DE4038765A1 - Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate - Google Patents

Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate

Info

Publication number
DE4038765A1
DE4038765A1 DE4038765A DE4038765A DE4038765A1 DE 4038765 A1 DE4038765 A1 DE 4038765A1 DE 4038765 A DE4038765 A DE 4038765A DE 4038765 A DE4038765 A DE 4038765A DE 4038765 A1 DE4038765 A1 DE 4038765A1
Authority
DE
Germany
Prior art keywords
solder
substrate
laser
film
cuts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4038765A
Other languages
German (de)
Inventor
Johannes Lebong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Patent GmbH
Original Assignee
ABB Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Patent GmbH filed Critical ABB Patent GmbH
Priority to DE4038765A priority Critical patent/DE4038765A1/en
Publication of DE4038765A1 publication Critical patent/DE4038765A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

In a process for applying solder to a substrate e.g. electronic components, solder in the form of a continuous film passes between a laser and the substrate below. A predetermined contour is cut from the solder film and falls under gravity onto the preheated substrate below. Control of the laser cutting profile and positioning of the substrate are automatic. USE/ADVANTAGE - The process feeds and applies solder film in a given shape to a substrate, typically electrical components, is automatic and reduces costs.

Description

Die Erfindung betrifft ein Verfahren zum Beschicken und Benetzen eines Substrates mit Lot, insbesondere in Fo­ lienform.The invention relates to a method for loading and Wetting a substrate with solder, especially in fo lienform.

Mit dem Begriff "Substrat" mögen jedwede Elemente ver­ standen werden, die durch Loteinsatz elektrisch bzw. me­ chanisch miteinander zu verbinden sind. Ein bevorzugtes Anwendungsgebiet des Verfahrens ist das automatisierte Löten in der Fertigung von Bauteilen der Leistungselek­ tronik (z. B. "Power-Module"). In Frage komnt auch ein Verlöten von aktiven Teilen und von Anschlußteilen ganz allgemeiner Art in der Elektrotechnik. With the term "substrate" any elements ver stand, which are electrically or me are to be connected with one another A preferred one The field of application of the method is automated Soldering in the production of components of the power electronics tronics (e.g. "Power modules"). A question may also arise Soldering of active parts and connection parts all general type in electrical engineering.  

Es gilt, im Rahmen eines automatisierten Lötprozesses auf bestimmte Positionen der Substratoberfläche Lot auf­ zubringen. Bekannte Lösungen sehen vor, ausgestanzte Lotplättchen manuell in Lötformen, die über die Substra­ te gelegt sind, einzubringen. Der eigentliche Lötprozeß findet dann in einem Durchlaufofen statt, der mit den Formen beschickt wird. Dieses Verfahren ist zeitaufwen­ dig, fehleranfällig und wegen der Notwendigkeit von Löt­ formen recht unflexibel. Zudem ist wegen des Durchlauf­ ofens ein hoher Energiebedarf erforderlich.It applies as part of an automated soldering process solder to certain positions on the substrate surface bring to. Known solutions provide punched out Solder platelets manually in solder molds, which are on the substra are laid. The actual soldering process then takes place in a continuous furnace, which with the Forms is loaded. This process is time consuming dig, error prone and because of the need for soldering shape quite inflexible. Also because of the run a high energy requirement is required.

Die Aufgabe der Erfindung ist es, für das Verfahren ei­ nen höheren Automatisierungsgrad zu erreichen und dabei den Aufwand insgesamt zu verringern.The object of the invention is to egg for the method to achieve a higher level of automation and thereby to reduce the overall effort.

Die Lösung gelingt mit den kennzeichnenden Merkmalen des Anspruches 1.The solution is achieved with the characteristic features of the Claim 1.

Dazu wird z. B. wie folgt verfahren:For this, z. B. proceed as follows:

Zwischen einem Laser und dem Substrat ist ein Lötfolien­ band angeordnet. Das Substrat bzw. dessen Unterlage wird zun Laser rechnergesteuert positioniert; letzterer schneidet, ebenfalls rechnergesteuert, aus der Folie ei­ ne geeignete Form heraus.There is a solder foil between a laser and the substrate band arranged. The substrate or its base is Positioned computer controlled for laser; the latter cuts, also computer-controlled, egg from the foil a suitable form.

Dazu "schreibt" der Laser eine Figur auf das Substrat, was durch rechnergesteuerte Strahlablenkung geschehen kann. Größere zu lötende Flächen werden durch rechnerge­ steuertes Nachführen des Substrates erzeugt. To do this, the laser "writes" a figure on the substrate, what happens through computer controlled beam deflection can. Larger areas to be soldered are created by computer controlled tracking of the substrate generated.  

Das Ausschmelzen einer geeigneten Kontur aus dem Folien­ band sowie das Aufschmelzen auf das evtl. vorgeheizte Substrat mittels Laserenergie erfolgt vorzugsweise in einem Arbeitsgang, dabei wird das Aufschmelzen z. B. durch mäanderförmiges Abscannen eines Lotflächenberei­ ches durch den Laserstrahl erreicht. Bei größeren zu lö­ tenden Flächen wird wiederum das Substrat nachgeführt werden. Die Energiedichte wird dabei durch die Scanner­ geschwindigkeit, die Fokussierung oder durch Pulsbetrieb eingestellt.Melting a suitable contour from the foil band and melting onto the possibly preheated Substrate using laser energy is preferably made in one operation, the melting z. B. by meandering scanning of a solder area ches achieved by the laser beam. To be solved for larger ones the substrate is again tracked will. The energy density is determined by the scanner speed, focusing or by pulse operation set.

Wird ein Verfahren gewählt, bei dem das Aufschmelzen des Lotes nicht durch Laserenergie erfolgt, so gelangt das ausgeschnittene Lotplättchen, z. B. durch Schwerkraft, auf das vorgeheizte Substrat und wird dort aufgeschmol­ zen. Bei diesem Verfahren wird zwischen Lötfolie und Substrat natürlich ein Abstand einzuhalten sein.If a method is selected in which the melting of the Solder is not done by laser energy, so that happens cut out solder platelets, e.g. B. by gravity, on the preheated substrate and is melted there Zen. In this process, between solder foil and The substrate must of course be kept at a distance.

Nach einem Lötvorgang werden Lötfolienband und/oder Sub­ stratunterlage - wiederum rechnergesteuert - für eine weitere Lötstelle neu positioniert. Das zuvor beschrie­ bene Verfahren eignet sich besonders für konturierte, flächige Lötstellen. Um den Schwerkrafttransport des ausgeschnittenen Lötplättchens zu ermöglichen, sollte das Lötfolienband parallel zum Substrat ausgerichtet sein und horizontal verlaufen.After a soldering process, solder tape and / or sub strat document - again computer controlled - for one repositioned another solder joint. That previously described bene method is particularly suitable for contoured, flat solder joints. In order to transport the gravity of the should allow cut out solder pads the tape is aligned parallel to the substrate be and run horizontally.

Das Folienband kann von einer Rolle, die als Magazin dient, abgerollt und auf eine weitere Rolle aufgerollt werden. Dabei sollte das Band stets unter einer gewissen Zugspannung gehalten werden. Mit Hilfe einer Spannein­ richtung, etwa aus zwei Spannarmen gebildet, wird das Folienband parallel zum Substrat geführt. The foil tape can be from a roll that acts as a magazine serves, unrolled and rolled up on another roll will. The tape should always be below a certain level Tension can be kept. With the help of a span direction, approximately formed from two clamping arms, that is Foil tape guided parallel to the substrate.  

Denkbar ist auch eine solche Verfahrensvariante, bei der das auf das Substrat abgesenkte Folienband zunächst durch einen Laserstrahl nur "angeheftet" - also punkt­ förmig am Substrat angeschmolzen wird, und danach erst die geeignete Kontur aus dem Band herausgetrennt wird. Dabei wird das Substrat noch nicht auf die Schmelztempe­ ratur des Lotes vorgeheizt sein. Dieses Verfahren hat den Vorteil, daß das Lötfolienband von vorn herein si­ cher und unverrückbar fixiert ist.Such a method variant is also conceivable in which the film strip lowered onto the substrate initially only "pinned" by a laser beam - ie point is melted onto the substrate, and only after that the appropriate contour is cut out of the tape. The substrate is not yet on the melting temperature rature of the solder to be preheated. This procedure has the advantage that the solder foil tape si from the beginning fixed and immovable.

Bei etwa punktförmigen Lötstellen ist auch eine Variante denkbar, bei der das auf das Substrat abgesenkte Folien­ band vom Laser abgeschmolzen und gleichzeitig in einem einzigen Vorgang auf das Substrat aufgeschmolzen wird. Hierbei hat das nicht vom Laserstrahl behandelte Sub­ strat eine Temperatur unterhalb der Schmelztemperatur des Lotes. Dieses Verfahren ist sehr genau und bedarf nur eines Arbeitsschrittes.A variant is also available for punctiform solder joints conceivable in which the film lowered onto the substrate band melted by the laser and simultaneously in one is melted onto the substrate in a single operation. Here, the sub not treated by the laser beam strat a temperature below the melting temperature of the solder. This procedure is very precise and requires just one step.

Grundsätzlich sollte das Verfahren in einer Schutzgasat­ mosphäre vorgenommen werden, um die Reinheit der Löt­ stellen zu gewährleisten.Basically, the process should be in a protective gas atmosphere be made to the purity of the solder to ensure.

Eine Vorrichtung zur Durchführung des Verfahrens ist beispielhaft in schematischen Skizzen dargestellt, die nachfolgend erläutert werden.An apparatus for performing the method is exemplified in schematic sketches that are explained below.

Es zeigen:Show it:

Fig. 1 die in Position gebrachte Vorrichtung vor Ab­ trennung des Folienbandes, Fig. 1, placed in position before device separation from the film strip,

Fig. 2 das Abtrennen des Folienbandes durch den La­ ser, Fig. 2 shows the separation of the film strip by the ser La,

Fig. 3 die Zwischenstufe, bei der das ausgeschnittene Lötplättchen sich auf das Substrat auflegt, Fig. 3 shows the intermediate stage in which the cut is Lötplättchen hangs up on the substrate,

Fig. 4 die Vorrichtung nach Aufschmelzen des Lot­ plättchens. Fig. 4 shows the device after melting the solder plate.

Mit 1 ist eine beheizbare Positioniereinrichtung be­ zeichnet, auf der ein Substrat 2, z. B. elektronische Bauteile, angeordnet ist. Von einer Rolle 3, die als Folienmagazin dient, ist das Lot in Form eines Lötfo­ lienbandes 4 zu einer weiteren Rolle 5 geführt. Eine Spanneinrichtung in Form zweier im Abstand zueinander angeordneter Spannarme 6, 6a drückt auf das Folienband 4 und hält es parallel zum Substrat 2. Die Rollen 3, 5 halten das Folienband unter einem gewissen Zug, d. h. z. B., die Rolle 3 läßt sich nur dann in Abrollrichtung bewegen, wenn eine gewisse Zugkraft des Folienbandes überschritten ist, und die gesperrte Rolle 5 wird nur bei Anforderung von einem Antrieb in Aufrollrichtung ge­ dreht. Die Rollen 3, 5 samt Spannarme 6, 6a können in Richtung auf das Substrat beweglich ausgeführt sein, um das Folienband 4 beliebig nahe an das Substrat zu brin­ gen.With 1 , a heatable positioning device is characterized, on which a substrate 2 , z. B. electronic components is arranged. From a roll 3 , which serves as a film magazine, the solder is guided in the form of a solder tape 4 to a further roll 5 . A clamping device in the form of two mutually spaced clamping arms 6, 6 a pressed onto the film tape 4 and holds it parallel to the substrate. 2 The rollers 3 , 5 hold the film strip under a certain tension, that is to say, for example, the roller 3 can only be moved in the unwinding direction when a certain tensile force of the film strip is exceeded, and the locked roller 5 is only moved in when requested by a drive Rolling direction rotated. The rollers 3 , 5 together with tensioning arms 6 , 6 a can be designed to be movable in the direction of the substrate in order to bring the film strip 4 as close as desired to the substrate.

Der Laser 7 ist im gezeigten Beispiel in einer Festposi­ tion über dem Folienband 4 sowie dem Substrat 2 instal­ liert. Fig. 2 zeigt den Laser in Aktion, er trennt durch Strahlung, (siehe Laserstrahlen 8), ein für das Substrat geeignetes mit irgendeiner Kontur versehenes Lötfolienplättchen 4a aus dem Band 4 heraus. Das abge­ trennte Lotmaterial senkt sich mit Hilfe der Schwerkraft - ggf. unterstützt durch eine Ansaugeinrichtung, auf das Substrat 2 ab und wird dort aufgeschmolzen (siehe Fig. 3). In the example shown, the laser 7 is installed in a fixed position over the film strip 4 and the substrate 2 . Fig. 2 shows the laser in action, it separates by radiation (see laser beams 8 ), a suitable for the substrate provided with any contour solder foil plate 4 a out of the band 4 . The separated solder material lowers with the help of gravity - possibly supported by a suction device - onto the substrate 2 and is melted there (see FIG. 3).

Aus der Position gemäß Fig. 4 verfährt die Positionie­ reinrichtung 1 in eine neue Stellung, in der ein anderes Substrat unter dem Laser in Strahlstellung gelangt. Bei Bedarf wird das Folienband 4 automatisch weitertranspor­ tiert.From the position shown in FIG. 4, the procedure Positionin device 1 to a new position in which a different substrate under the laser beam in position reached. If necessary, the film strip 4 is automatically transported further.

Die Vorgänge, wie Transport des Folienbandes, Ausschnei­ den desselben, Verfahren der Positioniereinrichtung 1 sowie Strahlablenkung des Lasers und dessen Fokussierung sind rechnergesteuert und laufen automatisch ab.The processes, such as transport of the film strip, cutting out the same, method of the positioning device 1 and beam deflection of the laser and its focusing are computer-controlled and run automatically.

Dabei kann der Laser- und/oder die Positioniereinrich­ tung beweglich ausgeführt sein und vorbestimmte Punkte bzw. Bereiche in einem Koordinatensystem anfahren.The laser and / or the positioning device can device be designed to be movable and predetermined points or move to areas in a coordinate system.

Zum Ausschneiden des Lötfolienplättchens bzw. zum Lot­ punktesetzen kann der Laser 7 zusätzlich als Ganzes schwenkbar bzw. lediglich in seinem Strahlengang ent­ sprechend beweglich ausgebildet sein.To cut out the solder foil or to set the solder, the laser 7 can additionally be pivoted as a whole or only designed to be movable in its beam path accordingly.

Claims (7)

1. Verfahren zum Beschicken und Benetzen eines Sub­ strates mit Lot, insbesondere in Folienform, dadurch ge­ kennzeichnet, daß das auf einer Positioniervorrichtung (1) angeordnete Substrat (2) sowie ein Laser (7) rech­ nergesteuert zueinander ausgerichtet werden, daß zwi­ schen Laser (7) und Substrat (2) das im Bereich des Sub­ strates in Bevorratung angeordnete Lot durch Laserstrah­ lung - ebenfalls rechnergesteuert - abgelöst, daß das Lot dem Substrat (2) zugeführt wird und das Lot und/oder Substrat für das Aufschmelzen des Lotes aufheizbar sind.1. A method for loading and wetting a sub strate with solder, in particular in the form of a film, characterized in that the arranged on a positioning device ( 1 ) substrate ( 2 ) and a laser ( 7 ) computationally aligned to each other that inter mediate laser ( 7 ) and substrate ( 2 ) the arranged in the sub strate in stock solder by laser radiation - also computer-controlled - replaced that the solder is supplied to the substrate ( 2 ) and the solder and / or substrate for melting the solder can be heated are. 2. Verfahren nach Anspruch 1, dadurch gekennzeich­ net, daß das aufzubringende Lot durch die Laserstrahlung konturiert aus- bzw. abgeschnitten wird.2. The method according to claim 1, characterized in net that the solder to be applied by the laser radiation contoured cut or cut. 3. Verfahren nach Anspruch 1 oder 2, dadurch ge­ kennzeichnet, daß das Lot auf das Substrat (2) aufgelegt wird und mit dem Laserstrahl (8) in einem einzigen Ver­ fahrensschritt das aufzubringende Lot abgetrennt und auf das Substrat (2) aufgeschmolzen wird.3. The method according to claim 1 or 2, characterized in that the solder is placed on the substrate ( 2 ) and with the laser beam ( 8 ) in a single Ver process step, the solder to be applied is separated and melted onto the substrate ( 2 ). 4. Verfahren nach einem der Ansprüche 1 oder 2, da­ durch gekennzeichnet, daß mindestens vorübergehend Lot und Substrat (2) miteinander in Berührung gebracht wer­ den, wobei das Lot am Substrat (2) durch Laserstrahlung angeheftet wird. 4. The method according to any one of claims 1 or 2, characterized in that solder and substrate ( 2 ) are brought into contact with one another at least temporarily, the solder being attached to the substrate ( 2 ) by laser radiation. 5. Verfahren nach einem der Ansprüche 1 bis 4, da­ durch gekennzeichnet, daß ein über Rollen (3, 5) ab- und aufrollbares Lötfolienband (4) über das Substrat (2) vermittels einer Spanneinrichtung (Spannarme 6, 6a) ge­ führt wird.5. The method according to any one of claims 1 to 4, characterized in that a roll of rolls ( 3 , 5 ) rollable and rollable solder tape ( 4 ) on the substrate ( 2 ) by means of a clamping device (clamping arms 6, 6 a) leads GE becomes. 6. Verfahren nach Anspruch 5, dadurch gekennzeich­ net, daß die Spanneinrichtung (Spannarme 6, 6a) und die Rollen (3, 5) relativ zum Substrat bewegbar sind.6. The method according to claim 5, characterized in that the clamping device (clamping arms 6, 6 a) and the rollers ( 3 , 5 ) are movable relative to the substrate. 7. Verfahren nach einem der Ansprüche 1 bis 6, da­ durch gekennzeichnet, daß der Verfahrensablauf in einer Schutzgasatmosphäre stattfindet.7. The method according to any one of claims 1 to 6, there characterized in that the process flow in a Protective gas atmosphere takes place.
DE4038765A 1990-12-05 1990-12-05 Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate Withdrawn DE4038765A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4038765A DE4038765A1 (en) 1990-12-05 1990-12-05 Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4038765A DE4038765A1 (en) 1990-12-05 1990-12-05 Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate

Publications (1)

Publication Number Publication Date
DE4038765A1 true DE4038765A1 (en) 1992-06-11

Family

ID=6419637

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4038765A Withdrawn DE4038765A1 (en) 1990-12-05 1990-12-05 Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate

Country Status (1)

Country Link
DE (1) DE4038765A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995000279A1 (en) * 1993-06-17 1995-01-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and device for metallizing a contact area
WO1995027307A1 (en) * 1994-03-31 1995-10-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and device for producing solder humps
DE19648546A1 (en) * 1996-11-25 1998-05-28 Fontargen Gmbh Process for soldering parts made of solderable materials
DE19829135C2 (en) * 1998-03-31 2001-11-08 Talleres Utilar S A Device for tinning the end clamps for heated vehicle windows
US6369351B1 (en) 1998-08-28 2002-04-09 Patent Treuhand Gesellschaft Fur Elektrische Gluhlampen Mbh Method for processing and for joining, especially, for soldering a component or a component arrangement using electromagnetic radiation
WO2012098205A3 (en) * 2011-01-20 2013-04-11 Schlenk Metallfolien Gmbh & Co. Kg Process for producing pre-tin-plated connectors for pv cells and for tin-plating a metal foil having a groove structure running in one direction
US8829360B2 (en) 2010-11-26 2014-09-09 Schlenk Metallfolien Gmbh & Co. Kg Connector for PV cells and method for its production
DE102013220886A1 (en) * 2013-10-15 2015-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a metallic contacting structure on a semiconductor substrate
WO2023001927A1 (en) * 2021-07-23 2023-01-26 Osram Opto Semiconductors Gmbh Method for applying an electrical connecting material or flux to a component
US11600762B2 (en) 2017-12-14 2023-03-07 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Fabrication of high-temperature superconducting striated tape combinations

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995000279A1 (en) * 1993-06-17 1995-01-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and device for metallizing a contact area
US5653381A (en) * 1993-06-17 1997-08-05 Fraunhofer-Gesellschaft Zur Forderung der Angerwandten Forshung E.V. Process and apparatus for producing a bonded metal coating
WO1995027307A1 (en) * 1994-03-31 1995-10-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and device for producing solder humps
DE19648546A1 (en) * 1996-11-25 1998-05-28 Fontargen Gmbh Process for soldering parts made of solderable materials
DE19648546C2 (en) * 1996-11-25 2001-09-27 Fontargen Gmbh Process for soldering parts made of solderable materials
DE19829135C2 (en) * 1998-03-31 2001-11-08 Talleres Utilar S A Device for tinning the end clamps for heated vehicle windows
US6369351B1 (en) 1998-08-28 2002-04-09 Patent Treuhand Gesellschaft Fur Elektrische Gluhlampen Mbh Method for processing and for joining, especially, for soldering a component or a component arrangement using electromagnetic radiation
US8829360B2 (en) 2010-11-26 2014-09-09 Schlenk Metallfolien Gmbh & Co. Kg Connector for PV cells and method for its production
CN103329286A (en) * 2011-01-20 2013-09-25 施伦克金属箔有限责任两合公司 Process for producing pre-tin-plated connectors for pv cells and metal foil having a groove structure running in one direction
JP2014506011A (en) * 2011-01-20 2014-03-06 シュレンク メタルフォリーエン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンジットゲセルシャフト Method for manufacturing pre-tinned PV cell connector and metal foil with corrugated structure extending in one direction
WO2012098205A3 (en) * 2011-01-20 2013-04-11 Schlenk Metallfolien Gmbh & Co. Kg Process for producing pre-tin-plated connectors for pv cells and for tin-plating a metal foil having a groove structure running in one direction
CN103329286B (en) * 2011-01-20 2016-08-24 施伦克金属箔有限责任两合公司 Manufacture the method for the connector of the pre-plating tin for photovoltaic cell and there is the metal forming of the rill structure extended in one direction
US9865751B2 (en) 2011-01-20 2018-01-09 Schlenk Metallfolien GmbH & Co., KG Method for producing pretinned connectors for PV cells and metal foil with a corrugated structure running in one direction
DE102013220886A1 (en) * 2013-10-15 2015-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a metallic contacting structure on a semiconductor substrate
US11600762B2 (en) 2017-12-14 2023-03-07 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Fabrication of high-temperature superconducting striated tape combinations
WO2023001927A1 (en) * 2021-07-23 2023-01-26 Osram Opto Semiconductors Gmbh Method for applying an electrical connecting material or flux to a component

Similar Documents

Publication Publication Date Title
DE3939812C2 (en) Laser soldering system for SMD elements
DE3423172C2 (en) Method of manufacturing a solar battery
US3889364A (en) Method of making soldered electrical connections
DE19840226B4 (en) Method of applying a circuit chip to a carrier
DE4038765A1 (en) Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate
DE3111809C2 (en) Method and device for machine soldering of workpieces
DE102007042082A1 (en) Device for soldering solar cells, comprises a laser soldering device, which is displaceably formed along a surface of the solar cell to be soldered, a holding-down device, a cooling device for cooling solder joints, and a camera
EP0336232B1 (en) Method for dip-soldering printed-circuit boards
DE3724005C2 (en)
DE19925652A1 (en) Soldering method for manufacture of electronic circuit
DE69112164T2 (en) Apply a solder paste.
EP3009220A1 (en) Roller to roller production assembly for and method of concatenated continuous and discontinuous processing processes
WO2004050287A1 (en) Method for soldering miniaturised components to a base plate
DE102008020383A1 (en) Method for attaching solar cell to conducting film to produce solar cell module, involves soldering contact points, where melted solder passes through clearance holes from bottom and connects conducting film and solar cells with one another
DE3843191C1 (en) Device for soldering
EP0756442B1 (en) Method of soldening components to a carrier foil
DE19931287A1 (en) Method and apparatus for wave soldering
EP2289658A1 (en) Method and device for soldering connection leads with a solar cell
DE102017202426A1 (en) TLS method and TLS device
WO2006087301A2 (en) Method and device for connecting semiconductor or interposer components to a supporting strip and the use of said device
EP0569423B1 (en) Process for soldering materials like printed circuit boards or sets of components in electronics or metals in engineering work
EP3403103B1 (en) Method for placing and making contact with a test contact
DE4105875C1 (en)
EP0642298A1 (en) Method of soldering of electronic components for surface mounting on circuit boards
DE69738553T2 (en) Method of mounting components on a substrate

Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee