DE4028440A1 - Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering - Google Patents

Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering

Info

Publication number
DE4028440A1
DE4028440A1 DE19904028440 DE4028440A DE4028440A1 DE 4028440 A1 DE4028440 A1 DE 4028440A1 DE 19904028440 DE19904028440 DE 19904028440 DE 4028440 A DE4028440 A DE 4028440A DE 4028440 A1 DE4028440 A1 DE 4028440A1
Authority
DE
Germany
Prior art keywords
hybrid
circuit board
printed
hybrids
deformed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19904028440
Other languages
German (de)
Inventor
Dietrich Dipl Ing Dr Bergfried
Guenter Dipl Ing Dr Hege
Walter Dipl I Roethlingshoefer
Lothar Dr Schmidt
Ulrich Dr Goebel
Rainer Dipl Phys Jeske
Elmar Huber
Botho Dipl Phys Dr Ziegenbein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19904028440 priority Critical patent/DE4028440A1/en
Publication of DE4028440A1 publication Critical patent/DE4028440A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A circuit board (1) provides a facility for the mounting of hybrid circuit elements (5). The hybrid is produced in a green form in which the unsintered ceramic foil is produced with trucks and formed in multi-layers. This is followed by sintering to produce a rigid, hard product. The hybrid has an L shaped cross-section and is positioned on the board before being soldered (7) into position. Alternatively, it is bonded into position. ADVANTAGE - Improved mounting using formed hybrid circuit. Increased packing density by use of third dimension.

Description

Stand der TechnikState of the art

Die Erfindung betrifft ein Verfahren zum Herstellen von gedruckten Schaltungen aus zumindest einer Leiter­ platte und einem Hybrid.The invention relates to a method for manufacturing of printed circuits from at least one conductor plate and a hybrid.

Gedruckte Schaltungen werden üblicherweise aus Leiter­ platten hergestellt, wobei auf diese Leiterplatten Hybride für besondere Schaltungsfunktionen aufge­ bracht werden. Die Verbindung zwischen Leiterplatte und Hybrid erfolgt durch Lötkämmen, wobei sowohl auf der Leiterplatte wie auch am Hybrid Lötstellen vorhanden sind. Das Anbringen dieser Lötstellen ist zum einen zeitaufwendig und zum anderen nicht immer ganz zuverlässig, da Mängel in der Kontaktierung vorkommen. Ferner liegen die bekannten Hybride, ins­ besondere die Dickschichthybride in zweidimensionaler Form vor, so daß sie immer einen bestimmten Raum in Anspruch nehmen.Printed circuits are usually made of conductors plates made, being on these circuit boards Hybrid set up for special circuit functions be brought. The connection between circuit board and hybrid is done by soldering combs, with both on the PCB as well as on the hybrid solder joints available. The attachment of these solder joints is on the one hand time consuming and on the other hand not always quite reliable because of deficiencies in the contact occurrence. Furthermore, the known hybrids, ins especially the thick-layer hybrid in two dimensions Form before so that it always has a certain space take advantage of.

Vorteile der ErfindungAdvantages of the invention

Die vorliegende Erfindung gemäß dem kennzeichnenden Teil von Anspruch 1 hat den wesentlichen Vorteil, daß beliebige Formen von Hybriden geschaffen werden können, die den entsprechenden Raumanforderungen der gedruckten Schaltung Rechnung tragen. Die unge­ sinterten Keramikfolien, auch Green-Sheet-Folie ge­ nannt, sind preisgünstig zu erwerben und einfach als ebene Folien mit Leiterbahnen zu bedrucken. Nach dem Bedrucken werden diese Folien in die gewünschte Form gebracht und anschließend durch Sintern in dieser Form fixiert.The present invention according to the characterizing  Part of claim 1 has the essential advantage that any forms of hybrids are created can meet the corresponding space requirements take into account the printed circuit. The young sintered ceramic foils, including green sheet foils are inexpensive to buy and simple to be printed as flat foils with conductor tracks. To After printing, these foils are cut into the desired ones Formed and then by sintering in this Fixed shape.

Ferner besteht der Vorteil, eine Vielzahl von unge­ sinterten Keramikfolien unterschiedlich zu bedrucken und durch Stapeln mehrerer solcher bedruckter Folien eine Mehrlagenschaltung herzustellen. Diese Mehr­ lagenschaltung wird dann in die gewünschte Form ge­ bracht und durch Sintern fixiert.There is also the advantage of having a large number of sintered ceramic foils to print differently and by stacking several such printed films to produce a multilayer circuit. This more position control is then ge in the desired shape brought and fixed by sintering.

Das Aufbringen eines so hergestellten Hybrids aus einer oder mehreren Keramikfolien kann durch Auflösen oder Aufkleben mittels eines Leitklebers erfolgen, wodurch die Kontaktflächen zwischen Leiterplatte und Hybrid wesentlich erhöht wird. Die Lötkämme ent­ fallen und die Kontaktierung geht gesicherter von­ statten. Es ist selbstverständlich auch möglich, derartige Hybride mit anderen Hybriden zu verbinden.The application of a hybrid produced in this way one or more ceramic foils can be dissolved or gluing with a conductive adhesive, creating the contact areas between circuit board and hybrid is significantly increased. The soldering combs fall and the contact is more secure equip. Of course it is also possible to connect such hybrids with other hybrids.

Ein weiterer wesentlicher Vorteil der vorliegenden Erfindung liegt in der Ausnützung der flexiblen Eigen­ schaften der Green-Sheet-Folie und in der Erhöhung der Packungsdichte durch Nutzung der dritten Dimension.Another major advantage of the present Invention lies in the use of the flexible own the green sheet film and in the increase the packing density by using the third dimension.

Eine derartige gedruckte Schaltung besteht dann er­ findungsgemäß aus einer Leiterplatte und/oder anderen Hybriden, welche mit einer oder mehreren bedruckten, verformten und gesinterten Keramikfolien (Green-Sheet- Folien) verbunden sind. Unter Schutz gestellt werden soll aber auch der grundsätzliche Gedanke der Ver­ wendung von bedruckten, verformten und gesinterten Keramikfolien als Hybride auf Leiterplatten oder in Verbindung mit anderen Hybriden.Such a printed circuit then exists according to the invention from a circuit board and / or other  Hybrids, which are printed with one or more deformed and sintered ceramic foils (green sheet Foils) are connected. Be put under protection but should also the basic idea of Ver use of printed, deformed and sintered Ceramic foils as hybrids on printed circuit boards or in connection with other hybrids.

Zeichnungdrawing

Die Erfindung wird anhand der Zeichnung näher er­ läutert; diese zeigt inThe invention is based on the drawing he purifies; this shows in

Fig. 1 eine perspektivische, teilweise geschnittene Ansicht einer Leiterplatte mit aufgesetztem Dickschichthybrid entsprechend dem Stand der Technik; Figure 1 is a perspective, partially sectioned view of a circuit board with attached thick film hybrid according to the prior art.

Fig. 2 eine perspektivische Ansicht einer Leiter­ platte mit einem aufgesetzten Dickschicht­ hybrid einer anderen Ausführungsform ent­ sprechend dem Stand der Technik; Figure 2 is a perspective view of a circuit board with an attached thick film hybrid of another embodiment accordingly to the prior art.

Fig. 3 eine perspektivische Ansicht einer Leiter­ platte mit einem aufgesetzten Hybrid ent­ sprechend der vorliegenden Erfindung; Fig. 3 is a perspective view of a circuit board with an attached hybrid accordingly to the present invention;

Fig. 4 eine perspektivische Ansicht einer Leiter­ platte mit aufgesetzten erfindungsgemäßen Hybriden in einer weiteren Ausführungform. Fig. 4 is a perspective view of a circuit board with attached hybrids according to the invention in a further embodiment.

Gemäß Fig. 1 wird nach dem bekannten Stand der Technik auf eine Leiterplatte 1 ein Hybrid, insbesondere ein Dickschichthybrid 2 durch Verlöten aufgebracht. Hierzu stehen von dem Dickschichthybrid 2 Lötkamme 3 ab, die in entsprechende Bohrungen 4 in der Leiter­ platte 1 eingreifen. In diesen Bohrungen 4 werden die Lötkämme 3 verlötet, wobei dort Lötstellen ent­ stehen.According to FIG. 1, a hybrid, in particular a thick-film hybrid 2, is applied to a printed circuit board 1 by soldering. For this purpose, from the thick-film hybrid 2 soldering combs 3 , which engage in corresponding holes 4 in the circuit board 1 . In these holes 4 , the soldering combs 3 are soldered, where there are solder joints ent.

An dem Dickschichthybrid 2 liegen die Lötkämme 3 üblicherweise beidseits an und sind ebenfalls beid­ seits unter Ausbildung von Lötstellen an den Dick­ schichthybriden 2 verlötet.On the thick-film hybrid 2 , the soldering combs 3 are usually on both sides and are also soldered on both sides, forming solder joints on the thick-layer hybrids 2 .

Während es sich bei dem Dickschichthybrid 2 gemäß Fig. 1 um ein SIL-Hybrid handelt, ist in Fig. 2 die Festlegung eines DIL-Hybrides 2a dargestellt. Dieses Hybrid 2a wird über beidseitig angeordnete Lötkämme 3a und 3b in Abstand von der Leiterplatte gehalten, wobei die Ebene des Hybrides 2a etwa paral­ lel zur Ebene der Leiterplatte 1 verläuft.While the thick-film hybrid 2 according to FIG. 1 is a SIL hybrid, the determination of a DIL hybrid 2 a is shown in FIG. 2. This hybrid 2 a is held on both sides by soldering combs 3 a and 3 b at a distance from the circuit board, the level of the hybrid 2 a running approximately parallel to the level of the circuit board 1 .

Erfindungsgemäß ist nun gemäß Fig. 3 auf eine Leiter­ platte 1 oder ein anderes Hybrid ein Hybrid 5 aufge­ setzt, welches in sog. Green-Sheet-Technik hergestellt ist. Dabei handelt es sich um ungesinterte Keramik­ folien (Green-Sheet-Folien), die üblicherweise als ebene Folien mit Leiterbahnen bedruckt werden und durch Stapeln mehrerer Folien zu einer ebenen Mehr­ lagenschaltung gepreßt und gesintert werden. Erfin­ dungsgemäß werden diese Folien nach dem Bedrucken verformt und durch anschließendes Sintern in dieser Form fixiert. Gemäß Fig. 3 weist das Hybrid nach dem Verformen eine L-Form auf und ist mit seinem unteren Schenkel 6 auf die Leiterplatte 1 bzw. ein anderes Hybrid aufgesetzt. Die Verbindung erfolgt dann durch ein Lot 7 oder eine Schicht eines ent­ sprechenden Leitklebers. According to the invention, a hybrid 5 is now placed on a printed circuit board 1 or another hybrid, as shown in FIG. 3, which is produced using so-called green sheet technology. These are unsintered ceramic foils (green sheet foils), which are usually printed as flat foils with conductor tracks and are pressed and sintered by stacking several foils to form a flat multi-layer circuit. Invention according to these films are deformed after printing and fixed in this form by subsequent sintering. According to FIG. 3, the hybrid has an L-shape after being deformed and is placed with its lower leg 6 on the printed circuit board 1 or another hybrid. The connection is then made by a solder 7 or a layer of a corresponding conductive adhesive.

Andere Formen von erfindungsgemäßen Hybriden 5a und 5b sind in Fig. 4 aufgezeigt, wobei die Verbindung mit der Leiterplatte 1 ebenfalls durch Lot 7 oder eine Leitkleberschicht erfolgt. Diese Formen sind lediglich beispielhaft. Andere Formen sollen eben­ falls vom Erfindungsgedanken umfaßt sein.Other forms of hybrids 5 a and 5 b according to the invention are shown in Fig. 4, wherein the connection to the circuit board 1 is also carried out by solder 7 or a conductive adhesive layer. These forms are only examples. Other forms are also intended to be encompassed by the inventive concept.

Somit wird die Verformbarkeit der Green-Sheet-Folie zur direkten Kontaktierung und zur dreidimensionalen Anordnung von Dickschichthybriden benutzt.Thus the deformability of the green sheet film for direct contact and three-dimensional Arrangement of thick-film hybrids used.

Claims (7)

1. Verfahren zum Herstellen von gedruckten Schal­ tungen aus zumindest einer Leiterplatte und einem Hybrid, dadurch gekennzeichnet, daß zumindest eine ungesinterte Keramikfolie mit Leiterbahnen bedruckt, sodann verformt, anschließend durch Sintern in dieser Form fixiert sowie mit der Leiterplatte und/oder einen anderen Hybrid verbunden wird.1. A method for producing printed scarf lines from at least one circuit board and a hybrid, characterized in that at least one unsintered ceramic film is printed with conductor tracks, then deformed, then fixed by sintering in this form and connected to the circuit board and / or another hybrid becomes. 2. Verfahren nach Anspruch 1, dadurch gekennzeich­ net, daß mehrere Keramikfolien bedruckt und durch Stapeln mehrerer Folien zu einer ebenen Mehrlagen­ schaltung gepreßt, dann verformt und gesintert und sodann mit der Leiterplatte und/oder einem anderen Hybrid verbunden werden.2. The method according to claim 1, characterized in net that several ceramic foils printed and through Stacking several foils into a flat multilayer circuit pressed, then deformed and sintered and then with the circuit board and / or another Hybrid connected. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekenn­ zeichnet, daß die verformte/n Keramikfolie/n auf eine Leiterplatte und/oder ein Hybrid aufgelötet wird/werden.3. The method according to claim 1 or 2, characterized records that the deformed / n ceramic film / s a circuit board and / or a hybrid soldered will be. 4. Verfahren nach Anspruch 1 oder 2, dadurch gekenn­ zeichnet, daß die verformte/n Keramikfolie/n auf eine Leiterplatte und/oder ein Hybrid mittels eines Leitklebers aufgeklebt wird/werden. 4. The method according to claim 1 or 2, characterized records that the deformed / n ceramic film / s a circuit board and / or a hybrid by means of a Conductive adhesive is / are stuck on.   5. Gedruckte Schaltung aus zumindest einer Leiterplatte und einem Hybrid, dadurch gekennzeichnet, daß die Hybride (5) aus einer oder mehreren bedruckten, ver­ formten und gesinterten Keramikfolien mit der Leiter­ platte (1) und/oder mit anderen Hybriden verbunden sind.5. Printed circuit from at least one circuit board and a hybrid, characterized in that the hybrids ( 5 ) from one or more printed, shaped and sintered ceramic foils with the circuit board ( 1 ) and / or are connected to other hybrids. 6. Gedruckte Schaltung nach Anspruch 5, dadurch gekennzeichnet, daß die Hybride (5) auf die Leiter­ platte (1) und/oder ein anderes Hybrid aufgeklebt, aufgelötet od. dgl. sind.6. Printed circuit according to claim 5, characterized in that the hybrids ( 5 ) on the circuit board ( 1 ) and / or another hybrid glued, soldered or the like. 7. Verwendung von bedruckten, verformten und gesin­ terten Keramikfolien als Hybride auf Leiterplatten oder in Verbindung mit anderen Hybriden.7. Use of printed, deformed and Gesin Ceramic foils as hybrids on printed circuit boards or in combination with other hybrids.
DE19904028440 1990-09-07 1990-09-07 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering Ceased DE4028440A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19904028440 DE4028440A1 (en) 1990-09-07 1990-09-07 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19904028440 DE4028440A1 (en) 1990-09-07 1990-09-07 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering

Publications (1)

Publication Number Publication Date
DE4028440A1 true DE4028440A1 (en) 1992-03-12

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DE19904028440 Ceased DE4028440A1 (en) 1990-09-07 1990-09-07 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197208B1 (en) 1997-05-07 2001-03-06 Robert Bosch Gmbh Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197208B1 (en) 1997-05-07 2001-03-06 Robert Bosch Gmbh Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid

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