DE4100865A1 - Use of reactive substrate in thick film resistor mfr. - has thick dielectric layer acting as adhesion promoter and insulating layer, between resistor layer and substrate - Google Patents

Abstract

Layered devices with conductor and resistor layers in thick film technology are made on substrates of pref. Y-Fe-garnet, ferrite or AlN. The feature is that a dielectric layer, which acts as adhesion promoter and insulating layer, is provided between the resistor layer and the substrate. In the pref. process the dielectric layer is first printed and fired, then the conductor layer is printed and fired, and possibly additional layers individually fired, and finally the resistor layer is printed and fired, pref. as a paste compatible with a conductor layer using Cu, Ag, Ag/Pd or Au/Pd. A final coating layer can be deposited and/or a noble metal layer applied. USE/ADVANTAGE - The intermediate dielectric layer allows resistor layers to be used which would react with the substrate material in the absence of the layer, either during firing or during laser trimming.

Description

The invention relates to a layer circuit with Lei ter structures and resistors in thick-film technology on kera mix substrate materials, if not based on them are built up of aluminum oxide.

Layer circuits in thick film technology (Ag / Pd, Au / Pd and other paste systems to be burned in air as well as Cu-Pa systems) on the above-mentioned substrate materials, esp special yttrium iron garnet and ferrite materials usually made with chip resistors because of resistance pastes either react with the substrate material or cannot be compared with lasers (aluminum nitride substrates decompose during laser adjustment to form a lei Al layer). An integration of film resistors is thus in thick-film technology on the like materials not possible.

For frequencies at which the parasitic reactances (Indukti vities, capacities) of chip resistors are intolerable layer circuits on non-ceramic materials the completely manufactured in thin film technology or the integrated Resistor as a separate circuit on aluminum oxide ceramic will be realized. The latter variant requires one additional hybridization process, d. H. Applying a bondver bond between thick film and thin film circuit, as well as the Structure of the two components on an additional carrier plate. The carrier plate in turn requires a larger one Space in the parent assembly. Both procedures are therefore very expensive.

The invention is based, for a layered scarf device of the type mentioned at the beginning to create a solution with which the resistors are integrated in a simple manner.

This object is achieved according to the invention by a Adhesive and insulating layer serving dielectric layer between the substrate material and consist of resistance layers the integrated resistors. This insulating layer prevents the reaction of the resistance paste with the substrate material during Branding. It is the first layer before the ladder is printed tracks and possible crossings applied and switched on burns.

In a method for producing such a layered scarf The first step is a dielectric layer using screen printing technology nik applied and baked on the substrate material finally a conductor track layer and possibly necessary other layers printed and baked and there after printing the resistance layer (s) with a suitable one Sieve and penetration of the resistance layer (s) made. This process enables the production of integrated resistors stands in thick film technology in layer circuits on different those ceramic substrate materials (e.g. garnet, ferrite, aluminum minium nitride). This applies to paste systems that are in the air, as well as those that are burned in nitrogen.

Advantageous refinements and developments of the Erfin subject matter are specified in subclaims 3 and 4 ben.

The invention based on one in the drawing illustrated embodiment explained in more detail.

Figs. 1 and 2 show the individual steps in the preparation of an integrated resistor with a Ag / Pd paste system garnet substrate. Initially occurs, the pressure of a dielectric layer 2 with a suitable sieve to the substrate material 1 and the penetration of the dielectric layer. 2 A conductor layer 3 is then printed on - FIG. 1 shows the baked dielectric 2 and the printed conductor layer 3 . After the printing and firing of the conductor layer 3 and all other layers that may be required (e.g. conductor tracks and dielectrics for multi-layer applications), the resistance layer (s) 4 is printed with a suitable screen. This process state of a fired dielectric 2 and a burned-in conductor track 3 and printed resistor 4 is shown in FIG. 2. The circuit is finished with the subsequent firing of the resistance layer (s) 4 . Subsequently, the production of cover layers (over-glazing, protective lacquer) and, if necessary, a surface refinement by chemical or galvanic gold can take place.

Claims (4)

1. Layer circuit with conductor structures and resistors in thick-film technology on ceramic substrate materials, preferably yttrium-iron-garnet, ferrite or aluminum nitride, characterized by a dielectric layer serving as an adhesive and insulating layer between the substrate material and the integrated resistors consisting of resistance layers. 2. Method for producing a layer circuit according to An saying 1, characterized, that first a dielectric layer using screen printing technology is applied and baked onto the substrate material finally a conductor track layer and possibly necessary other layers are printed and baked and then the pressure of the resistance layer (s) with a ge suitable sieve and the penetration of the resistance layer (s) follows. 3. The method according to claim 2, marked by the subsequent production of cover layers and one any surface finishing provided. 4. The method according to claim 2 or 3, characterized, that the resistance layer as a paste (for conductor paste, e.g. Cu, Ag, Ag / Pd, Au / Pd paste, compatible resistance paste) is applied.