DE4006861A1 - Peltier element structure with solid, two-slide cover plates - has at least one plate divided into several small partial sections by cutting - Google Patents

Peltier element structure with solid, two-slide cover plates - has at least one plate divided into several small partial sections by cutting

Info

Publication number
DE4006861A1
DE4006861A1 DE4006861A DE4006861A DE4006861A1 DE 4006861 A1 DE4006861 A1 DE 4006861A1 DE 4006861 A DE4006861 A DE 4006861A DE 4006861 A DE4006861 A DE 4006861A DE 4006861 A1 DE4006861 A1 DE 4006861A1
Authority
DE
Germany
Prior art keywords
cover plates
peltier element
element structure
solid
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4006861A
Other languages
German (de)
Inventor
Gerhard Dipl Phys Bollert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PELTRON GMBH, 90765 FUERTH, DE
Original Assignee
PELTRON GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PELTRON GmbH filed Critical PELTRON GmbH
Priority to DE4006861A priority Critical patent/DE4006861A1/en
Publication of DE4006861A1 publication Critical patent/DE4006861A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

The Peltier element structure has solid cover plates on both sides. At least one plate is cut into several, small, partial regions. The cover plates are pref. of insulating ceramic material. Alternately they can be of metal, with an electrically insulating intermediate substance. At least the subdivided surface is provided with heat conductive contacting material, whichy may have low friction properties. The element has pairs of semiconductor p- and n-conductive cubes, coupled by copper contact bridges. USE/ADVANTAGE - For refrigeration appts. etc. with sufficient reduction of mechanical stresses.

Description

Zerlegung der Abdeckplatten bei Peltier-Elementen in kleine Einzelbereiche, um einen Abbau von mechanischen Spannungen zu erreichen, die bei Temperaturänderung durch die unterschiedlichen Wärmeausdehnungskoeffizienten der verbundenen Materialien entstehen.Disassembly of the cover plates for Peltier elements in small individual areas, in order to reduce mechanical stresses that Temperature change due to the different Thermal expansion coefficients of the connected materials arise.

Peltier-Elemente werden seit Jahrzehnten für den Bau von Kühlgeräten - vor allem im Kleinleistungsbereich - verwendet.Peltier elements have been used for decades in the construction of refrigeration equipment especially in the low power range - used.

Die derzeit meistgebaute Ausführung von Peltier-Elementen sind solche, die beidseitig mit Keramikplatten abgeschlossen sind. Diese Platten (meistens Aluminiumoxid) dienen einerseits der mechanischen Festigkeit der Elemente, andererseits sind sie die zur Wärmeübertragung erforderlichen Kontaktflächen.The currently most built version of Peltier elements are those are finished on both sides with ceramic plates. These plates (mostly Aluminum oxide) serve on the one hand for the mechanical strength of the elements, on the other hand, they are the ones required for heat transfer Contact areas.

Moderne Peltier-Elemente bestehen meist aus einer Vielzahl von Halbleiter- p- und n-Quadern, welche paarweise durch Kupferbrücken verbunden sind, so daß sich eine Serienschaltung der einzelnen Quaderpaare derart ergibt, daß bei Stromdurchgang alle Kaltseiten und alle Warmseiten jeweils in einer Ebene liegen. Die verdrahtenden Kupferbrücken werden in Löttechnik mit den geeignet vormetallisierten Keramikplatten verbunden. Diese Technik führt zu erheblichen Problemen, welche auf die unterschiedlichen Ausdehnungskoeffizienten der verwendeten Materialien zurückzuführen sind. Insbesondere geht es hierbei um den Unterschied zwischen Kupfer und z. B. Aluminiumoxid-Keramik.Modern Peltier elements mostly consist of a large number of semiconductor p and n cuboids, which are connected in pairs by copper bridges, see above that there is a series connection of the individual cuboid pairs such that all current sides and all warm sides in one at a time Level. The wiring copper bridges are soldered to the suitably pre-metallized ceramic plates connected. This technique leads to significant problems that affect the different Expansion coefficients of the materials used can be attributed. In particular, this is about the difference between copper and z. B. Alumina ceramic.

Erzeugt man im Kontaktbereich zwischen Kupfer und Keramik eine Temperaturänderung, so hat das eine starke Durchbiegung der Keramikplatten zur Folge bzw. bei Unterdrückung dieser Durchbiegung eine starke Verspannung in den Quadern. Es treten sowohl Zug- als auch Scherspannungen auf. Diese mechanische Verspannung führt, besonders bei Temperatur- Wechselbeanspruchung, leicht zur Zerstörung der Peltier-Elemente. Selbst wenn das Element der rein mechanischen Beanspruchung zunächst gewachsen sein sollte, kann es doch durch Lotermüdung und Rekristallisationsprozesse dazu kommen, daß sich die Kontaktverbindungen lösen bzw. hochohmiger werden, was zu einer ständig ansteigenden Temperatur und schließlich zur Zerstörung im Kontaktbereich führt. Die unterschiedliche Ausdehnung der Warm- und Kaltseite führt ebenfalls zu unterschiedlicher Wärmeausdehnung. Auch die hierdurch auftretenden Verspannungen können durch ein Aufteilen vermindert werden.If you create one in the contact area between copper and ceramic Temperature change, this has a strong deflection of the ceramic plates as a result or if this deflection is suppressed, a strong one Tension in the cuboids. Both tensile and shear stresses occur on. This mechanical tension leads, especially at temperature Alternating stress, easy to destroy the Peltier elements. Self when the element of the purely mechanical stress initially grown should be because of solder fatigue and recrystallization processes In addition, the contact connections become loose or have a higher resistance become what an ever increasing temperature and eventually the Destruction in the contact area leads. The different extent of the  The hot and cold sides also lead to different thermal expansion. The resulting tensions can also be divided can be reduced.

Die erwähnten mechanischen Spannungen wachsen von der Mitte eines Elementes zu den Rändern zu proportional zur Länge an. D. h. je größer ein Element in seiner Kantenausdehnung wird, umso sicherer wird es durch Temperatur- Einflüsse zerstört.The mentioned mechanical stresses grow from the middle of an element to the edges too proportional to the length. I.e. the larger an element in its edge expansion, the safer it becomes by temperature Influences destroyed.

Sinn der Erfindung ist es, selbst bei großflächigem Bau von Peltier- Elementen (z. B. Kantenlänge < 10 mm) für einen ausreichenden Abbau der Spannungen zu sorgen. Hierzu werden die Abdeckplatten mindestens auf einer Seite in kleine Einzelbereiche zerlegt. Diese Maßnahme kann auch noch nachträglich an normal gefertigten Peltier-Elementen durch Zerschneiden der Abdeckplatte erfolgen.The purpose of the invention is, even with large-scale construction of Peltier Elements (e.g. edge length <10 mm) for sufficient degradation of the To worry about tensions. For this, the cover plates are at least on one Page broken down into small individual areas. This measure can also subsequently on normally manufactured Peltier elements by cutting the Cover plate.

Ein Nebeneffekt dieser Maßnahme ist es, daß das Element wesentlich elastischer wird (bei noch völlig ausreichender Stabilität), so daß das Einspannen zwischen zwei wärmeleitenden Blöcken wesentlich unproblematischer wird.A side effect of this measure is that the element is essential becomes more elastic (while still having sufficient stability), so that the Clamping between two heat-conducting blocks is essential becomes less problematic.

Claims (5)

1. Aufbau von Peltier-Elementen mit festen beidseitigen Abdeckplatten, dadurch gekennzeichnet, daß mindestens eine dieser Platten durch Zerschneiden in mehrere kleine Teilbereiche zerlegt wird.1. Structure of Peltier elements with fixed cover plates on both sides, characterized in that at least one of these plates is broken up into several small sections. 2. ..dadurch gekennzeichnet, daß die verwendeten Abdeckplatten aus einem elektrisch isolierenden keramischen Werkstoff bestehen.2. .. characterized in that the cover plates used from a electrically insulating ceramic material. 3. ..nach Anspruch 1), daß die Abdeckplatten metallischer Natur sind unter Verwendung eines elektrisch isolierenden Zwischenmediums.3. ..nach claim 1) that the cover plates are metallic in nature Use of an electrically insulating intermediate medium. 4. ..nach Anspruch 1), daß mindestens die aufgeteilte Fläche mit einem wärmeleitfähigen Kontaktmittel versehen ist.4. ..nach claim 1) that at least the divided area with a thermally conductive contact means is provided. 5. ..daß das nach 4) verwendete Kontaktmittel Gleiteigenschaften besitzt.5. ... that the contact means used according to 4) has sliding properties.
DE4006861A 1990-03-03 1990-03-03 Peltier element structure with solid, two-slide cover plates - has at least one plate divided into several small partial sections by cutting Withdrawn DE4006861A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4006861A DE4006861A1 (en) 1990-03-03 1990-03-03 Peltier element structure with solid, two-slide cover plates - has at least one plate divided into several small partial sections by cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4006861A DE4006861A1 (en) 1990-03-03 1990-03-03 Peltier element structure with solid, two-slide cover plates - has at least one plate divided into several small partial sections by cutting

Publications (1)

Publication Number Publication Date
DE4006861A1 true DE4006861A1 (en) 1991-09-05

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ID=6401449

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Application Number Title Priority Date Filing Date
DE4006861A Withdrawn DE4006861A1 (en) 1990-03-03 1990-03-03 Peltier element structure with solid, two-slide cover plates - has at least one plate divided into several small partial sections by cutting

Country Status (1)

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DE (1) DE4006861A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19527867A1 (en) * 1995-07-29 1997-01-30 Schulz Harder Juergen Metal substrate for electrical and/or electronic semiconductor circuit - has Peltier chip connected between respective overlapping metallisation structures of upper and lower ceramic layer
US6002081A (en) * 1996-12-18 1999-12-14 S.E.L. Usa Inc. Thermoelectric component and thermoelectric cooling device
WO2001022490A1 (en) * 1999-09-22 2001-03-29 Infineon Technologies Ag Selective cooling of partial surfaces pertaining to a flat electronic component
DE19680505C2 (en) * 1995-05-26 2001-10-31 Matsushita Electric Works Ltd Peltier effect module and method for its production
DE10035840B4 (en) * 2000-07-14 2007-06-06 Hahn-Meitner-Institut Berlin Gmbh Thermoelectric semiconductor component
DE102006012977A1 (en) * 2006-03-21 2007-10-11 Siemens Ag Thermal-insulating layer system for use in e.g. gas turbine, has active thermal-insulating layer counteracting heat flow, which is defined by intrinsic thermal conductivity of passive poor heat conducting thermal-insulating layer
DE19733455B4 (en) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Heat exchanger assembly and cooling system with at least one such heat exchanger assembly
DE102012210627A1 (en) * 2012-06-22 2013-12-24 Eberspächer Exhaust Technology GmbH & Co. KG Thermoelectric module, heat exchanger, exhaust system and internal combustion engine
WO2014027011A1 (en) * 2012-08-17 2014-02-20 Behr Gmbh & Co. Kg Thermoelectric module
US9842979B2 (en) 2012-08-17 2017-12-12 Mahle International Gmbh Thermoelectric device
US10074790B2 (en) 2012-08-17 2018-09-11 Mahle International Gmbh Thermoelectric device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903857A (en) * 1956-09-24 1959-09-15 Rca Corp Thermoelectric heat pump
US3302414A (en) * 1965-07-14 1967-02-07 Gustav H Sudmeier Thermo-electric air conditioner for automobiles
DE1272408B (en) * 1961-05-22 1968-07-11 North American Aviation Inc Thermoelectric converter
DE1764723B1 (en) * 1968-07-25 1971-07-15 Siemens Ag Process for the production of a Peltier cooling block
US4497973A (en) * 1983-02-28 1985-02-05 Ecd-Anr Energy Conversion Company Thermoelectric device exhibiting decreased stress

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903857A (en) * 1956-09-24 1959-09-15 Rca Corp Thermoelectric heat pump
DE1272408B (en) * 1961-05-22 1968-07-11 North American Aviation Inc Thermoelectric converter
US3302414A (en) * 1965-07-14 1967-02-07 Gustav H Sudmeier Thermo-electric air conditioner for automobiles
DE1764723B1 (en) * 1968-07-25 1971-07-15 Siemens Ag Process for the production of a Peltier cooling block
US4497973A (en) * 1983-02-28 1985-02-05 Ecd-Anr Energy Conversion Company Thermoelectric device exhibiting decreased stress

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19680505C2 (en) * 1995-05-26 2001-10-31 Matsushita Electric Works Ltd Peltier effect module and method for its production
DE19527867A1 (en) * 1995-07-29 1997-01-30 Schulz Harder Juergen Metal substrate for electrical and/or electronic semiconductor circuit - has Peltier chip connected between respective overlapping metallisation structures of upper and lower ceramic layer
US6002081A (en) * 1996-12-18 1999-12-14 S.E.L. Usa Inc. Thermoelectric component and thermoelectric cooling device
DE19733455B4 (en) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Heat exchanger assembly and cooling system with at least one such heat exchanger assembly
WO2001022490A1 (en) * 1999-09-22 2001-03-29 Infineon Technologies Ag Selective cooling of partial surfaces pertaining to a flat electronic component
DE10035840B4 (en) * 2000-07-14 2007-06-06 Hahn-Meitner-Institut Berlin Gmbh Thermoelectric semiconductor component
DE102006012977A1 (en) * 2006-03-21 2007-10-11 Siemens Ag Thermal-insulating layer system for use in e.g. gas turbine, has active thermal-insulating layer counteracting heat flow, which is defined by intrinsic thermal conductivity of passive poor heat conducting thermal-insulating layer
DE102012210627B4 (en) * 2012-06-22 2016-12-15 Eberspächer Exhaust Technology GmbH & Co. KG Thermoelectric module, heat exchanger, exhaust system and internal combustion engine
DE102012210627A1 (en) * 2012-06-22 2013-12-24 Eberspächer Exhaust Technology GmbH & Co. KG Thermoelectric module, heat exchanger, exhaust system and internal combustion engine
DE102012210627A8 (en) * 2012-06-22 2014-04-03 Eberspächer Exhaust Technology GmbH & Co. KG Thermoelectric module, heat exchanger, exhaust system and internal combustion engine
US9748465B2 (en) 2012-06-22 2017-08-29 Eberspaecher Exhaust Technology Gmbh & Co. Kg Thermoelectric module, heat exchanger, exhaust system and internal combustion engine
WO2014027011A1 (en) * 2012-08-17 2014-02-20 Behr Gmbh & Co. Kg Thermoelectric module
CN104641480B (en) * 2012-08-17 2017-08-08 马勒国际公司 Electrothermal module
US9735333B2 (en) 2012-08-17 2017-08-15 Mahle International Gmbh Thermoelectric module
CN104641480A (en) * 2012-08-17 2015-05-20 马勒国际公司 Thermoelectric module
US9842979B2 (en) 2012-08-17 2017-12-12 Mahle International Gmbh Thermoelectric device
US10074790B2 (en) 2012-08-17 2018-09-11 Mahle International Gmbh Thermoelectric device

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Legal Events

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8127 New person/name/address of the applicant

Owner name: PELTRON GMBH, 90765 FUERTH, DE

8110 Request for examination paragraph 44
8130 Withdrawal