual for loading Substrates are required in a vacuum environment increased pollution with particles in the vicinity of the Disc.

Known systems make multiple movements and Substrate tampering required to transfer to execute one processing station to the next, whereby the transport cycle time is increased. The systems did furthermore individual insertion and removal of the substrate required, which reduces the throughput and the Particle distribution increases.  

Higher throughput systems as usual used in production environments Pass-through techniques, which ensure satisfactory throughput to care. However, the larger throughput due to the continuous engagements of rainfall sources achieved.

Furthermore, the coating quality is achieved sacrificed increased throughput. The coating quality is used in such systems as a result of substrate movement adversely affected during coating, and a Deposition rate changes with entry and exit of the substrate linked by the deposition zone while the Deposition sources are in operation.

An additional disadvantage of systems with higher Throughput is the removal of condensate from substrate holders and the release of absorbed water vapor from the condensate Substrate holders, which with the substrate or the carriers in enter and exit the system.

Accordingly, it is an object of the invention in using a substrate handling and processing system to create an excellent throughput potential.

Another object of the invention is therein, a system for serial processing of substrates to create that individually in a continuous manner a plurality of processing stations at the same time to be edited.

A related object of the invention is in creating a processing system more individual Substrates kept isolated from all other processes will.

Another object of the invention is in the creation of a cargo lock type system, which the transport of cartridges to and from a vacuum environment performs in which the loading and unloading of therein  contained individual substrates can be executed, while other substrates are being processed.

Another related goal is Creation of a system as before, which is for a slow Pumping rate at the load lock ensures that the Air turbulence and particle contamination inside the locks are reduced.

Another related goal is Creation of a system as before, which can automatic substrate handling from and in cassettes is compatible.

Another object of the invention is in the creation of a system for use in one Production line, taking reliability, Maintainability, ease of operation and Product quality should be improved.

The task set is due to the measures of claim 1 and solved by the further features of Subclaims designed and developed.

The handling and processing system disclosed substantially reduces or eliminates the disadvantages of the State of the art. The disclosed system maximizes that Throughput of single substrate handling device by the Number of required in previous systems Transport movements is significantly reduced. The system also improves the coating quality by Coating effects due to directed movements and Fluctuations in the rate of precipitation are avoided, and effectively prevents the formation of water vapor and the generation of chippings that conventional Substrate holders occur by these holders themselves be eliminated.

The system disclosed uses an input and exit-side load lock and a buffer chamber, wherein  Cassettes with vertically aligned supports or substrates introduced into the system and the carriers effectively from the Cassettes and transferred to the main vacuum chamber of the system can be while under vacuum and during other substrates are processed one after the other. The System uses a simple, three-stage transfer of Carriers or substrates from processing station too Processing station, which increases throughput, compared to previously known systems based on more complex Subtrate handling and transfer based, greatly enlarged becomes. The system disclosed includes a main vacuum chamber a plurality of adjacent to this Processing stations. The system also includes one Conveyor roller assembly for moving a plurality of cassettes, which vertically aligned supports or substrates with it to lead. The conveyor further includes one along its length Entrance load lock, a buffer chamber and one Exit loading lock. During transportation one Cassette along the conveyor, the cassette is first in the entrance load lock moves. The loading lock is then pumped out to create a vacuum environment. The The cassette is then moved from the entrance load lock into the Buffer chamber transferred, which is kept at high vacuum and communicates with the main vacuum chamber.

The disclosed system also includes a vertical one Transport system, which is arranged below the conveyor and go through the bottom surface of the cassettes can. The vertical transport system comprises a plurality of Lifting plunger to place individual substrates or supports in and to transport out of the cassettes and one Buffer chamber transfer position above the cassettes to feed in or out. The lifters are for close symmetrical grasping of an individual substrate the edge of half formed and hold the substrate  safe due to gravity, both Substrate surfaces are only negligibly shadowed or be covered.

The handling and processing system disclosed is also loaded with a new type of substrate and -Discharge device provided, which is a simple Single plane pivotal movement used. The Loading device is for gripping a single substrate trained and arranged if this in the Is transfer position, and transports the substrate to Main chamber transport device. The unloading device is for grasping an individual substrate Processing and transfer of the processed substrate to the transfer position within the buffer chamber trained and arranged, wherein the vertical Transport system takes the processed substrate and that The substrate is lowered into an exit cassette.

In the disclosed system, substrates of a cassette processed in a vacuum environment and retransfer, eliminating the need for loading and Discharge of individual substrates into the atmosphere is avoided. Accordingly, the throughput is significantly increased and the possibility of particle pollution far decreased.

The new transport structure with main chamber according to Invention is designed to grip the substrate and causes the transfer of the substrate from Processing station to processing station. The Transport device for the main chamber is both for angular indexing as well as for vertical displacement formed to simultaneously process a plurality of substrates Transfer processing station to processing station. During transport and processing, they are Substrates arranged in racks that are close to the circumference of the  Conveyor of the main chamber are located, and the substrates are processed from processing station to processing station a simple sequence of upward movement, indexing and Downward movement is transferred, being on the same The rack remains in the entire processing sequence.

Each of the frames is a sealing device assigned such that when the conveyor is the main chamber is in the up position, each Processing station is isolated from the others and the Cargo lock, the buffer chamber and the Processing stations isolated from the main vacuum chamber are. A rough pump vacuum is available to each of the cargo locks and processing stations are available, which as required or can be switched off. The different Processing stations are so different from each other during the Operating isolates, avoiding or avoiding cross contamination is at least greatly reduced. If the sponsor of the Main chamber in the lower position during times of Non-operation (or indexing) of the arrangement, accept the processing stations and the buffer chamber shared vacuum of the main chamber.

Additional advantages arise from the fact that the individual processing stations during their operation are isolated. Accidental coating of the conveyor of the Main chamber is limited to the racks. As a consequence of this is the generation of particles that make up the substrate contaminate, greatly reduced, which accordingly the Main chamber conveyor need maintenance decreased. Other advantages are that different spray gas pressures in each Spray process station can be used or that different gases to optimize each Process step can be used.

Further details of the invention with others  Advantages and features emerge from the following Description of exemplary embodiments and the drawings. It shows:

Fig. 1 shows a cross section through a cassette conveyor according to the invention,

Figs. 2A and 2B are cross sections through details of FIG. 1 showing the vertical transport of substrates in accordance with the invention,

Fig. 3 is a schematic plan view showing the transport system, which is used for transferring substrates in and out of the cassettes and to and from the main vacuum chamber in accordance with the invention,

Fig. 4 is a schematic cross section illustrating the transfer of an individual substrate from the vertical transport means to the charging means of the buffer chamber and the transport means of the main chamber, and

Fig. 5 is a schematic representation to illustrate the transport system of the main chamber according to the invention.

According to the invention, the disclosed reduces Substrate handling and processing system essentially the disadvantages of the prior art. According to the invention an entrance load lock, a buffer chamber and a Exit load lock provided to effectively cassettes to transfer to support vertically aligned substrates, namely when transporting in and out of the system, and one Arrangement with vertical transport and buffer chamber loading / discharge is to facilitate the transfer of Substrates from the cassettes and into the main vacuum chamber provided while other substrates in the majority of existing processing stations are processed. Another very important technical advantage of the Invention lies in the simple three-step process  Main chamber transport system, making individual Processing stations isolated, the throughput of the Systems significantly increased and the particle contamination in the be significantly reduced.

Fig. 1 is a simplified cross section of an embodiment of the invention for handling and processing a plurality of thin, vertically oriented substrates or carriers, which can be computer memory disks, or magnetic or optical disks. FIG. 1 provides an overview of the operations of handling and processing system. The description of the mechanics used to perform these operations is related to the following figures.

Fig. 1, the flow distribution of N substrates indicated by the horizontal conveyor system, where N is an integer greater than 1. The conveyor system 1 comprises a series of spaced-apart rollers 8 , the design, position and dimensions of which are intended to accommodate a plurality of cassettes 2 . The cassettes shown in positions C1 to C8 move along the conveyor system 1 , in which unprocessed carriers or substrates are unloaded and processed carriers are loaded as follows:
In the preferred embodiment of the invention, the driving force for moving the cartridges 2 is provided by a plurality of motors M1 to M8, and conventional gear arrangements are operatively connected to the roller sets R1 to R8 or other transport devices. For example, at the input of the conveyor system 1, the motors M1 and M2 synchronously drive the roller sets R1 and R2 and move an input cassette 2 , which is filled with unprocessed carriers or substrates, from the position C1 to the position C2.

The charge lock 3 on the inlet side is then slowly ventilated, ie brought to atmospheric pressure (for example less than 760 torr / minute) with an inert gas, for example nitrogen. The gate valve arrangement G1 is opened, thereby opening the entrance door of the load lock and thus allowing the input cassette 2 access to the input load lock 3 . Continuing this example, the motors M2 and M3 synchronously drive the roller sets R2 and R3, the cassette being moved from the position C2 to the position C3. The gate valve assembly G1 is then closed, closing the load lock door so that it seals against the frame of the load lock and forms a sealed load lock chamber. The input charge lock 3 is then slowly, ie less than 760 torr / minute, roughly pumped out via a conventional vacuum pump, not shown, and then to a very low vacuum, ie 10 ^-6 torr, via the gate valve arrangement G2 and a conventional high-vacuum pump (cyropump) P1 pumped out.

The gate valve arrangement G3 is opened, whereby a common gate arrangement, not shown, between the input charge lock 3 and the buffer chamber 4 opens and allows the cassette 2 to enter the buffer chamber 4 . The buffer chamber 4 is in selective communication with the main vacuum chamber 6 of the system (namely when the transport arrangement 31 of the main chamber is in the lowered position, as will be described in detail below) and is under continuously high pressure due to the gate valve arrangement G4 and the high vacuum cyropump P2 . Since a vacuum environment has been achieved in the load lock 3 , the opening of the common gate does not lead to a noticeable disturbance of the environmental conditions in the buffer chamber 4 or in the main vacuum chamber 6 . Furthermore, the creation of the vacuum environment is accomplished in the entry load lock 3 in a relatively short time because the load lock 3 compared to the main vacuum chamber 6 of small volume. The system cycle and processing time are therefore greatly reduced compared to previously known systems, which significantly increases the output.

Continuing with this example, the motors M3 and M4 then drive the roller sets R3 and R4 synchronously and move the cassette from the position C3 to the position C4 in the buffer chamber 4 .

For example, to position a carrier or substrate for transport into the system, motor M4 drives roller set R4 to advance the cassette by one slot width in position C4, thereby aligning the first substrate to be processed above the path of the web Input lifting plunger 11 of the vertical transport system 10 comes to rest. While the cartridge 2 is being advanced, the input lifter 11 and the output lifter 12 are in their respective retracted positions, as shown in FIG. 2A and discussed below. The cartridges 2 hold a plurality of substrates parallel to each other at a certain distance so that they face each other and are aligned, and the cartridges include an opening that extends over a substantial part of the bottom surface to allow access to the input and output lift rams.

After the gate valve arrangement G3 has been actuated in order to separate the input load lock 3 from the buffer chamber 4 , the load lock 3 is vented again to atmospheric pressure. The gate valve arrangement G1 opens again to open the input load lock door, and a subsequent cassette 2 filled with unprocessed substrates moves from the position C2 to C3. The gate valve arrangement G1 is then closed in order to close the input load lock door, whereupon the input load lock 3 is slowly pumped out to a pre-vacuum and then to a high vacuum.

In the preferred embodiment of the invention, the vertical transport system 10 has an input lifter 11 (load) and an output lifter 12 (unload). The vertical transport system 10 is located below the buffer chamber 4 and further comprises two actuating spindles 13 and ball nuts 14 ( FIG. 2A) and drive motors M9 and M10. The vertical displacement of the lifting tappets 11 , 12 is effected by the actuation of the motors M9 and M10, which drive individual actuating spindles 13 , whereby the respective ball nut 14 is raised or lowered, a respective ball nut 14 being operationally connected to an associated tappet 11 , 12 .

The lifting plungers 11 , 12 are guided for upward and downward movement in a vertical path which intersects the conveyor system 1 at right angles. The width of the plunger 11 , 12 is less than the width of the distances between the main walls of the cassette 2 , which holds the substrates. The plungers 11 , 12 are also thinner than the distance between adjacent substrates which are held in the cassettes 2 .

The lifters 11 , 12 are also provided with an arcuate upper end 15 to conform to the curvature of the substrates ( Fig. 4) and a V-shaped groove 16 is attached to this end to allow individual substrates between the edges of the groove hold ( Fig. 2B). In order to transfer an unprocessed substrate 30 from an input cassette 2 into the position C4 to the vertical transfer position ( FIG. 2B) upon actuation of the motor M4, whereby a cassette 2 and a substrate 30 are brought into register over the path of movement of the plunger 11 , grips the input plunger 11 between the rollers 8 of the conveyor system and cuts the path of the conveyor and the cassette 2 at right angles. Since the cassettes 2 are designed to allow access to the substrates from below and to allow the lifters 11 , 12 to fully reach through when a cassette 2 and a substrate are placed in register over the path of the lifter 11 , it moves Ram 11 up between conveyor rollers 8 to grasp a substrate 30 within the V-groove of the upper end 12 from below and raise the substrate 30 up to a position in register immediately adjacent to the loading device 20 ( FIG. 2B) of the buffer chamber .

Since the substrates are oriented vertically, gravity helps to hold the substrates firmly but gently and securely in the grooved end 16 of the lifting lifters 11 , 12 . Contact with the front of the substrate or magnetic disks is therefore really avoided, unlike in the case of typical automatic handling, when the substrate is aligned horizontally. Therefore, the risk of damage or abrasion on the substrate is largely reduced.

After the substrate 30 is raised to the vertical transfer position, as shown in FIG. 2B, the substrate 30 is gripped by the charger 20 of the buffer chamber and the input lifter 11 is retracted as shown in FIG. 2A. The motor M4 then moves the cassette 64 and overlaps the next substrate above the input lifter 11 .

Substrates are transferred from the cassette 2 as described above until all substrates have been unloaded. The motors M4 and M5 then drive the roller sets R4 and R5 synchronously and move the empty cassette 2 to the position 65 . The empty cassette 2 remains in position 65 until the preceding cassette in position C6 is filled with processed substrates and has been moved out of the buffer chamber 4 .

Before unloading the substrate into the cassette in position C5, motors M5 and M6 synchronously drive roller sets R5 and R6 and move the empty cassette to position C6, where the first empty slot of the cassette is aligned directly above the path of movement of the output lifting plunger 12 .

The loading device 20 of the buffer chamber of the system comprises a lever arm 21 , at one end of which a plurality of grooved parts 22 are operatively connected. In the preferred embodiment, the lever arm 21 comprises three grooved parts 22 which are arranged so that one of the grooved parts 22 contacts the substrate at the upper edge of the inner opening of the substrate and the two remaining parts 22 contact the substrate at the lower edge. In another embodiment of the invention, not shown, the arm 21 may include two grooved parts 22 that are configured to engage the lower edge of a single substrate.

The buffer chamber loader 20 further includes a drive motor M11 and a conventional transmission (not shown) to cause the lever arm 21 to pivot into and out of the buffer chamber 4 to the system main vacuum chamber 6 ( Fig. 3).

The lever arm 21 of the loading device of the buffer chamber is designed and arranged such that the arm moves into a position 23 immediately adjacent to the substrate 30 in the vertical transfer position, which is shown in broken lines in FIGS. 2B and 3. In order to transfer the substrate 30 from the buffer chamber 4 to the main vacuum chamber 6 , the lever arm 21 is moved from its ready position 23 to the position 24 by means of a motor M11, the grooved parts 22 of the lever arm 21 being aligned with the substrate 30 and the input lifting plunger 11 being itself retracts, whereby the substrate 30 can rest on the grooved parts 22 of the lever arm 21 ( FIG. 2B). The lever arm 21 is then pivoted further into the position 25 (which can also be seen in broken lines in FIG. 3), where the substrate 30 is transferred to the transport device 31 of the main chamber, which transport device is arranged within the main vacuum chamber 6 . Therefore, the substrate is effectively transferred from the buffer chamber 4 to the main vacuum chamber 6 in a sealed vacuum environment by a simple, single pivot in one plane of the lever 21 , which significantly increases the throughput.

The substrate 30 is transferred to the transport device 31 of the main chamber, processed and unloaded as follows:
The motor M10 pivots the lever arm 21 and the unprocessed substrate 30 into the position 25 , above and immediately adjacent to a frame 32 , a plurality of which are arranged on the transport device 31 of the main chamber. The racks 32 are provided with an arcuate upper end which conforms to the curvature of the substrates 30 , and a V-shaped groove 35 is provided at this end to enclose a single substrate 30 between the edges during the transfer of the substrates from processing station to processing station and hold during processing of the substrates ( Fig. 4).

In the preferred embodiment of the invention, the racks 32 are also provided with a novel sealing system which seals and isolates each processing station from the main vacuum chamber 6 when the main chamber conveyor 31 is in the raised position. The sealing system is also designed so that when the main chamber transport device 31 is in the raised position, an individual processing station can be removed for maintenance purposes without disturbing the vacuum environment of the main chamber 6 .

The sealing system comprises a plurality of insulation seals 36 ( FIG. 5) which comprise a flexible polymer material, for example an elastomer, which is arranged at the bottom of each frame 32 and cooperates with corresponding sealing seats 37 , which are arranged in the upper wall of the vacuum chamber and in Coverage over the path of movement of each insulation seal 36 are aligned.

When maintenance of one or more individual processing stations becomes necessary, the operation of the system is temporarily interrupted, with the transport device 31 of the main chamber being in the raised position. All processing stations, loading locks and buffer chambers are therefore sealed off from the main vacuum chamber. To maintain a single processing station, the associated pump is disconnected via a corresponding valve and the processing station is vented to atmospheric pressure. The channel or passage into the main vacuum chamber from the respective processing station may contain another seal which is exposed to atmospheric pressure when the processing station in question is vented. The vacuum environment of the main vacuum chamber is maintained only by the fact that the atmospheric pressure is on the surface of this seal in question.

Appropriate sections of the processing station can then be removed and replaced with suitably completed and preprocessed sections. Alternatively, the entire processing station can be removed and replaced with a new or freshly supplied one that has been prepared off-line while the coating system was in production. The processing station is then pumped out (pre-vacuum), and the associated vacuum pump is switched on. After a short conditioning operation, the transport device 31 is lowered and normal operation of the system is resumed. Maintenance of the selected processing station did not require ventilation of the other processing stations or the main vacuum chamber to the atmosphere. The system downtime has been largely reduced.

The main chamber conveyor 31 is further provided with a drive motor M12, an index assembly 33 and an index motor M13 to cause the indexing in one place to be sufficient for all substrates within the main vacuum chamber 6 at the same time as each individual substrate is being transferred through the system . The substrates are processed sequentially in each of the N main chamber processing stations 40 , with all processing stations 40 processing an individual substrate at the same time, and thus a high production rate can be achieved.

In order to achieve the one-station indexing of the transport device 31 of the main chamber in the preferred embodiment of the invention, the transport device 31 is made to perform three different movements in one transfer cycle:
The first movement takes place axially downward from a plane which is defined by the substrates in the respective processing stations (as well as the transfer positions shown in broken lines in FIG. 5). The first movement is carried out by activating the motor M12, which drives a conventional spindle and ball nut arrangement 38 , which lowers the transport device 31 .

The second movement takes place along a horizontal, circular path, the substrates being located below and immediately adjacent to the next processing station. The second movement is accomplished by activating the motor M13, which drives the index device 33 ( FIG. 5).

The third movement of the transport device 31 is directed axially upward, the substrates in turn being positioned in their respective processing station. This third position is similarly achieved by activating the motor M12 and the associated spindle and ball nut arrangement 38 . This third position also facilitates the transfer of substrates from the buffer chamber 4 via the lever arm 21 of the loading device of the buffer chamber ( FIG. 4) to the main vacuum chamber 6 , and the transfer of substrates from the main chamber 6 to the buffer chamber 4 via the lever arm 26 of the unloading device the buffer chamber shown in Fig. 3. This sequence described above has three positions and is repeated until all processing steps have been completed and the processed substrate reaches the unloading station 34 in Fig. 3.

The main chamber transport device 31 further isolates the main chamber 6 from the buffer chamber 4 when the substrates have been moved to the respective processing stations by the main chamber transport device 31 . The main chamber 6 is continuously under high vacuum via the gate valve arrangement G8 and an associated vacuum pump (not shown).

After the substrates of the transport device 31 have been transferred to the main chamber and arranged thereon, the successive processing of the substrates begins. If the processing involves a spray or dust deposit, spray gas, typically argon, is introduced and a plasma is generated. The vacuum insulation of the processing stations enables the use of different gas or gases at different pressures in each processing station. At the end of the spraying or dusting process, the gas or gases in each processing station is substantially evacuated by the vacuum pump associated with the respective processing station before the main chamber conveyor 31 is lowered so that the introduction of gas or gases into the main chamber 6 minimized and the risk of cross-contamination of gas or gases after other process stations is substantially reduced.

It will be apparent to those skilled in the art that the number of processing stations, as well as the particular methods used in the handling and processing system disclosed, may be tailored to the particular coating and / or processing sequence, which is not described in detail. However, the first processing station is typically a heating station equipped with high power infrared heating lamps to raise the temperature of the substrate on the racks 32 to the desired temperature. In one embodiment, the remaining processing stations are set up for dust coating, either with direct current or with radio frequency. A typical spray application or pollination station 40 is shown schematically in FIG. 5. In other embodiments, one or more processing stations include a direct current or radio frequency etching apparatus or CVD (reactive vapor deposition) systems as are known. When a substrate is held by the rack 32 of the main chamber conveyor 31 , as indicated by dash-dotted lines in Fig. 5, both sides of the substrate are substantially exposed to the dust coating by the dust gun, which is of a known type. The arcuate and V-shaped grooved upper end 35 of the rack 32 supports individual substrates with the edges, reducing the surface area of the rack 32 that is exposed to spraying or dusting in the processing stations. Each of the processing stations is further equipped with an associated high vacuum pump 41 so that vacuum coating processes can be carried out in selected processing stations.

In another embodiment of the invention one of the processing stations has a substrate cooling device have, as in a simultaneously submitted Registration is described.

In the preferred embodiment of the invention, the processing stations are adjacent to the main vacuum chamber 6 ( Fig. 5). However, it is clear to the person skilled in the art that the processing stations can be arranged at different functional positions, for example above, below or within the main vacuum chamber 6 . The term "contiguous" as used herein is intended to encompass these various positions.

The process of unloading a substrate from the main vacuum chamber 6 through the buffer chamber 4 into the dispensing cassette 2 in position C6 is well understood in light of the previous step of loading a substrate from the buffer chamber 4 since the numerous mechanisms are the same as they are can be used both in the charging device 20 and the discharge device 27 of the buffer chamber. The main difference between the two devices 20 and 27 is the pivoting of the lever arms 21 , 26 , as can be seen in FIG. 3.

Accordingly, when a substrate has been processed and reaches the unloading station 34 , the lever arm 26 of the unloading device 27 of the buffer chamber is aligned with the substrate while the transport device 31 of the main chamber is in the raised position. The transport device 31 of the main chamber lowers and leaves the substrate in engagement with the lever arm 26 . The lever arm 26 is then rotated by means of the motor M14 and the substrate is brought into alignment with the movement path of the discharge lifter ram 12 of the vertical transport system 10 . Motor M10 is then actuated and lifts the output plunger 12 to grasp the substrate. The lever arm 26 is pivoted into its ready position (dash-dotted lines in Fig. 3). The lifter plunger 12 is then retracted, depositing the substrate in the output cassette in position C6.

After the cassette 2 has been loaded with processed substrates, the gate valve arrangement G6 opens. The motors M6 and M7, for example, drive the roller sets R6 and R7 synchronously and move the full cassette from the buffer chamber 4 to the position C7 in the discharge load lock 5 . The gate valve arrangement G5 is then closed and isolates the buffer chamber 4 from the discharge load lock 5 . The discharge lock 5 is then slowly brought to atmospheric pressure (vented) with an inert gas. The gate valve arrangement G7 is opened. The motors M7 and M8 drive the roller sets R7 and R8 synchronously and move the cassette 2 into the position C8. The gate valve arrangement G7 is closed, and the discharge charge lock 5 is pumped out again via the gate valve arrangement G6 and the high vacuum cyropump P3. The cassette 2 has now ended its journey through the conveyor system 1 .

While the embodiments of the devices and Methods related to specific structures have been disclosed , it is clear that the person skilled in the art will make numerous changes and  Modifications of the invention can make this the adapt to different applications and conditions. Such changes and modifications are from Equivalence range covered by the following claims.

Claims (30)

1. System of handling and serial processing of a plurality of substrates with the following features:
a main vacuum chamber ( 6 ) is formed;
at least one processing station ( 40 ) adjoins the main vacuum chamber ( 6 );
an input load lock ( 3 ) has an inlet opening and a first movable door (G1) for sealing the inlet opening and an outlet opening and a second movable door (G2) for sealing the outlet opening;
an output load lock ( 5 ) has an inlet opening and a third movable door (G5) for sealing the inlet opening and an outlet opening and a fourth movable door (G7) for sealing the outlet opening;
a buffer chamber ( 4 ) has an inlet opening and an outlet opening;
the buffer chamber ( 4 ) is in a selectively sealed connection with the main chamber ( 6 ) and is arranged between the input load lock ( 3 ) and the output load lock ( 5 ) and is operatively connected to them, the load locks and the buffer chamber being arranged so that the second movable door (G3) is used to jointly seal the outlet opening of the input load lock and the inlet opening of the buffer chamber and the third movable door (G5) is provided to jointly seal the inlet opening of the input load lock and the outlet opening of the buffer chamber; a first transport device ( 1 , 2 ) is provided for conveying the substrates ( 30 ) from the input load lock ( 3 ) through the buffer chamber ( 4 ) to the output load lock ( 5 );
a buffer chamber loading device ( 20 ) is provided for transferring the substrates ( 30 ) from the buffer chamber ( 4 ) into the main vacuum chamber ( 6 );
a buffer chamber discharge device ( 27 ) is provided for transferring the substrates ( 30 ) from the main vacuum chamber ( 6 ) into the buffer chamber ( 4 );
a main chamber transport device ( 31 ) is provided for transferring the substrates ( 30 ) to and from the processing stations;
the main chamber transport device ( 31 ) is designed to receive one of the substrates ( 30 ) from the buffer chamber loading device ( 20 ) and to transfer one of the substrates ( 30 ) to the buffer chamber discharge device ( 27 );
the main chamber transport device ( 31 ) is used for simultaneous indexing of all substrates ( 30 ) within the main vacuum chamber ( 6 ) at a station, the individual substrates ( 30 ) being transported through the system, being processed successively in each of the processing stations and all processing stations simultaneously process the substrates to achieve a high production rate;
the main chamber transport device ( 31 ) has a sealing device ( 36 , 37 ) so that the processing stations are insulated during processing when the substrates are positioned in their respective processing stations by the main chamber transport device ( 31 ). 2. substrate handling and processing system according to claim 1, characterized in that the substrates ( 30 ) are aligned vertically during handling and processing. 3. Substrathandhabungs- and processing system according to claim 1 or 2, characterized in that the first transport means (1, 2) a plurality of cassettes (2) comprises, and in that the cassettes (2) the substrates (30) vertically aligned and hold opposite . 4. substrate handling and processing system according to claim 1, 2 or 3, characterized in that the load locks ( 3 , 5 ) in the course of the first transport device ( 1 , 2 ) are arranged, the first, second, third and fourth door (G1 , G3, G5, G7) are arranged in parallel planes and coincident with the first transport device. 5. substrate handling and processing system according to one of claims 1 to 4, characterized in that a vertical transport device ( 10 ) for individual transfer of the substrates ( 30 ) from an input side, arranged within the buffer chamber cassette ( 2 ) to the buffer chamber loading device ( 20 ) and is provided from the buffer chamber discharge device ( 27 ) to an outlet-side cassette ( 2 ) arranged within the buffer chamber. 6. substrate handling and processing system according to claim 5, characterized in that the vertical transport device ( 10 ) has a plurality of lifting rams ( 11 , 12 ) and
that each of the lifting plungers ( 11 , 12 ) is designed to securely hold an individual substrate ( 30 ) during vertical transport. 7. substrate handling and processing system according to claim 6, characterized in that the lifting plunger ( 11 , 12 ) have a rounded, V-shaped groove ( 15 , 16 ) to symmetrically touch one of the substrates near the lower half of the edge of the substrates and support. 8. substrate handling and processing system according to claim 7, characterized in that the lifting plunger ( 11 , 12 ) are designed and arranged so that the buffer chamber loading and unloading devices ( 20, 29 ) can grip the substrates ( 30 ). 9. substrate handling and processing system according to one of claims 1 to 8, characterized in that the main chamber transport device has a plurality of frames ( 32 ) and
that each of the racks ( 32 ) is adapted to securely hold an individual substrate ( 30 ) during the transfer of the substrates from the processing stations and during the processing of the substrates. 10. substrate handling and processing system according to claim 9, characterized in that the frames ( 32 ) each have an arcuate V-groove ( 35 ) to symmetrically touch and support one of the substrates near the lower half of the edge of the substrates. 11. substrate handling and processing system according to claim 10, characterized in that the frames ( 32 ) are designed so that the buffer chamber loading and unloading devices ( 20, 27 ) can grip the substrates ( 30 ). 12. substrate handling and processing system according to one of claims 1 to 11, characterized in that the buffer chamber loading device ( 20 ) and the buffer chamber unloading device ( 27 ) each have a rotatable lever arm ( 21 , 26 ). 13. The substrate handling and processing system according to claim 12, characterized in that each of the lever arms ( 21 , 26 ) has a plurality of grooved parts ( 22 ) at one end, each around a substrate ( 30 ) near the lower half of the edge of the substrate to support. 14. The substrate handling and processing system according to claim 12 or 13, characterized in that the lever arms ( 21 , 26 ) between a first position, the arms being in communication with the buffer chamber ( 4 ), and a second position, the arms ( 21 , 26 ) are connected to the main vacuum chamber ( 6 ) and are pivotable. 15. substrate handling and processing system according to claim 14, characterized in that the lever arms ( 21 , 26 ) can still be pivoted into a third position while the arm is in connection with the buffer chamber, and
that the third position is at a predetermined distance beyond the first position and coincides with the line of curvature defined by the pivoting path of the arm from the second position to the first position. 16. A substrate handling and processing system according to claim 15, characterized in that the lever arms ( 21 , 26 ) are arranged so that one of the substrates can be gripped by the grooved parts ( 22 ) when the arm from the third to the first position is rotated. 17. substrate handling and processing system according to claim 16, characterized in that the lever arms ( 21 , 26 ) are further positioned so that the substrate in and out of the grooved parts ( 22 ) can be raised and lowered, by means of the vertical transport device ( 10 ) when the arms ( 21 , 26 ) are in their first position, with vertically oriented individual substrates being securely transferred between the cassettes and the buffer chamber loader and unloader ( 20, 27 ). 18. substrate handling and processing system according to one of claims 12 to 17, characterized in that the lever arm ( 21 , 26 ) is further arranged so that the substrate from the frame ( 32 ) of the main chamber transport device ( 31 ) can be gripped and removed. 19. The substrate handling and processing system according to claim 1, characterized in that the first transport device comprises a conveyor ( 1 ) for moving the cassettes ( 2 ) along a path. 20. The substrate handling and processing system according to claim 19, characterized in that the conveyor ( 1 ) comprises a plurality of motors (M1-M8) which are operatively connected to the horizontal transport device. 21. Substrate handling and processing system according to one of claims 1 to 20, characterized in that the main vacuum chamber device ( 6 ), the input charge lock ( 3 ) and the output charge lock ( 5 ) are connected to a pump device for backing vacuum and to a main high vacuum pump. 22. Substrate handling and processing system according to one of claims 1 to 21, characterized in that the buffer chamber ( 4 ) is provided with an associated high vacuum pump (P2). 23. Substrate handling and processing system according to one of claims 1 to 22, characterized in that each of the processing stations is provided with an associated high vacuum pump ( 41 ), wherein vacuum coating processes can be carried out in selected processing stations. 24. Substrate handling and processing system according to one of the  Claims 1 to 23, characterized, that each of the processing stations has a specific Process is associated with, in general different procedures in different Processing stations are executed. 25. Substrate handling and processing system according to claim 24, characterized in that the processing stations are generally arranged in a circle, the load locks ( 3 , 5 ) and the buffer chamber ( 4 ) being arranged at the edge of the circle. 26. Substrate handling and processing system according to one of claims 1 to 25, characterized in that the main chamber transport device has a device ( 33 ) for intermittent indexing of the main chamber transport device ( 31 ) to simultaneously index all substrates within the main chamber ( 6 ) at one station to accomplish. 27. The substrate handling and processing system according to claim 26, characterized in that the main chamber transport means are made to perform three different movements in one transfer cycle, the first movement being axially downward from a plane which is different from the substrates ( 30 ) in their respective Processing stations ( 40 ) is defined, a second movement takes place along a horizontal, circular path, the substrates being moved below the next processing station, and a third movement takes place axially upwards in the plane which is defined by the substrates in their respective processing positions , wherein a substrate is supported by one of the frames ( 32 ) when the lever arm ( 21 ) of the buffer chamber loading device ( 20 ) is in the second position, and one of the substrates is supported by the lever arm ( 26 ) of the buffer chamber loading device ( 27 ) when the lifting larm ( 26 ) of the buffer chamber unloading device ( 27 ) in the second position. 28. Substrate handling and processing system according to one of claims 1 to 27, characterized in that the sealing device, preferably an elastomer seal, is arranged and designed such that during the presence of the substrates in their processing stations, these processing stations ( 40 ) from the main vacuum chamber ( 6 ) are insulated so that when an individual processing station is removed or vented to atmosphere, this sealing device maintains an effective vacuum seal between the atmosphere and the vacuum chamber due to the atmospheric pressure applied to the sealing device. 29. Substrate handling and processing system with the following features:
the system has a processing chamber with an opening therein,
a plurality of treatment stations are arranged within the processing chamber,
means is provided for conveying a substrate vertically into and out of the processing chamber, and
Processing chamber transport devices move a substrate vertically from one of the treatment stations to another treatment station within the processing chamber,
the processing chamber transport device comprises a device for supporting a substrate in a vertical orientation,
the main chamber transport device further comprises a device for intermittent indexing of the process chamber transport device in order to effect a simultaneous single station indexing of all substrates within the processing chamber, and
the indexing has three different movements of the processing chamber transport device in a transmission cycle. 30. The substrate handling and processing system according to claim 29, characterized in that means for maintaining a vacuum environment is provided in each of the treatment stations and in the processing chamber during the operation of the system, and
that a device is associated with each treatment station to enable removal thereof without breaking the vacuum at the other treatment stations and the processing chamber.