DE3883908D1 - Metalldose zum Unterbringen eines IC und dazugehöriges Herstellungsverfahren. - Google Patents
Metalldose zum Unterbringen eines IC und dazugehöriges Herstellungsverfahren.Info
- Publication number
- DE3883908D1 DE3883908D1 DE88117061T DE3883908T DE3883908D1 DE 3883908 D1 DE3883908 D1 DE 3883908D1 DE 88117061 T DE88117061 T DE 88117061T DE 3883908 T DE3883908 T DE 3883908T DE 3883908 D1 DE3883908 D1 DE 3883908D1
- Authority
- DE
- Germany
- Prior art keywords
- house
- metal
- manufacturing process
- related manufacturing
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26123787 | 1987-10-16 | ||
JP26986787 | 1987-10-26 | ||
JP63174598A JPH0633015B2 (ja) | 1987-10-16 | 1988-07-13 | Ic収納用金属ケース |
JP63230509A JPH0633019B2 (ja) | 1987-10-26 | 1988-09-14 | Ic収納用金属ケースの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3883908D1 true DE3883908D1 (de) | 1993-10-14 |
DE3883908T2 DE3883908T2 (de) | 1994-04-21 |
Family
ID=27474583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88117061T Expired - Fee Related DE3883908T2 (de) | 1987-10-16 | 1988-10-13 | Metalldose zum Unterbringen eines IC und dazugehöriges Herstellungsverfahren. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4852736A (de) |
EP (1) | EP0312067B1 (de) |
KR (1) | KR930009705B1 (de) |
AU (1) | AU597192B2 (de) |
CA (1) | CA1277431C (de) |
DE (1) | DE3883908T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2625840B1 (fr) * | 1988-01-13 | 1990-06-29 | Sgs Thomson Microelectronics | Boitier destine a contenir un element fragile tel qu'un circuit logique et procede d'assemblage d'un tel boitier |
JPH0832493B2 (ja) * | 1990-04-16 | 1996-03-29 | 三菱電機株式会社 | 携帯形記憶装置およびその接続機構 |
DE9113601U1 (de) * | 1991-10-31 | 1993-03-04 | Schneider, Edgar, 8057 Günzenhausen | Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten |
DE4224103A1 (de) * | 1992-07-22 | 1994-01-27 | Manfred Dr Ing Michalk | Miniaturgehäuse mit elektronischen Bauelementen |
US5861602A (en) * | 1995-07-24 | 1999-01-19 | International Business Machines Corporation | Snap together PCMCIA cards with laser tack welded seams |
US5548485A (en) * | 1995-09-29 | 1996-08-20 | Itt Corporation | IC card rigidized cover |
US5786559A (en) * | 1995-10-17 | 1998-07-28 | Meyer Tool, Inc. | Weld-braze process |
EP0990400A3 (de) * | 1998-09-02 | 2002-05-08 | Siemens Aktiengesellschaft | Schutzhülle für elektronische Schlüssel |
KR100370176B1 (ko) * | 2000-03-23 | 2003-01-29 | 김광주 | 저용량 스팀 보일러의 물공급장치 |
JP2002183494A (ja) * | 2000-12-15 | 2002-06-28 | R & B 21:Kk | グレーディングシステム、サーバコンピュータ、カードケース、及びカード |
US6875631B2 (en) * | 2002-09-27 | 2005-04-05 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
DE10353648A1 (de) * | 2003-11-17 | 2005-06-16 | Giesecke & Devrient Gmbh | Verfahren zum Fixieren eines Chipmoduls |
US7710002B2 (en) * | 2006-06-21 | 2010-05-04 | Epson Toyocom Corporation | Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator |
US7261133B1 (en) | 2004-07-16 | 2007-08-28 | Copeland William A | Reinforced wallet |
US7163152B2 (en) * | 2004-12-15 | 2007-01-16 | Osborn Warren R | Protective container for readable cards |
US9104066B2 (en) * | 2005-08-25 | 2015-08-11 | Nec Corporation | Portable device with display unit with particular metal structure and injection molded casing |
TW200901869A (en) * | 2007-06-21 | 2009-01-01 | Metal Ind Res & Dev Ct | Electronic casing and method of manufacturing the same |
US7911774B2 (en) * | 2007-06-28 | 2011-03-22 | Epson Imaging Devices Corporation | Metal frame for electro-optical device having a folding portion and a seamless curved shape |
CN102404959A (zh) * | 2010-09-16 | 2012-04-04 | 富泰华工业(深圳)有限公司 | 电子装置及该电子装置的金属壳体的制造方法 |
US9316247B2 (en) | 2013-01-18 | 2016-04-19 | Gage Bilt, Inc. | Feed mechanism for swagable lockbolt collars |
CN104570413B (zh) * | 2013-10-25 | 2017-12-08 | 纬创资通股份有限公司 | 电子装置壳体及电子装置壳体制造方法 |
EP2974809B1 (de) | 2014-07-18 | 2018-10-24 | Gage Bilt, Inc. | Zuführvorrichtungen für schliessringe von schliessringbolzen |
JP7086503B2 (ja) * | 2018-06-20 | 2022-06-20 | コナ アイ カンパニー リミテッド | メタルカードの製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3349481A (en) * | 1964-12-29 | 1967-10-31 | Alpha Microelectronics Company | Integrated circuit sealing method and structure |
US4632250A (en) * | 1983-07-22 | 1986-12-30 | Dynic Corporation | Magnetic shielding members |
JPS60150654A (ja) * | 1984-01-18 | 1985-08-08 | Toshiba Corp | 半導体装置用ケ−ス |
JPH0219421Y2 (de) * | 1984-12-30 | 1990-05-29 | ||
JPS62154868U (de) * | 1985-08-09 | 1987-10-01 | ||
GB2178874A (en) * | 1985-08-09 | 1987-02-18 | Rock Tong | Press-key structure |
JPH0698865B2 (ja) * | 1986-02-21 | 1994-12-07 | 株式会社東芝 | メモリカード |
-
1988
- 1988-10-13 DE DE88117061T patent/DE3883908T2/de not_active Expired - Fee Related
- 1988-10-13 CA CA000580081A patent/CA1277431C/en not_active Expired - Lifetime
- 1988-10-13 EP EP88117061A patent/EP0312067B1/de not_active Expired - Lifetime
- 1988-10-14 US US07/257,866 patent/US4852736A/en not_active Expired - Fee Related
- 1988-10-15 KR KR1019880013511A patent/KR930009705B1/ko not_active IP Right Cessation
- 1988-10-17 AU AU23923/88A patent/AU597192B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0312067A3 (en) | 1990-02-14 |
DE3883908T2 (de) | 1994-04-21 |
US4852736A (en) | 1989-08-01 |
EP0312067B1 (de) | 1993-09-08 |
AU2392388A (en) | 1989-04-20 |
CA1277431C (en) | 1990-12-04 |
KR890007185A (ko) | 1989-06-19 |
AU597192B2 (en) | 1990-05-24 |
EP0312067A2 (de) | 1989-04-19 |
KR930009705B1 (ko) | 1993-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |