DE3940289A1 - Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate - Google Patents

Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate

Info

Publication number
DE3940289A1
DE3940289A1 DE19893940289 DE3940289A DE3940289A1 DE 3940289 A1 DE3940289 A1 DE 3940289A1 DE 19893940289 DE19893940289 DE 19893940289 DE 3940289 A DE3940289 A DE 3940289A DE 3940289 A1 DE3940289 A1 DE 3940289A1
Authority
DE
Germany
Prior art keywords
ridges
back plate
cooler
cooling
reverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19893940289
Other languages
German (de)
Other versions
DE3940289C2 (en
Inventor
Leonhard Dipl Ing Feldmair
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLEIN KG ELEKTRO GERAETE G
Original Assignee
KLEIN KG ELEKTRO GERAETE G
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLEIN KG ELEKTRO GERAETE G filed Critical KLEIN KG ELEKTRO GERAETE G
Priority to DE19893940289 priority Critical patent/DE3940289A1/en
Priority to AT225190A priority patent/AT403538B/en
Publication of DE3940289A1 publication Critical patent/DE3940289A1/en
Application granted granted Critical
Publication of DE3940289C2 publication Critical patent/DE3940289C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The cooler for electrotechnical devices has a cooling body formed such that ridges (3) are provided on the reverse side of the back plate (1) of the container. The ridges (3) are perpendicular to the cooling ribs (2) and their depth is greater than the thickness of the back plate (1). Thus, the cooling body can also serve as a rear connection to an electrical device. USE/ADVANTAGE - For cooling electrotechnical devices, especially those inserted in containers. Is compact, space saving construction which self ventilates.

Description

Die Erfindung betrifft einen Kühlkörper für Geräte der Elektro­ technik, insbesondere für Stromversorgungsgeräte, der aus einem Rückenteil besteht, auf dem über- bzw. nebeneinander Kühlrippen angeordnet sind.The invention relates to a heat sink for electrical devices technology, in particular for power supply devices, which consists of a There is a back part on which cooling fins are placed one above the other or next to each other are arranged.

Bei Geräten der Elektrotechnik, insbesondere bei solchen, die als Einschübe in Gehäusen angeordnet sind, ist es meist proble­ matisch, eine platzsparende Konstruktion für Fremdbelüftung zu finden. In der Regel wird ein Kühlblech oder ein Kühler liegend in das Gehäuse eingebaut. Dadurch ist aber die Eigenbelüftung zum Beispiel bei Lüfterausfall fast nicht möglich, zum andern wird sehr viel Platz im Gehäuse benötigt.For electrical engineering devices, especially those that arranged as inserts in housings, it is usually problematic matically, a space-saving construction for forced ventilation too Find. As a rule, a heat sink or a cooler is lying down built into the housing. But this is self-ventilation for example, almost not possible in the event of a fan failure, on the other a lot of space is required in the housing.

Aufgabe der vorliegenden Erfindung ist es, einen platzsparenden Kühlkörper für Geräte der Elektrotechnik zu schaffen, der auch noch bei Ausfall der Fremdkühlung eine ausreichende Eigenkühlung zur Aufrechterhaltung eines Notbetriebes ermöglicht.The object of the present invention is to save space To create heat sinks for electrical engineering devices, too sufficient self-cooling even if the external cooling fails to maintain emergency operation.

Zur Lösung dieser Aufgabe wird der Kühlkörper gemäß der Erfin­ dung derart ausgebildet, daß auf der Hinterseite des Rückenteils senkrecht zu den Kühlrippen Nuten vorgesehen sind, deren Tiefe größer ist als die Dicke des Rückenteils.To solve this problem, the heat sink according to the inven dung formed such that on the back of the back part grooves are provided perpendicular to the cooling fins, the depth of which is greater than the thickness of the back part.

Der Kühlkörper kann dabei als rückwärtiger Abschluß eines elektrischen Gerätes dienen, wobei an der Vorderseite dieses Gerätes ein Lüfter vorgesehen ist.The heat sink can be a rear end of a serve electrical device, being at the front of this Device a fan is provided.

Durch diese Maßnahmen ergeben sich senkrecht zum Rückenteil des Kühlkörpers Luftaustrittslöcher. Der Lüfter in der Frontplatte bläst durch das Gehäuse und kühlt dabei auch die Bauteile im Gerät sowie den Kühlkörper auf der Rückseite. Der Innenraum bleibt durch eine solche Konstruktion frei von Kühlblechen. Es ist eine saubere Trennung von Zu- und Abluft gegeben und bei Ausfall des Lüfters ist es möglich, einen Notbetrieb mit ca. 50% der Last aufgrund der guten Eigenkühlung des Kühlkörpers aufrechtzuerhalten. Der Lüfter selbst kann so montiert werden, daß er leicht austauschbar ist.These measures result in perpendicular to the back of the Heat sink air outlet holes. The fan in the front panel  blows through the housing and also cools the components in the Device as well as the heat sink on the back. The interior remains free of cooling plates due to such a construction. It there is a clean separation of supply and exhaust air and at Failure of the fan, it is possible to run an emergency operation with approx. 50% of the load due to the good self-cooling of the heat sink maintain. The fan itself can be mounted that it is easily interchangeable.

Anhand des Ausführungsbeispiels wird die Erfindung näher er­ läutert. Das Ausführungsbeispiel zeigt einen Kühlkörper mit einem Rückenteil 1, auf dem senkrecht nebeneinander die Kühl­ rippen 2 angeordnet sind. Auf der Rückseite des Rückenteils 1 sind Nuten 3 vorgesehen, die entweder durch Fräsen, Sägen oder auch gleich beim Gießen angebracht werden können. Da die Nu­ tentiefe größer ist als die Dicke des Rückenteils 1, entstehen an den Stellen zwischen den Kühlrippen Löcher 3. Dieser Kühlkör­ per kann nun beispielsweise an der Rückseite eines Einschubs oder eines Gerätes montiert werden, so daß die Kühlrippen nach außen stehen und so im Gehäuse selbst, in dem der Einschub angeordnet ist, keinen Platz beanspruchen. Durch die Löcher entsteht eine Eigenkonvektion, die eine gute Kühlung auch ohne Fremdbelüftung ermöglicht. Baut man an der Frontseite des die Einschübe enthaltenden Gehäuses einen Lüfter ein, so bläst die­ ser durch das Gehäuse und kühlt sowohl die Bauteile im Einschub sowie den Kühlkörper selbst. Dadurch ist eine gute Kühlung bei wenig Platzaufwand gewährleistet.Based on the embodiment, the invention is explained in more detail. The embodiment shows a heat sink with a back part 1 , on which the cooling ribs 2 are arranged vertically next to each other. Grooves 3 are provided on the back of the back part 1 , which can be attached either by milling, sawing or immediately during casting. Since the Nu depth is greater than the thickness of the back part 1 , holes 3 are formed at the locations between the cooling fins. This Kühlkör by can now be mounted, for example, on the back of an insert or device, so that the cooling fins are facing out and so take up no space in the housing itself, in which the insert is arranged. The holes create a natural convection, which enables good cooling even without external ventilation. If a fan is installed on the front of the housing containing the inserts, it blows through the housing and cools both the components in the insert and the heat sink itself. This ensures good cooling with little space requirement.

Claims (3)

1. Kühlkörper für Geräte der Elektrotechnik, insbesondere für Stromversorgungsgeräte, der aus einem Rückenteil besteht, auf dem über- bzw. nebeneinander Kühlrippen angeordnet sind, da­ durch gekennzeichnet, daß auf der Hin­ terseite des Rückenteils (1) senkrecht zu den Kühlrippen (2) Nuten (3) vorgesehen sind, deren Tiefe größer ist als die Dicke des Rückenteils (1).1. heat sink for electrical engineering devices, in particular for power supply devices, which consists of a back part on which cooling fins are arranged one above the other or next to each other, characterized in that on the rear side of the back part ( 1 ) perpendicular to the cooling fins ( 2 ) Grooves ( 3 ) are provided, the depth of which is greater than the thickness of the back part ( 1 ). 2. Kühlkörper nach Anspruch 1, dadurch gekenn­ zeichnet, daß der Kühlkörper als rückwärtiger Ab­ schluß eines elektrischen Gerätes dient.2. Heat sink according to claim 1, characterized records that the heat sink as a rear Ab circuit of an electrical device is used. 3. Kühlkörper nach Anspruch 2, dadurch gekenn­ zeichnet, daß an der Vorderseite dieses Gerätes ein Lüfter vorgesehen ist.3. Heatsink according to claim 2, characterized records that on the front of this unit Fan is provided.
DE19893940289 1989-12-06 1989-12-06 Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate Granted DE3940289A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19893940289 DE3940289A1 (en) 1989-12-06 1989-12-06 Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate
AT225190A AT403538B (en) 1989-12-06 1990-11-09 HEAT SINK FOR ELECTRICAL EQUIPMENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893940289 DE3940289A1 (en) 1989-12-06 1989-12-06 Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate

Publications (2)

Publication Number Publication Date
DE3940289A1 true DE3940289A1 (en) 1991-06-13
DE3940289C2 DE3940289C2 (en) 1991-12-19

Family

ID=6394895

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19893940289 Granted DE3940289A1 (en) 1989-12-06 1989-12-06 Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate

Country Status (2)

Country Link
AT (1) AT403538B (en)
DE (1) DE3940289A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10048328C2 (en) * 2000-09-28 2003-01-23 Aeg Niederspannungstech Gmbh Arc-extinguishing device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1764486B2 (en) * 1967-06-15 1973-05-30 Forbro Design Corp., New York, N.Y. (V.St.A.) COOLING DEVICE FOR ELECTRONIC COMPONENTS
DE3228368A1 (en) * 1982-07-29 1984-02-02 Siemens AG, 1000 Berlin und 8000 München Housing for electrotechnical apparatuses
US4751872A (en) * 1987-05-26 1988-06-21 Lawson Jr Theodore J Ventilation system
US4758924A (en) * 1986-05-29 1988-07-19 Honeywell Bull Inc. Electronic equipment housing
US4860163A (en) * 1988-08-05 1989-08-22 American Telephone And Telegraph Company Communication equipment cabinet cooling arrangement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1764486B2 (en) * 1967-06-15 1973-05-30 Forbro Design Corp., New York, N.Y. (V.St.A.) COOLING DEVICE FOR ELECTRONIC COMPONENTS
DE3228368A1 (en) * 1982-07-29 1984-02-02 Siemens AG, 1000 Berlin und 8000 München Housing for electrotechnical apparatuses
US4758924A (en) * 1986-05-29 1988-07-19 Honeywell Bull Inc. Electronic equipment housing
US4751872A (en) * 1987-05-26 1988-06-21 Lawson Jr Theodore J Ventilation system
US4860163A (en) * 1988-08-05 1989-08-22 American Telephone And Telegraph Company Communication equipment cabinet cooling arrangement

Also Published As

Publication number Publication date
DE3940289C2 (en) 1991-12-19
AT403538B (en) 1998-03-25
ATA225190A (en) 1997-07-15

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee