DE3915998A1 - Electronic component with integrated circuit - has voltage supply strip lines coupled each to capacitor electrode - Google Patents
Electronic component with integrated circuit - has voltage supply strip lines coupled each to capacitor electrodeInfo
- Publication number
- DE3915998A1 DE3915998A1 DE19893915998 DE3915998A DE3915998A1 DE 3915998 A1 DE3915998 A1 DE 3915998A1 DE 19893915998 DE19893915998 DE 19893915998 DE 3915998 A DE3915998 A DE 3915998A DE 3915998 A1 DE3915998 A1 DE 3915998A1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- strip lines
- plates
- electronic component
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49589—Capacitor integral with or on the leadframe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Die Erfindung betrifft ein elektronisches Bauelement mit einer integrierten Schaltung, die mit mehreren elektrische Anschlüsse bildenden Streifenleitungen verbunden ist.The invention relates to an electronic component an integrated circuit with multiple electrical Connected strip lines is connected.
Die Entwicklung von digitalen integrierten Schaltungen geht ständig in Richtung höherer Schaltgeschwindigkeiten bzw. steilerer Flanken. Damit ergeben sich jedoch Probleme durch abgestrahlte Störungen. Insbesondere wird beim Durchschalten eines Gatters die Betriebsspannungsquelle kurzzeitig hoch belastet, da vorübergehend beide eine Gegentaktendstufe bildende Transistoren gleichzeitig leitend sind.The development of digital integrated circuits continues constantly in the direction of higher switching speeds or steeper flanks. However, this creates problems radiated interference. Especially when switching through of a gate the operating voltage source briefly high burdened, since temporarily both a push-pull output stage forming transistors are conductive at the same time.
Um eine Auswirkung dieses Nadelimpulses in der Stromaufnahme auf andere, insbesondere von der gleichen Betriebsspannungsquelle versorgte Schaltungen zu verhindern, werden bei bekannten Schaltungsanordnungen im unmittelbaren Bereich der die Nadelimpulse erzeugenden integrierten Schaltung die Versorgungsleitungen mit einem Kondensator verbunden. Zu einer Wirksamkeit dieses Kondensators bei hohen Frequenzen sind jedoch kurze Leitungen zwischen dem Kondensator selbst und den Betriebsspannungsleitungen erforderlich. Bei den meisten integrierten Schaltungen, insbesondere bei Standard-CMOS-ICs, liegen jedoch die Anschlüsse für die Betriebsspannung auf entgegengesetzten Seiten des Gehäuses. Daraus ergibt sich eine Mindestlänge der Leiterbahnen zum Kondensator. Für sehr schnelle CMOS-Schaltungen sind diese Leitungen zu lang.The effect of this needle impulse in the current consumption to others, especially from the same Operating voltage source to prevent supplied circuits are in the known circuit arrangements in the immediate Area of the integrated generating pulse Circuit the supply lines with a capacitor connected. To make this capacitor effective However, high frequencies are short lines between the Capacitor itself and the operating voltage lines required. With most integrated circuits, in the case of standard CMOS ICs in particular, however Connections for the operating voltage on opposite Sides of the case. This results in a minimum length the conductor tracks to the capacitor. For very quick CMOS circuits these lines are too long.
Es sind ferner Spezialfassungen für derartige integrierte Schaltungen erhältlich, die den Kondensator auf kürzest möglichem Weg direkt unter der integrierten Schaltung anordnen. Dabei wird jedoch pro integrierter Schaltung ein zusätzliches Bauelement benötigt.There are also special versions for such integrated Circuits available that shorten the capacitor possible way directly under the integrated circuit arrange. However, one is per integrated circuit additional component required.
Aufgabe der vorliegenden Erfindung ist es, ein elektronisches Bauelement vorzuschlagen, bei welchem die obengenannten Störungen auf den Betriebsspannungsleitungen in wirtschaftlicher Weise vermieden werden.The object of the present invention is a to propose electronic component in which the above-mentioned faults on the operating voltage lines be avoided in an economical manner.
Das erfindungsgemäße elektronische Bauelement ist dadurch gekennzeichnet, daß diejenigen Streifenleitungen, welche zur Zuführung der Betriebsspannung vorgesehen sind, mit je einer Platte verbunden sind, die zusammen einen Kondensator bilden. Dabei ist vorzugsweise vorgesehen, daß die Platten einstückig mit je einer Streifenleitung verbunden sind.The electronic component according to the invention is thereby characterized in that those strip lines which for Supply of the operating voltage are provided, each with one Plate connected together which is a capacitor form. It is preferably provided that the plates are integrally connected to a strip line.
Eine Weiterbildung der Erfindung besteht darin, daß bei einem Leitungsrahmen (Leadframe), dessen einzelne Streifenleitungen durch Ausstanzen aus einem Blech hergestellt sind, der Kondensator durch Umbiegen einer der Platten gebildet wird. Damit ist eine besonders preiswerte Herstellung des Kondensators möglich.A further development of the invention is that at a lead frame, the individual of which Strip lines by punching them out of a sheet are made, the capacitor by bending one of the Plates is formed. This is a particularly inexpensive one Production of the capacitor possible.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung anhand mehrerer Figuren dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigt:An embodiment of the invention is in the drawing represented with several figures and in the following Description explained in more detail. It shows:
Fig. 1 die Ansicht einer integrierten Schaltung in einem sogenannten Dual-in-line-Gehäuse, Fig. 1 is a view of an integrated circuit in a so-called dual-line-in-housing,
Fig. 2 ein Leadframe einer bekannten integrierten Schaltung und Fig. 2 is a leadframe of a known integrated circuit and
Fig. 3 ein erfindungsgemäß ausgestaltetes Leadframe. Fig. 3 is a lead frame designed according to the invention.
Gleiche Teile sind in den Figuren mit gleichen Bezugszeichen versehen.Identical parts are given the same reference symbols in the figures Mistake.
Bei dem Bauelement gemäß Fig. 1 ist die integrierte Schaltung (Chip) in einem Gehäuse 15 angeordnet, welches auf beiden Seiten jeweils sieben Anschlüsse 1 bis 14 aufweist. Dabei sind normalerweise der Anschluß 7 für die Masseverbindung und der Anschluß 14 für die Betriebsspannung diagonal gegenüberliegend angeordnet. Zur Verbindung eines Kondensators mit diesen Anschlüssen sind entsprechend lange Leitungen erforderlich, welche die Wirkung des Kondensators beeinträchtigen.In the component according to FIG. 1, the integrated circuit (chip) is arranged in a housing 15 , which has seven connections 1 to 14 on each side. The connection 7 for the ground connection and the connection 14 for the operating voltage are normally arranged diagonally opposite one another. To connect a capacitor to these connections, correspondingly long lines are required, which impair the effect of the capacitor.
Fig. 2 stellt ein bekanntes Leadframe dar, welches aus einem Blech gestanzt ist, so daß einzelne Streifenleitungen entstehen, welche die aus dem Gehäuse herausragenden Anschlüsse und die Verbindungsleitungen bis in die Nähe der nicht dargestellten integrierten Schaltung bilden. Dabei ist die Streifenleitung des Anschlusses 7 für Masse bereits mit einer Platte 16 versehen, welche als teilweise Abschirmung der integrierten Schaltung dient. Fig. 2 shows a known lead frame, which is punched from a sheet metal, so that individual strip lines are formed, which form the connections protruding from the housing and the connecting lines up to the vicinity of the integrated circuit, not shown. The strip line of the connection 7 for ground is already provided with a plate 16 , which serves as a partial shielding of the integrated circuit.
Bei dem Ausführungsbeispiel nach Fig. 3 ist die Streifenleitung des Anschlusses 14 zu einer weiteren Platte 17 erweitert. Bei der Montage des Bauelementes wird der schraffiert dargestellte Teil der Platte 17 umgebogen, so daß er parallel zur Platte 16 liegt. Eine Isolierung zwischen den Platten 16, 17 kann durch entsprechendes Vergießen bzw. durch Einlegen einer Folie erfolgen.In the exemplary embodiment according to FIG. 3, the strip line of the connection 14 is expanded to a further plate 17 . When mounting the component, the hatched part of the plate 17 is bent so that it lies parallel to the plate 16 . Insulation between the plates 16 , 17 can be achieved by appropriate casting or by inserting a film.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19893915998 DE3915998A1 (en) | 1989-05-17 | 1989-05-17 | Electronic component with integrated circuit - has voltage supply strip lines coupled each to capacitor electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19893915998 DE3915998A1 (en) | 1989-05-17 | 1989-05-17 | Electronic component with integrated circuit - has voltage supply strip lines coupled each to capacitor electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3915998A1 true DE3915998A1 (en) | 1990-11-29 |
Family
ID=6380788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19893915998 Withdrawn DE3915998A1 (en) | 1989-05-17 | 1989-05-17 | Electronic component with integrated circuit - has voltage supply strip lines coupled each to capacitor electrode |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3915998A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0600488A2 (en) * | 1992-12-03 | 1994-06-08 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using same |
DE10051467A1 (en) * | 2000-10-17 | 2002-05-02 | Infineon Technologies Ag | Semiconducting chip housing has wiring plane with at least one resistor and/or capacitor in form of board-on-chip ball grid array with wiring structure of one or more layers |
WO2011071724A1 (en) * | 2009-12-10 | 2011-06-16 | Westinghouse Electric Company Llc | Electrical connector assembly, test lead, assembly therefor, and associated method |
CN103280442A (en) * | 2013-05-27 | 2013-09-04 | 苏州贝克微电子有限公司 | Capacitors using same lead frame and capacitive coupling isolating circuit |
-
1989
- 1989-05-17 DE DE19893915998 patent/DE3915998A1/en not_active Withdrawn
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0600488A2 (en) * | 1992-12-03 | 1994-06-08 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using same |
JPH06283662A (en) * | 1992-12-03 | 1994-10-07 | Linear Technol Corp | Lead frame capacitor and capacitive coupling type isolator circuit using it |
EP0600488A3 (en) * | 1992-12-03 | 1995-02-01 | Linear Techn Inc | Lead frame capacitor and capacitively-coupled isolator circuit using same. |
US5444600A (en) * | 1992-12-03 | 1995-08-22 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using the same |
US5589709A (en) * | 1992-12-03 | 1996-12-31 | Linear Technology Inc. | Lead frame capacitor and capacitively-coupled isolator circuit using same |
US5650357A (en) * | 1992-12-03 | 1997-07-22 | Linear Technology Corporation | Process for manufacturing a lead frame capacitor and capacitively-coupled isolator circuit using same |
JP2690264B2 (en) | 1992-12-03 | 1997-12-10 | リニアー テクノロジー コーポレイション | Lead frame capacitor and capacitive coupling type isolator circuit using the same |
US5926358A (en) * | 1992-12-03 | 1999-07-20 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using same |
US5945728A (en) * | 1992-12-03 | 1999-08-31 | Linear Technology Corporation | Lead frame capacitor and capacitively coupled isolator circuit |
DE10051467A1 (en) * | 2000-10-17 | 2002-05-02 | Infineon Technologies Ag | Semiconducting chip housing has wiring plane with at least one resistor and/or capacitor in form of board-on-chip ball grid array with wiring structure of one or more layers |
WO2011071724A1 (en) * | 2009-12-10 | 2011-06-16 | Westinghouse Electric Company Llc | Electrical connector assembly, test lead, assembly therefor, and associated method |
US8206186B2 (en) | 2009-12-10 | 2012-06-26 | Westinghouse Electric Co. Llc | Electrical connector assembly, test lead assembly therefor, and associated method |
CN103280442A (en) * | 2013-05-27 | 2013-09-04 | 苏州贝克微电子有限公司 | Capacitors using same lead frame and capacitive coupling isolating circuit |
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Legal Events
Date | Code | Title | Description |
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8139 | Disposal/non-payment of the annual fee |