DE4036302A1 - Support for electronic components - made of water setting gypsum or cement - Google Patents

Support for electronic components - made of water setting gypsum or cement

Info

Publication number
DE4036302A1
DE4036302A1 DE19904036302 DE4036302A DE4036302A1 DE 4036302 A1 DE4036302 A1 DE 4036302A1 DE 19904036302 DE19904036302 DE 19904036302 DE 4036302 A DE4036302 A DE 4036302A DE 4036302 A1 DE4036302 A1 DE 4036302A1
Authority
DE
Germany
Prior art keywords
cement
subrack
rack
electronic components
characterized records
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19904036302
Other languages
German (de)
Inventor
Reinhard Treudler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19904036302 priority Critical patent/DE4036302A1/en
Publication of DE4036302A1 publication Critical patent/DE4036302A1/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
    • C04B28/02—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/60—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
    • C04B41/61—Coating or impregnation
    • C04B41/65—Coating or impregnation with inorganic materials
    • C04B41/69—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/34—Non-shrinking or non-cracking materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Ceramic insulation base for supporting electronic components is made of hard gypsum or cement which sets under the effect of water. The setting expansion is above 0.05%. The gypsum or cement is sealed prior to use. The material used may also be enriched with filler material having ferromagnetic properties. The assembled base plus components may be a conductor plate or a cable tree and the support may be reinforced by struts or mesh. ADVANTAGE - The material used is cheap and readily available as the waste material from desulphurisation plant of coal fired power works. The set material also has a setting expansion as opposed to the prior art ceramic fibre material which has a setting shrinkage

Description

Die Erfindung betrifft einen Baugruppenträger aus keramik­ förmigem Isoliermaterial zur Aufnahme von Elektronikkompo­ nenten.The invention relates to a module rack made of ceramic shaped insulating material to hold electronic compo nenten.

Unter dem Warenzeichen Fiberfrax ist ein hochtemperaturbe­ ständiger Zement bekannt, der aus gemahlenen Keramikfasern und einem anorganischen Binder besteht. Das bekannte Mate­ rial ist verhältnismäßig teuer, da es für hohe Temperaturen vorgesehen ist.Under the trademark Fiberfrax is a high temperature permanent cement known from the ground ceramic fibers and an inorganic binder. The famous mate rial is relatively expensive as it is suitable for high temperatures is provided.

Es ist daher Aufgabe der Erfindung, einen Baugruppenträger aus keramikförmigem Isoliermaterial zur Aufnahme von Elek­ tronikkomponenten anzugeben, der preiswert ist.It is therefore an object of the invention to provide a rack made of ceramic-shaped insulating material to hold elec to specify electronics components, which is inexpensive.

Die Aufgabe der Erfindung wird durch die Merkmale des kenn­ zeichnenden Teils des Patentanspruchs 1 gelöst. The object of the invention is characterized by the features of Drawing part of claim 1 solved.  

Erfindungsgemäß besteht das Isoliermaterial, das den Bau­ gruppenträger bildet, aus Hartgips oder Zement, der unter Wassereinwirkung selbsttätig abbindet und eine Abbindexpan­ sion aufweist. Im Gegensatz dazu weist das bekannte Zement­ material eine Abbindschrumpfung auf.According to the invention there is the insulating material that the construction group carrier forms, from hard plaster or cement, the under Automatically binds water and an Abbindexpan sion. In contrast, the well-known cement material shrinks.

Mittels der Erfindung wird erzielt, daß alle eingebetteten Eletronikkomponenten fest verankert werden. Zudem ist ein derartiger Gips oder Zement äußerst preisgünstig, da er beispielsweise als Abfallprodukt bei Entschwefelungsanlagen von Kohlekraftwerken in großen Mengen anfällt. Die Erfin­ dung ist jedoch nicht nur auf den sogenannten Chemiegips oder synthetischen Gips, wie beispielsweise aus den Ent­ schwefelungsanlagen, beschränkt, sondern es kann auch Na­ turgips verwendet werden.By means of the invention it is achieved that all embedded Electronic components are firmly anchored. There is also a such gypsum or cement extremely inexpensive because it for example as a waste product in desulfurization plants of coal-fired power plants in large quantities. The Erfin However, manure is not only on so-called chemical gypsum or synthetic plaster, such as from Ent sulfur plants, limited, but it can also Na turgypses can be used.

Weitere vorteilhafte Weiterbildungen sind in den Unteran­ sprüchen beschrieben.Further advantageous developments are in the Unteran sayings described.

Bei dem Baugruppenträger kann es sich beispielsweise um eine Leiterplatte handeln. Zum Aufbau werden die Bauteile fixiert und mit der Verdrahtung versehen. Die so weit be­ schriebene Schaltung wird in eine Gießform eingesetzt. Die Gießform wird erfindungsgemäß mit Hartgips oder Zement aus­ gefüllt, der zuvor mit Wasser angerührt wird. Es gibt Gips- oder Zementsorten, die innerhalb von 30 Sekunden bis einer Minute abbinden, so daß die Schaltung aus der Form entnom­ men werden kann. Nach ca. sechsstündigem Austrocknen er­ reicht der Baugruppenträger bzw. die Leiterplatte die End­ härte und ist vollkommen wasserfrei.The subrack can be, for example trade a circuit board. The components are used for construction fixed and provided with the wiring. The so far be written circuit is inserted into a mold. The The casting mold is made according to the invention with hard plaster or cement filled, which is mixed with water beforehand. There are gypsum or types of cement within 30 seconds to one Set the minute so that the circuit is removed from the mold men can be. After drying out for about six hours the subrack or the printed circuit board reaches the end hardness and is completely anhydrous.

Damit die Leiterplatte keine Feuchtigkeit aufnimmt, kann sie mit Lack oder durch Tränken in Öl versiegelt werden. Weiter ist es leicht möglich, den Gips oder den Zement mit Farbstoff anzurühren oder zuvor ein Füllmaterial einzumen­ gen. Bei dem Füllmaterial kann es sich um ferromagnetische Teilchen handeln, so daß alle Bauteile gegen sogenannte EMV-Störungen von innen und außen abgeschirmt sind. Hierzu lassen sich die Bauteile gleichfalls vollständig in dem Isoliermaterial einbetten.So that the circuit board does not absorb moisture, can they are sealed with varnish or by soaking in oil. Furthermore, it is easily possible to use the plaster or cement  Mix dye or fill in a filler beforehand The filling material can be ferromagnetic Act particles so that all components against so-called EMC interference is shielded from the inside and outside. For this the components can also be completely in the Embed insulation material.

Besonders vorteilhaft ist, daß die Form einer derartigen Leiterplatte schnell variiert werden kann und es lassen sich beispielsweise in einfacher Weise sogenannte 3D-Schal­ tungen aufbauen, was räumliche Leiterplatten sind. Die 3D- Schaltung kann sogar vollständig in ein Gehäuse übergehen, so daß beispielsweise bei einem Transistorradiogerät die komplette Elektronik von außen nicht mehr zugänglich einge­ gossen ist. Nur die Bedienelemente werden so eingegossen, daß sie von außen zugänglich sind. Ferner ist es möglich, daß der Baugruppenträger ein Kabelbaum ist, der beispiels­ weise in einem Auto eingesetzt wird. Zur Verringerung des Kabelbaumgewichtes, bei dem die einzelnen Kabeldrähte durch einen Gips- oder Zementstrang zusammengefaßt sind, ist es möglich, als Füllmaterial Holz, Styropor usw. vorzusehen. Ebenso kann der Baugruppenträger Verstärkungselemente wie Verstärkungsstreben oder Verstärkungsgitter aufweisen, ob dies eine Leiterplatte, ein Gehäuse oder ein Kabelbaum ist.It is particularly advantageous that the shape of such a circuit board can be varied quickly and so-called 3D scarf lines can be constructed, for example, in a simple manner, which are spatial circuit boards. The 3- D circuit can even completely merge into a housing, so that, for example in a transistor radio device, the complete electronics are no longer accessible from the outside. Only the controls are cast in such a way that they are accessible from the outside. It is also possible that the subrack is a wire harness that is used, for example, in a car. To reduce the weight of the wiring harness, in which the individual cable wires are combined by a plaster or cement strand, it is possible to use wood, styrofoam, etc. as the filling material. Likewise, the subrack can have reinforcing elements such as reinforcing struts or reinforcing grids, whether this is a printed circuit board, a housing or a wiring harness.

Die verwendeten Gips- oder Zementsorten sind insbesondere aus der Dentaltechnik als Abformmittel bekannt. Hier ist man angestrebt, möglichst Gipssorten zu verwenden, die eine geringe Abbindexpansion aufweisen. Diese Abbindexpansion erweist sich jedoch beim Aufbau des Baugruppenträgers als besonders nützlich, da hierdurch alle Bauteile fest fixiert und gehalten werden. Beispielsweise bei einer Leiterplatte, die erfindungsgemäß mit Hartgips oder Zement gegossen ist, liegen alle Schaltungsverbindungen nach dem vollständigen Aushärten absolut und unverrückbar fest, so daß keine Haar­ risse auftreten können. Ebenso sind Wackelkontakte und kalte Lötstellen ausgeschlossen, da schon die geringe Ab­ bindexpansion von Dentalgipsen ausreicht, die Kontaktstelle ohne Löten fest miteinander durch Druck zu verbinden. Zwar weist der Gips oder der Zement Brucheigenschaften auf, die einer üblicher Kunststoffleiterplatte nicht nachstehen, doch wird die Festigkeit durch die hinterschnittenen Schal­ tungsteile und Verdrahtung weiter erhöht. Hier wirken Ab­ bindexpansion, die Formbeständigkeit und die eingelagerten Elektronikkomponenten zusammen, so daß sich ähnlich wie bei einem Haus mit Stahlgeflecht im Beton hohe Festigkeiten er­ zielen lassen.The types of plaster or cement used are special known from dental technology as an impression material. Here is one strives to use gypsum varieties if possible, the one have low index expansion. This Abbindex expansion turns out to be the case when assembling the subrack Particularly useful because it fixes all components firmly and be held. For example, with a printed circuit board, which is cast according to the invention with hard plaster or cement, are all circuit connections after the complete Cure absolutely and immovably firm, so no hair cracks can occur. There are also loose contacts and  cold solder joints excluded, since the low Ab bindexpansion of dental plaster is sufficient, the contact point without soldering to firmly connect to each other by pressure. Though the gypsum or cement has fracture properties that not inferior to a common plastic circuit board, yet the firmness is due to the undercut scarf parts and wiring further increased. From here work bindexpansion, the dimensional stability and the stored Electronic components together, so that similar to a house with steel mesh in concrete high strength let it aim.

Ebenso bereitet die Entsorgung der erfindungsgemäßen Bau­ gruppenträger keine Schwierigkeiten, da der Baugruppenträ­ ger zermahlen und die Metallteile von den Gipsteilen ge­ trennt werden können. Ein Recycling der Metallteile ist da­ mit möglich.The disposal of the construction according to the invention also prepares rack no problems, since the rack ground and the metal parts from the plaster parts can be separated. There is a recycling of the metal parts with possible.

Die Erfindung ist nicht auf die beschriebenen Formen von Baugruppenträgern beschränkt. Ebenso kann die Verdrahtung bei den Leiterplatten durch Wire-Wrap-Technik erfolgen, weshalb ein Löten nicht erforderlich ist. Ebenso lassen sich die Leiterbahnen auf eine erste ausgehärtete Grund­ platte galvanisch oder in Pulverform auftragen. An­ schließend wird eine Deckgipsschicht aufgetragen, wobei die Bauteile wiederum mit eingegossen werden können.The invention is not limited to the forms described Racks limited. Likewise, the wiring printed circuit boards are made using wire wrap technology, which is why soldering is not necessary. Leave as well the conductor tracks on a first hardened ground Apply plate galvanically or in powder form. On finally a layer of plaster is applied, the Components can be cast in turn.

Claims (9)

1. Baugruppenträger aus keramikförmigem Isoliermaterial zur Aufnahme von Elektronikkomponenten, dadurch gekennzeichnet, daß das Isoliermaterial unter Wassereinwirkung abbindender Hartgips oder Zement ist, der Abbindexpansionseigenschaften aufweist.1. Subrack made of ceramic-shaped insulating material for receiving electronic components, characterized in that the insulating material is hard plaster or cement which sets under the action of water and has the index-expansion properties. 2. Baugruppenträger nach Anspruch 1, dadurch gekennzeich­ net, daß die Abbindexpansion größer als 0,05% ist.2. Subrack according to claim 1, characterized net that the index expansion is greater than 0.05%. 3. Baugruppenträger nach Anspruch 1-2, dadurch gekenn­ zeichnet, daß der Hartgips oder der Zement versiegelt ist. 3. Subrack according to claim 1-2, characterized records that the hard plaster or cement is sealed.   4. Baugruppenträger nach Anspruch 1-3, dadurch gekenn­ zeichnet, daß der Hartgips oder der Zement mit einem Füll­ material angereichert ist.4. Subrack according to claims 1-3, characterized records that the hard plaster or cement with a filling material is enriched. 5. Baugruppenträger nach Anspruch 4, dadurch gekennzeich­ net, daß das Füllmaterial ferromagnetische Eigenschaften aufweist.5. Subrack according to claim 4, characterized net that the filler material has ferromagnetic properties having. 6. Baugruppenträger nach Anspruch 1-5, dadurch gekenn­ zeichnet, daß der Baugruppenträger eine Leiterplatte, ins­ besondere eine 3D-Schaltung ist.6. Subrack according to claims 1-5, characterized records that the subrack a circuit board, ins special is a 3D circuit. 7. Baugruppenträger nach Anspruch 1-5, dadurch gekenn­ zeichnet, daß der Baugruppenträger ein Gehäuse ist, in das alle Bauteile zusammen mit der Verdrahtung eingegossen sind.7. Rack according to claim 1-5, characterized records that the rack is a housing in which all components cast in together with the wiring are. 8. Baugruppenträger nach Anspruch 1-5, dadurch gekenn­ zeichnet, daß der Baugruppenträger ein Kabelbaum ist.8. Rack according to claim 1-5, characterized records that the rack is a wire harness. 9. Baugruppenträger nach Anspruch 1-8, dadurch gekenn­ zeichnet, daß in den Baugruppenträger Verstärkungsstreben oder Verstärkungsgitter eingelegt sind.9. Rack according to claim 1-8, characterized records that in the subrack reinforcing struts or reinforcement grids are inserted.
DE19904036302 1990-11-14 1990-11-14 Support for electronic components - made of water setting gypsum or cement Ceased DE4036302A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19904036302 DE4036302A1 (en) 1990-11-14 1990-11-14 Support for electronic components - made of water setting gypsum or cement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19904036302 DE4036302A1 (en) 1990-11-14 1990-11-14 Support for electronic components - made of water setting gypsum or cement

Publications (1)

Publication Number Publication Date
DE4036302A1 true DE4036302A1 (en) 1992-05-21

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DE19904036302 Ceased DE4036302A1 (en) 1990-11-14 1990-11-14 Support for electronic components - made of water setting gypsum or cement

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DE (1) DE4036302A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019209252A1 (en) * 2019-06-26 2020-12-31 Te Connectivity Germany Gmbh Carrier structure, cell contact system and manufacturing process

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE319924C (en) * 1915-03-27 1920-04-03 Wilhelm Streitzig Cement compound for electrical switchboard and insulating panels
EP0203333B1 (en) * 1985-05-30 1989-09-13 Giulini Chemie GmbH Method of producing moulds, patterns and tools on base of hard gypsum and/or cement
DE3811572A1 (en) * 1988-03-31 1989-10-19 System Elektronik Gmbh Berlin Electrical component which is potted using a potting compound
DE3824249A1 (en) * 1988-07-13 1990-01-18 Schering Ag METHOD FOR PRODUCING HIGH-TEMPERATURE-RESISTANT COPPER COATINGS ON INORGANIC DIELECTRICS

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE319924C (en) * 1915-03-27 1920-04-03 Wilhelm Streitzig Cement compound for electrical switchboard and insulating panels
EP0203333B1 (en) * 1985-05-30 1989-09-13 Giulini Chemie GmbH Method of producing moulds, patterns and tools on base of hard gypsum and/or cement
DE3811572A1 (en) * 1988-03-31 1989-10-19 System Elektronik Gmbh Berlin Electrical component which is potted using a potting compound
DE3824249A1 (en) * 1988-07-13 1990-01-18 Schering Ag METHOD FOR PRODUCING HIGH-TEMPERATURE-RESISTANT COPPER COATINGS ON INORGANIC DIELECTRICS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019209252A1 (en) * 2019-06-26 2020-12-31 Te Connectivity Germany Gmbh Carrier structure, cell contact system and manufacturing process

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