DE4116321A1 - Assembly of sensor-chip on printed circuit board - obtd. by gluing chip to carrier material, attaching to PCB inside ring shaped barrier and filling by injection moulding - Google Patents
Assembly of sensor-chip on printed circuit board - obtd. by gluing chip to carrier material, attaching to PCB inside ring shaped barrier and filling by injection mouldingInfo
- Publication number
- DE4116321A1 DE4116321A1 DE19914116321 DE4116321A DE4116321A1 DE 4116321 A1 DE4116321 A1 DE 4116321A1 DE 19914116321 DE19914116321 DE 19914116321 DE 4116321 A DE4116321 A DE 4116321A DE 4116321 A1 DE4116321 A1 DE 4116321A1
- Authority
- DE
- Germany
- Prior art keywords
- chip
- board
- sensor
- assembly
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Die Erfindung betrifft ein Verfahren zur Häusung von vorzugsweise Sensor-Halbleiterbauelementen in Chip on Boardtechnik, bei denen die Chipoberfläche bzw. die selektiven Sensorflächen frei von Abdeckmaterial sind und bei denen die Chipgeometrie zur Vermeidung von Deformationen insbesondere Durchbiegung stabilisiert ist.The invention relates to a method for housing preferably sensor semiconductor components in chip on Board technology in which the chip surface or selective sensor surfaces are free of masking material and where the chip geometry to avoid deformation deflection in particular is stabilized.
Die Erfindung findet in der Elektronikindustrie vorzugsweise zur Herstellung von Sensor-Halbleiterbauelementen, bei denen die selektiven Flächen frei von Abdeckungen bleiben und die Chipgeometrie nicht wesentlich beeinflußt werden darf, Anwendung.The invention preferably takes place in the electronics industry for the production of sensor semiconductor components in which the selective areas remain free of covers and the Chip geometry must not be significantly influenced, Application.
Es ist bekannt die Hermetisierung der Kontaktbereiche mittels Pasten bestehend aus härtbaren Epoxid- oder Silikonharzen, die mit geeigneten Füllstoff wie Quarzmehl, Al₂O₃ in Pulverform u. a. versetzt mit Pigmenten, abzudecken.The hermeticization of the contact areas is known using pastes consisting of curable epoxy or Silicone resins with suitable filler such as quartz powder, Al₂O₃ in powder form u. a. mixed with pigments to cover.
Es ist weiterhin bekannt Sensorhalbleiterbauelemente in Chip on Boardtechnik zu montieren, die Anschlüsse in Drahtbondtechnik, Beam-Lead oder Tape-Kontaktierung auszuführen und die Kontaktbereiche dosiert mit Abdeckmaterial gegen mechanische und chemische Einflüsse zu schützen, wobei die definierte Laterale Ausbreitung des Abdeckmaterials bzw. die Formgebung nicht genau definiert werden kann.Sensor semiconductor components in chip are also known to mount on board technology, the connections in Wire bonding technology, beam lead or tape contacting perform and the contact areas dosed with Cover material against mechanical and chemical influences protect, the defined lateral spread of the Cover material or the shape not exactly defined can be.
Es ist weiterhin bekannt die partielle Beschichtung der Kontaktbereiche in der mechanischen Abdeckung der selektiven Bereiche durch Folien, z. B. Haftfolie, die nach dem Beschichtungs- und Härtevorgang wieder entfernt werden, durchzuführen.It is also known the partial coating of the Contact areas in the mechanical cover of the selective Areas through foils, e.g. B. adhesive film after the Coating and hardening process are removed again, perform.
Bekannt ist weiterhin die Hermetisierung der Kontaktbereiche im Gießverfahren durchzuführen, wobei die Konfiguration der Hermetisierung durch eine Form gegeben ist.The hermeticization of the contact areas is also known perform in the casting process, the configuration of the Hermetization is given by a form.
Nachteile dieser bekannten Verfahren sind, daß die definierte Formgebung und die Abdeckung der sensitiven Flächen nicht sicher ist und daß die partielle Beschichtung der Sensoroberfläche und völligem Ausfüllen der geometrisch kleinen Volumina unbefriedigend ist.Disadvantages of these known methods are that defined shape and the coverage of the sensitive Areas are not safe and that the partial coating the sensor surface and completely filling the geometrically small volumes is unsatisfactory.
Der Erfindung liegt die Aufgabe zugrunde, die partielle Hermetisierung von Sensor-Halbleiterbauelementen, montiert in Chip on Boardtechnik, bei derThe invention has for its object the partial Hermetization of sensor semiconductor components, assembled in chip on board technology, at
- 1. die laterale Begrenzung der Hermetisierung1. the lateral limitation of the hermeticization
- 2. die Geometrie der partiellen Häusung2. the geometry of the partial housing
- 3. die Dichte des Hermetisierungsmaterials3. the density of the hermetic material
reproduzierbar beherrscht wird und dabei die durch die hohe Ausdehnung des Leiterkartenmaterials und des Plasts zur Hermetisierung erzeugten Deformation bzw. Verbiegung der Chips gering gehalten wird.is reproducibly mastered and the high Expansion of the circuit board material and the plastic for Hermetization caused deformation or bending of the Chips is kept low.
Nachstehend soll die Erfindung beispielhaft erläutert werden.The invention is explained below by way of example will.
Zur selektiven Häusung von Sensorhalbleiterbauelementen wird zunächst das Sensorchip auf einem Zwischenträger etwa gleicher lateraler Geometrie mittels eines dünnen Laminats, welches beidseits mit einer nicht gehärteten polymerisierba ren Schicht versehen ist, befestigt. Der zu verwendende Zwischenträger soll dabei gleichen oder kleinen Ausdehnungskoeffizienten aufweisen z. B. Quarzglas oder Silizium bei Aufbau eines Sensorchips aus Silizium. Die Materialdicken Sensorchip zu Chipträger verhalten sich wie 1 : 1.For the selective packaging of sensor semiconductor components first the sensor chip on an intermediate carrier, for example same lateral geometry using a thin laminate, which is coated on both sides with an uncured polymerisable Ren layer is attached. The one to use Intermediate carrier should be the same or small Expansion coefficients have z. B. quartz glass or Silicon when building a sensor chip made of silicon. The Material-thick sensor chip to chip carrier behave like 1: 1.
Die Montage erfolgt unter einer Temperatur z. B. bei 160°C ca. 1,5 h, wobei Sensorchip und Zwischenträger unter Zwischenlage der Laminatfolie zwischen ebene Platten gespannt werden. Die Chipoberfläche ist während des Härtevorganges mit einer Schutzfolie abgedeckt. Durch den Abkühlvorgang werden Sensorchip und Chipträger gegeneinander verspannt und damit die Geometrie, besonders die Ebenheit der Sensoroberfläche stabilisiert. Auf die mit der Anschlußkonfiguration versehene Leiterplatte wird eine zweite nichtstrukturierte Leiterplatte, die im Bereich des einzubauenden Sensors einschließlich der Anschlüsse durchbrochen ist, auflaminiert. Die Materialdicke der mit den Durchbrüchen versehenen Leiterplatte wird so gewählt, daß diese gegenüber dem Sensorchip mit Zwischenträger 10-50 µm geringer ist. Anschließend wird das so vorbereitete Sensorchip in die Kavität des Leiterkartenlaminats vorzugsweise durch Klebverbindung eingesetzt. Nach diesem Montageschritt wird die Leiterplatte mit dem Sensorchip in die Spritzpreßform eingesetzt und die Freiräume unter Druck bei einer Temperatur von 150-180°C ausgespritzt.The assembly takes place under a temperature z. B. at 160 ° C. approx. 1.5 h, with the sensor chip and intermediate carrier under Interlayer of the laminate film between flat panels be excited. The chip surface is during the Hardening process covered with a protective film. By the The cooling process is the sensor chip and chip carrier against each other tense and thus the geometry, especially the flatness stabilizes the sensor surface. On the one with the Connection configuration provided PCB is a second unstructured circuit board, which is in the area of sensor to be installed including the connections is broken, laminated. The material thickness of the with the printed circuit board provided with openings is selected so that this compared to the sensor chip with intermediate carrier 10-50 µm is less. Then the prepared Sensor chip in the cavity of the printed circuit board laminate preferably used by adhesive bonding. After this Assembly step is the circuit board with the sensor chip in the injection mold and the free spaces under pressure sprayed at a temperature of 150-180 ° C.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19914116321 DE4116321A1 (en) | 1991-05-16 | 1991-05-16 | Assembly of sensor-chip on printed circuit board - obtd. by gluing chip to carrier material, attaching to PCB inside ring shaped barrier and filling by injection moulding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19914116321 DE4116321A1 (en) | 1991-05-16 | 1991-05-16 | Assembly of sensor-chip on printed circuit board - obtd. by gluing chip to carrier material, attaching to PCB inside ring shaped barrier and filling by injection moulding |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4116321A1 true DE4116321A1 (en) | 1991-11-28 |
Family
ID=6431954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19914116321 Ceased DE4116321A1 (en) | 1991-05-16 | 1991-05-16 | Assembly of sensor-chip on printed circuit board - obtd. by gluing chip to carrier material, attaching to PCB inside ring shaped barrier and filling by injection moulding |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE4116321A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4241333A1 (en) * | 1991-12-09 | 1993-06-17 | Mitsubishi Electric Corp | Semiconductor sensor for flow meter - contains semiconducting chip with sensor element contg. flow detector element with heating and temp. sensitive elements. |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3330975A1 (en) * | 1983-08-27 | 1985-03-21 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method and apparatus for encapsulating a semiconductor component |
DE3508385A1 (en) * | 1984-03-09 | 1985-09-26 | Osakeyhtiö Lohja Ab, Virkkala | METHOD FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS THAT ARE ARRANGED ON A CARRIER TAPE |
US4644384A (en) * | 1984-02-02 | 1987-02-17 | National Semiconductor Corporation | Apparatus and method for packaging eprom integrated circuits |
US4698662A (en) * | 1985-02-05 | 1987-10-06 | Gould Inc. | Multichip thin film module |
DE3635375C2 (en) * | 1986-10-17 | 1988-07-21 | W.C. Heraeus Gmbh, 6450 Hanau, De | |
EP0306890A1 (en) * | 1987-09-11 | 1989-03-15 | Fairchild Semiconductor Corporation | A semiconductor module having active devices disposed in substrate cavities |
DD273527A1 (en) * | 1988-06-27 | 1989-11-15 | Tech Hochschule C Schorlemmer | METHOD FOR THE SECULATION OF SEMICONDUCTOR SENSORS |
US4905075A (en) * | 1986-05-05 | 1990-02-27 | General Electric Company | Hermetic semiconductor enclosure |
US4949148A (en) * | 1989-01-11 | 1990-08-14 | Bartelink Dirk J | Self-aligning integrated circuit assembly |
US4975765A (en) * | 1988-07-22 | 1990-12-04 | Contraves Ag | Highly integrated circuit and method for the production thereof |
DE3917519A1 (en) * | 1989-05-30 | 1990-12-06 | Rump Elektronik Tech | Identification appts. for unknown gaseous substances |
DE3937522A1 (en) * | 1989-11-10 | 1991-05-16 | Texas Instruments Deutschland | SEMICONDUCTOR PRESSURE SENSOR CONNECTED TO A CARRIER ELEMENT |
-
1991
- 1991-05-16 DE DE19914116321 patent/DE4116321A1/en not_active Ceased
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3330975A1 (en) * | 1983-08-27 | 1985-03-21 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method and apparatus for encapsulating a semiconductor component |
US4644384A (en) * | 1984-02-02 | 1987-02-17 | National Semiconductor Corporation | Apparatus and method for packaging eprom integrated circuits |
DE3508385A1 (en) * | 1984-03-09 | 1985-09-26 | Osakeyhtiö Lohja Ab, Virkkala | METHOD FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS THAT ARE ARRANGED ON A CARRIER TAPE |
US4698662A (en) * | 1985-02-05 | 1987-10-06 | Gould Inc. | Multichip thin film module |
US4905075A (en) * | 1986-05-05 | 1990-02-27 | General Electric Company | Hermetic semiconductor enclosure |
DE3635375C2 (en) * | 1986-10-17 | 1988-07-21 | W.C. Heraeus Gmbh, 6450 Hanau, De | |
EP0306890A1 (en) * | 1987-09-11 | 1989-03-15 | Fairchild Semiconductor Corporation | A semiconductor module having active devices disposed in substrate cavities |
DD273527A1 (en) * | 1988-06-27 | 1989-11-15 | Tech Hochschule C Schorlemmer | METHOD FOR THE SECULATION OF SEMICONDUCTOR SENSORS |
US4975765A (en) * | 1988-07-22 | 1990-12-04 | Contraves Ag | Highly integrated circuit and method for the production thereof |
US4949148A (en) * | 1989-01-11 | 1990-08-14 | Bartelink Dirk J | Self-aligning integrated circuit assembly |
DE3917519A1 (en) * | 1989-05-30 | 1990-12-06 | Rump Elektronik Tech | Identification appts. for unknown gaseous substances |
DE3937522A1 (en) * | 1989-11-10 | 1991-05-16 | Texas Instruments Deutschland | SEMICONDUCTOR PRESSURE SENSOR CONNECTED TO A CARRIER ELEMENT |
Non-Patent Citations (4)
Title |
---|
CHEN, Cherh-Lin * |
EPP, Febr. 1991, S. 82-83 * |
et.al.: Packing Technolgy for a Low Temperature Astometric Sensor Array. In: IEEE Transactions on Components, Hybrids and Manufactu-ring Technology, vol.13, No.4, December 1990, S.1083-1089 * |
HEUBERGER, Anton: Mikromechanik, Springer-Verlag, Berlin 1989,S.470-476 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4241333A1 (en) * | 1991-12-09 | 1993-06-17 | Mitsubishi Electric Corp | Semiconductor sensor for flow meter - contains semiconducting chip with sensor element contg. flow detector element with heating and temp. sensitive elements. |
US5396795A (en) * | 1991-12-09 | 1995-03-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor sensor device for measuring intake flow rate |
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Legal Events
Date | Code | Title | Description |
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OAV | Applicant agreed to the publication of the unexamined application as to paragraph 31 lit. 2 z1 | ||
OR8 | Request for search as to paragraph 43 lit. 1 sentence 1 patent law | ||
8122 | Nonbinding interest in granting licenses declared | ||
8105 | Search report available | ||
8110 | Request for examination paragraph 44 | ||
8131 | Rejection |