DE3935272A1 - Kuehlblech fuer elektronische bauelemente - Google Patents

Kuehlblech fuer elektronische bauelemente

Info

Publication number
DE3935272A1
DE3935272A1 DE19893935272 DE3935272A DE3935272A1 DE 3935272 A1 DE3935272 A1 DE 3935272A1 DE 19893935272 DE19893935272 DE 19893935272 DE 3935272 A DE3935272 A DE 3935272A DE 3935272 A1 DE3935272 A1 DE 3935272A1
Authority
DE
Germany
Prior art keywords
cooling plate
frame part
frame
circuit board
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19893935272
Other languages
German (de)
English (en)
Other versions
DE3935272C2 (enrdf_load_stackoverflow
Inventor
Heinz Dipl Ing Kraus
Heinrich Dipl Ing Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Loewe Opta GmbH
Original Assignee
Loewe Opta GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loewe Opta GmbH filed Critical Loewe Opta GmbH
Priority to DE19893935272 priority Critical patent/DE3935272A1/de
Publication of DE3935272A1 publication Critical patent/DE3935272A1/de
Application granted granted Critical
Publication of DE3935272C2 publication Critical patent/DE3935272C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19893935272 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente Granted DE3935272A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19893935272 DE3935272A1 (de) 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893935272 DE3935272A1 (de) 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente

Publications (2)

Publication Number Publication Date
DE3935272A1 true DE3935272A1 (de) 1991-04-25
DE3935272C2 DE3935272C2 (enrdf_load_stackoverflow) 1991-10-10

Family

ID=6392017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19893935272 Granted DE3935272A1 (de) 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente

Country Status (1)

Country Link
DE (1) DE3935272A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416460C2 (de) * 1994-05-10 1996-04-11 Hella Kg Hueck & Co Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
DE7908303U1 (de) * 1979-03-24 1979-07-12 Loewe Opta Gmbh, 1000 Berlin Halter für Kühlbleche für elektronische Bauteile in einem Gerätechassis
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
DE8707370U1 (de) * 1987-05-22 1987-07-23 TA Triumph-Adler AG, 8500 Nürnberg Vorrichtung zum Befestigen eines elektronischen Bauelementes an einem Kühlblech

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
DE7908303U1 (de) * 1979-03-24 1979-07-12 Loewe Opta Gmbh, 1000 Berlin Halter für Kühlbleche für elektronische Bauteile in einem Gerätechassis
DE8707370U1 (de) * 1987-05-22 1987-07-23 TA Triumph-Adler AG, 8500 Nürnberg Vorrichtung zum Befestigen eines elektronischen Bauelementes an einem Kühlblech

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor

Also Published As

Publication number Publication date
DE3935272C2 (enrdf_load_stackoverflow) 1991-10-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licenses declared (paragraph 23)
8339 Ceased/non-payment of the annual fee