DE3811572A1 - Electrical component which is potted using a potting compound - Google Patents

Electrical component which is potted using a potting compound

Info

Publication number
DE3811572A1
DE3811572A1 DE19883811572 DE3811572A DE3811572A1 DE 3811572 A1 DE3811572 A1 DE 3811572A1 DE 19883811572 DE19883811572 DE 19883811572 DE 3811572 A DE3811572 A DE 3811572A DE 3811572 A1 DE3811572 A1 DE 3811572A1
Authority
DE
Germany
Prior art keywords
potting compound
potted
electrical component
concrete
casting compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19883811572
Other languages
German (de)
Inventor
Juergen Hahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
System Elektronik Berlin GmbH
Original Assignee
System Elektronik Berlin GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by System Elektronik Berlin GmbH filed Critical System Elektronik Berlin GmbH
Priority to DE19883811572 priority Critical patent/DE3811572A1/en
Publication of DE3811572A1 publication Critical patent/DE3811572A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/14—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances cements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to an electrical component which is potted using a potting compound. The invention comprises the potting compound being concrete. In this way, electrical components can be improved from various points of view.

Description

Die Erfindung bezieht sich auf eine mit einer Vergußmasse vergossene elektrische Komponente.The invention relates to a potting compound encapsulated electrical component.

Bisher hat man derartige Komponenten mit Kunstharz vergos­ sen.So far, such components have been potted with synthetic resin sen.

Der Erfindung liegt die Aufgabe zugrunde, eine Ver­ gußmasse vorzusehen.The invention has for its object a Ver to provide casting compound.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Vergußmasse Beton ist.This object is achieved in that the Casting compound is concrete.

Zwar hat Beton den Nachteil, daß er langsamer als Kunstharz aushärtet. Er hat aber den Vorteil gegenüber Kunstharz, daß er billiger ist als dieser und außerdem für den Fall der Vernichtung der Komponente keine Umweltbelastung darstellt. Als weiterer Vorteil kommt hinzu, daß Beton einen höheren Temperaturkoeffizienten besitzt als Kunstharz, so daß seine Kühlfähigkeit größer ist als die von Kunstharz. Die sonsti­ gen Eigenschaften, die an eine Vergußmasse für elektrische Komponenten zu stellen sind, besitzt Beton ebenfalls.Concrete has the disadvantage that it is slower than synthetic resin hardens. But it has the advantage over synthetic resin that it is cheaper than this and also in the case of Destruction of the component is not an environmental burden. Another advantage is that concrete has a higher Has temperature coefficient as a synthetic resin, so that its Cooling capacity is greater than that of synthetic resin. The other gene properties that a casting compound for electrical Concrete also has components to be provided.

Claims (1)

Mit einer Vergußmasse vergossene elektrische Komponente, dadurch gekennzeichnet, daß die Vergußmasse Beton ist.Electrical component cast with a casting compound, characterized in that the casting compound is concrete.
DE19883811572 1988-03-31 1988-03-31 Electrical component which is potted using a potting compound Withdrawn DE3811572A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19883811572 DE3811572A1 (en) 1988-03-31 1988-03-31 Electrical component which is potted using a potting compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19883811572 DE3811572A1 (en) 1988-03-31 1988-03-31 Electrical component which is potted using a potting compound

Publications (1)

Publication Number Publication Date
DE3811572A1 true DE3811572A1 (en) 1989-10-19

Family

ID=6351499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883811572 Withdrawn DE3811572A1 (en) 1988-03-31 1988-03-31 Electrical component which is potted using a potting compound

Country Status (1)

Country Link
DE (1) DE3811572A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036302A1 (en) * 1990-11-14 1992-05-21 Reinhard Treudler Support for electronic components - made of water setting gypsum or cement
WO1994020965A1 (en) * 1993-03-12 1994-09-15 Adolf R. Hochstim Family Trust Improved fire proofing method and system for the protection of electrical cables and conduits
DE102019209252A1 (en) * 2019-06-26 2020-12-31 Te Connectivity Germany Gmbh Carrier structure, cell contact system and manufacturing process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036302A1 (en) * 1990-11-14 1992-05-21 Reinhard Treudler Support for electronic components - made of water setting gypsum or cement
WO1994020965A1 (en) * 1993-03-12 1994-09-15 Adolf R. Hochstim Family Trust Improved fire proofing method and system for the protection of electrical cables and conduits
DE102019209252A1 (en) * 2019-06-26 2020-12-31 Te Connectivity Germany Gmbh Carrier structure, cell contact system and manufacturing process

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee