DE4129056A1 - Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips - Google Patents

Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips

Info

Publication number
DE4129056A1
DE4129056A1 DE4129056A DE4129056A DE4129056A1 DE 4129056 A1 DE4129056 A1 DE 4129056A1 DE 4129056 A DE4129056 A DE 4129056A DE 4129056 A DE4129056 A DE 4129056A DE 4129056 A1 DE4129056 A1 DE 4129056A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
led
conductor tracks
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4129056A
Other languages
German (de)
Inventor
Gerald Helmers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mannesmann VDO AG
Original Assignee
Mannesmann VDO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann VDO AG filed Critical Mannesmann VDO AG
Priority to DE4129056A priority Critical patent/DE4129056A1/en
Publication of DE4129056A1 publication Critical patent/DE4129056A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The printed circuit board has apertures (2) formed for the location of LED indicators (3). The LED connects with the circuit board using L-shaped contact strips (4, 5) and the hole size is such that good contact is obtained without requiring soldering of the ends (6, 7). The L-shaped contacts can have a large cross sectional area for good heat dissipation and can be produced of aluminium, copper or iron. ADVANTAGE - Provides good heat conduction away from LED, defective indicators can be easily replaced

Description

Die Erfindung betrifft eine Leiterplatte mit zumindest einer von ihr gehaltenen und von auf ihr verlaufenden Leiterbahnen kontaktierten Leuchtdiode.The invention relates to a circuit board with at least one held by it and one running on it Conductor tracks contacted light emitting diode.

Leiterplatten der vorstehenden Art werden in zahlreichen elektronischen Geräten eingesetzt und sind deshalb allge­ mein bekannt. Oftmals werden dabei mehrere Leuchtdioden in einer Reihe hintereinander angeordnet, um eine höhere Leuchtdichte zu erreichen.Printed circuit boards of the above type are available in numerous electronic devices and are therefore general my known. Often there are several light emitting diodes arranged in a row to make a higher one To achieve luminance.

Bei den bekannten Leiterplatten sind die Leuchtdioden auf der Vorderseite der Leiterplatte zwischen den Leiterbah­ nen gelötet. Die Leiterbahnen bestehen aus einer sehr massearmen Kupferbeschichtung. Durch diese Anordnung der Leuchtdioden tritt das Problem auf, daß die in den Leuchtdioden entstehende Wärme oftmals nicht ausreichend abgeführt werden kann. Sie gelangt deshalb zum Beispiel in ein vor der Leiterplatte angeordnetes Display und kann Ursache für Fehlfunktionen sein. Weiterhin ist nachtei­ lig, daß die beim Auflöten der Leuchtdioden erforderliche Wärme oftmals dazu führt, daß die Leiterplatte mit ihren Leuchtdioden unbrauchbar wird. Bei großflächigen LED-Ar­ rays entsteht also schon in der Fertigung relativ viel Ausschuß.In the known circuit boards, the LEDs are on the front of the circuit board between the circuit board soldered one. The conductor tracks consist of a very low-mass copper coating. Through this arrangement of Light-emitting diodes the problem arises that in the LEDs often do not generate enough heat can be dissipated. Therefore, for example, it arrives in a display arranged in front of the circuit board and can Cause malfunction. Furthermore, night is lig that the required when soldering the LEDs Heat often leads to the circuit board with their LEDs become unusable. With large-area LED ares So rays already produce a lot in production Committee.

Der Erfindung liegt das Problem zugrunde, eine Leiter­ platte der eingangs genannten Art so auszubilden, daß die von auf ihr angeordneten Leuchtdioden erzeugte Wärme mög­ lichst gut abgeführt werden kann.The invention is based on the problem of a ladder plate of the type mentioned so that the heat generated by LEDs arranged on it possible can be dissipated as well as possible.

Dieses Problem wird erfindungsgemäß dadurch gelöst, daß die Leuchtdiode in ein Fenster der Leiterplatte einge­ setzt ist und die Leiterbahnen als auf der Rückseite der Leiterplatte verlaufende Kontaktstreifen ausgebildet sind.This problem is solved according to the invention in that the light emitting diode in a window of the circuit board is set and the conductor tracks as on the back of the PCB contact strips formed are.

Bei einer solchen Leiterplatte wird die von den Leuchtdi­ oden erzeugte Wärme von den Kontaktstreifen zur Rückseite der Leiterplatte geführt. Dort kann Wärme abgestrahlt werden, ohne daß es dadurch zu einer nachteiligen Beein­ flussung des vor der Leiterplatte angeordneten Displays kommt. Diese Wärmeabgabe kann auf einfache Weise durch einen entlang der Leiterplattenrückseite geführten Luft­ strom gefördert werden. Ein weiterer Vorteil der erfin­ dungsgemäßen, als LED-Trägerplatte ausgebildeten Leiter­ platte liegt darin, daß ihre Bauhöhe geringer ist als die üblicher Leiterplatten.With such a circuit board, the by the Leuchtdi ode generated heat from the contact strips to the back of the circuit board. Heat can be emitted there be without causing an adverse leg flow of the display arranged in front of the circuit board is coming. This heat release can be done easily air led along the back of the PCB electricity are promoted. Another advantage of invent according to the invention, designed as an LED carrier plate conductor plate is that its overall height is less than that usual circuit boards.

Besonders einfach kann die Kontaktierung der jeweiligen Leuchtdiode erfolgen, wenn gemäß einer Weiterbildung der Erfindung die Leiterbahnen zur Kontaktierung der Leucht­ diode jeweils einen rechtwinklig abgebogenen, in das Fen­ ster eingreifenden Endbereich aufweisen.The contacting of the respective can be particularly simple Light-emitting diode take place if according to a further development of the Invention the conductor tracks for contacting the light diode each bent at a right angle into the fen have the most engaging end region.

Eine andere, vorteilhafte Weiterbildung der Erfindung be­ steht darin, daß das Fenster mit den in ihm greifenden Endbereichen der Leiterbahnen zur klemmenden Aufnahme einer Leuchtdiode bemessen ist. Durch diese Gestaltung brauchen die Leuchtdioden nicht mit den Leiterbahnen ver­ lötet zu werden. Deshalb entfällt bei der Fertigung ein Arbeitsgang, der wegen der bei ihm entstehenden Wärme häufig Ursache für Ausschuß ist. Die Leuchtdioden können bei der erfindungsgemäßen, als LED-Trägerplatte ausgebil­ deten Leiterplatte einfach von der Rückseite her in das jeweilige Fenster der Leiterplatte eingesetzt werden. Deshalb ist später auch mit geringem Aufwand ein Austau­ schen defekter Leuchtdioden möglich.Another advantageous development of the invention be it says that the window with the ones that reach into it End areas of the conductor tracks for clamping reception a light emitting diode. Through this design the LEDs do not need to be connected to the conductor tracks to be soldered. Therefore, there is no need for manufacturing Operation, because of the heat generated by it  is often the cause of committee. The LEDs can in the invention, trained as an LED carrier plate PCB from the back into the respective windows of the circuit board are used. That is why you can replace it later with little effort defective LEDs possible.

Eine besonders gute Wärmeableitung von der jeweiligen Leuchtdiode zur Rückseite der Leiterplatte erreicht man, wenn die Leiterbahnen aus Metall, insbesondere Aluminium, Kupfer oder Eisen, bestehen.A particularly good heat dissipation from the respective LED to the rear of the circuit board can be reached if the conductor tracks are made of metal, in particular aluminum, Copper or iron.

Zur Erhöhung der Wärmeabstrahlung trägt es bei, wenn ge­ mäß einer anderen Weiterbildung der Erfindung die Leiter­ bahnen auf der Rückseite der Leiterplatte zur besseren Wärmeabstrahlung Wärmeaustauschflächen aufweisen.It contributes to increasing the heat radiation if ge according to another development of the invention, the ladder tracks on the back of the circuit board for better Heat radiation have heat exchange surfaces.

Eine weitere Verbesserung der Wärmeabgabe läßt sich da­ durch erreichen, daß die Wärmeaustauschflächen von der Leiterplatte weg in den freien Raum gerichtet sind.A further improvement in the heat emission can be there by achieving that the heat exchange surfaces of the PCB are directed away into free space.

Die Erfindung läßt zahlreiche Ausführungsformen zu. Zur weiteren Verdeutlichung ihres Grundprinzips ist eine da­ von in der Zeichnung dargestellt und wird nachfolgend be­ schrieben. Die Zeichnung zeigt inThe invention allows numerous embodiments. For there is a further clarification of their basic principle of shown in the drawing and will be below wrote. The drawing shows in

Fig. 1 einen Teilbereich einer erfindungsgemäßen Leiterplatte, Fig. 1 a portion of a printed circuit board according to the invention,

Fig. 2 einen Längsschnitt durch die Leiterplatte ent­ lang der Linie II-II in Fig. 1. Fig. 2 shows a longitudinal section through the circuit board ent along the line II-II in Fig. 1st

Die Fig. 1 zeigt einen Teilbereich einer aus Kunststoff bestehenden Leiterplatte 1, in der ein rechteckiges Fen­ ster 2 mit einer darin von der Rückseite der Leiterplatte 1 her eingesetzten Leuchtdiode 3 vorgesehen ist. Fig. 1 shows a portion of an existing plastic circuit board 1 , in which a rectangular Fen ster 2 is provided with a light-emitting diode 3 inserted therein from the back of the circuit board 1 .

Die Fig. 2 läßt erkennen, daß die Kontaktierung der Leuchtdiode 3 durch auf der Rückseite der Leiterplatte verlaufende, als Kontaktstreifen aus Aluminium ausgebil­ dete Leiterbahnen 4, 5 erfolgt, welche hierzu jeweils mit einem rechtwinklig abgebogenen Endbereich 6, 7 in das Fenster 2 eingreifen. Dabei sind das Fenster 2, die Endbereiche 6, 7 und die Leuchtdiode 3 so bemessen, daß sich die Leuchtdiode 3 von der Rückseite der Leiterplatte 1 her stramm in das Fenster 3 einschieben läßt. Deshalb ist ein Verlöten der Endbereiche 6, 7 mit den Kontaktflä­ chen der Leuchtdiode 3 nicht nötig. Fig. 2 shows that the contacting of the light emitting diode 3 by running on the back of the circuit board, as a contact strip made of aluminum ausgebil Dete conductor tracks 4 , 5 , which each engage with a right-angled end region 6 , 7 in the window 2 . The window 2 , the end regions 6 , 7 and the light-emitting diode 3 are dimensioned such that the light-emitting diode 3 can be pushed tightly into the window 3 from the rear of the printed circuit board 1 . Therefore, soldering the end regions 6 , 7 to the contact surfaces of the light-emitting diode 3 is not necessary.

Zur Verbesserung der Wärmeabfuhr können die Leiterbahnen 4, 5 auf der Rückseite der Leiterplatte 1 in Fig. 1 gestrichelt dargestellte Wärmeaustauschflächen 8, 9 auf­ weisen, die entweder auf der Leiterplatte 1 aufliegen, oder zur noch besseren Wärmeabgabe von ihr aus frei in den Raum ragen und dadurch die Funktion echter Kühlrippen haben.To improve the heat dissipation, the conductor tracks 4 , 5 on the back of the circuit board 1 in FIG. 1 shown in dashed lines have heat exchange surfaces 8 , 9 , which either rest on the circuit board 1 , or protrude freely from it into the room for even better heat dissipation and thereby have the function of real cooling fins.

Claims (6)

1. Leiterplatte mit zumindest einer von ihr gehaltenen und von auf ihr verlaufenden Leiterbahnen kontaktierten Leuchtdiode, dadurch gekennzeichnet, daß die Leuchtdiode (3) in ein Fenster (2) der Leiterplatte (1) eingesetzt ist und die Leiterbahnen (4, 5) als auf der Rückseite der Leiterplatte (1) verlaufende Kontaktstreifen ausgebildet sind.1. Printed circuit board with at least one light-emitting diode held by it and contacted by conductor tracks running on it, characterized in that the light-emitting diode ( 3 ) is inserted into a window ( 2 ) of the printed circuit board ( 1 ) and the conductor tracks ( 4 , 5 ) as on Contact strips running on the back of the printed circuit board ( 1 ) are formed. 2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Leiterbahnen (4, 5) zur Kontaktierung der Leucht­ diode (3) jeweils einen rechtwinklig abgebogenen, in das Fenster (2) eingreifenden Endbereich (6, 7) aufweisen.2. Printed circuit board according to claim 1, characterized in that the conductor tracks ( 4 , 5 ) for contacting the light-emitting diode ( 3 ) each have a right-angled, in the window ( 2 ) engaging end region ( 6 , 7 ). 3. Leiterplatte nach Anspruch 2, dadurch gekennzeichnet, daß das Fenster (2) mit den in ihm greifenden Endberei­ chen (6, 7) der Leiterbahnen (4, 5) zur klemmenden Auf­ nahme einer Leuchtdiode (3) bemessen ist.3. Printed circuit board according to claim 2, characterized in that the window ( 2 ) with the end regions engaging in it ( 6 , 7 ) of the conductor tracks ( 4 , 5 ) for clamping on measurement of a light-emitting diode ( 3 ). 4. Leiterplatte nach zumindest einem der vorangehenden Ansprüchen, dadurch gekennzeichnet, daß die Leiterbahnen (4, 5) aus Metall, insbesondere Aluminium, Kupfer oder Eisen, bestehen. 4. Printed circuit board according to at least one of the preceding claims, characterized in that the conductor tracks ( 4 , 5 ) made of metal, in particular aluminum, copper or iron. 5. Leiterplatte nach zumindest einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß die Leiterbahnen (4, 5) auf der Rückseite der Leiterplatte (1) zur besse­ ren Wärmeabstrahlung Wärmeaustauschflächen (8, 9) aufwei­ sen.5. Printed circuit board according to at least one of the preceding claims, characterized in that the conductor tracks ( 4 , 5 ) on the back of the printed circuit board ( 1 ) for better heat radiation ren heat exchange surfaces ( 8 , 9 ) aufwei sen. 6. Leiterplatte nach Anspruch 5, dadurch gekennzeichnet, daß die Wärmeaustauschflächen (8, 9) von der Leiterplatte (1) weg in den freien Raum gerichtet sind.6. Printed circuit board according to claim 5, characterized in that the heat exchange surfaces ( 8 , 9 ) of the printed circuit board ( 1 ) are directed away into the free space.
DE4129056A 1991-09-02 1991-09-02 Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips Withdrawn DE4129056A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4129056A DE4129056A1 (en) 1991-09-02 1991-09-02 Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4129056A DE4129056A1 (en) 1991-09-02 1991-09-02 Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips

Publications (1)

Publication Number Publication Date
DE4129056A1 true DE4129056A1 (en) 1993-03-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE4129056A Withdrawn DE4129056A1 (en) 1991-09-02 1991-09-02 Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips

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DE (1) DE4129056A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943213A (en) * 1997-11-03 1999-08-24 R-Amtech International, Inc. Three-dimensional electronic module
DE19834538A1 (en) * 1998-07-31 2000-02-03 Abb Patent Gmbh Electronic installation device used in buildings has liquid crystal display illuminated from rear via light source fitted into opening in surface of printed circuit board for installation device
EP1647763A1 (en) * 2004-10-12 2006-04-19 Scanatron Technics AG Surgical or medical illuminating device with optimized LED light source
EP1715242A3 (en) * 2005-04-13 2007-08-22 WÜRTH ELEKTRONIK GmbH & Co. KG Illumination arrangement for circuit board
WO2013117198A1 (en) * 2012-02-08 2013-08-15 Scanled Ipr Aps An assembly of a construction panel and a light emitting diode
CN107926114A (en) * 2015-09-03 2018-04-17 亮锐控股有限公司 The method for making LED device
US11264737B2 (en) 2019-03-11 2022-03-01 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Solder-free component carrier connection using an elastic element and method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943213A (en) * 1997-11-03 1999-08-24 R-Amtech International, Inc. Three-dimensional electronic module
DE19834538A1 (en) * 1998-07-31 2000-02-03 Abb Patent Gmbh Electronic installation device used in buildings has liquid crystal display illuminated from rear via light source fitted into opening in surface of printed circuit board for installation device
DE19834538B4 (en) * 1998-07-31 2010-04-08 Abb Ag Electronic installation device for building installation technology with backlit LCD display
EP1647763A1 (en) * 2004-10-12 2006-04-19 Scanatron Technics AG Surgical or medical illuminating device with optimized LED light source
EP1715242A3 (en) * 2005-04-13 2007-08-22 WÜRTH ELEKTRONIK GmbH & Co. KG Illumination arrangement for circuit board
WO2013117198A1 (en) * 2012-02-08 2013-08-15 Scanled Ipr Aps An assembly of a construction panel and a light emitting diode
CN107926114A (en) * 2015-09-03 2018-04-17 亮锐控股有限公司 The method for making LED device
CN107926114B (en) * 2015-09-03 2021-08-06 亮锐控股有限公司 Method for manufacturing LED device
US11264737B2 (en) 2019-03-11 2022-03-01 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Solder-free component carrier connection using an elastic element and method

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