DE3883590D1 - Testkarte und Verfahren zu deren Rekonfiguration. - Google Patents
Testkarte und Verfahren zu deren Rekonfiguration.Info
- Publication number
- DE3883590D1 DE3883590D1 DE88105610T DE3883590T DE3883590D1 DE 3883590 D1 DE3883590 D1 DE 3883590D1 DE 88105610 T DE88105610 T DE 88105610T DE 3883590 T DE3883590 T DE 3883590T DE 3883590 D1 DE3883590 D1 DE 3883590D1
- Authority
- DE
- Germany
- Prior art keywords
- reconfiguring
- procedure
- test card
- card
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4378987A | 1987-04-29 | 1987-04-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3883590D1 true DE3883590D1 (de) | 1993-10-07 |
DE3883590T2 DE3883590T2 (de) | 1994-04-21 |
Family
ID=21928899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883883590 Expired - Fee Related DE3883590T2 (de) | 1987-04-29 | 1988-04-08 | Testkarte und Verfahren zu deren Rekonfiguration. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0288801B1 (de) |
JP (1) | JPS63274154A (de) |
CA (1) | CA1270069A (de) |
DE (1) | DE3883590T2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2677772B1 (fr) * | 1991-06-11 | 1993-10-08 | Sgs Thomson Microelectronics Sa | Carte a pointes pour testeur de puces de circuit integre. |
US5625299A (en) * | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US6603322B1 (en) * | 1996-12-12 | 2003-08-05 | Ggb Industries, Inc. | Probe card for high speed testing |
WO2001079867A1 (en) * | 2000-04-12 | 2001-10-25 | Wentworth Laboratories, Inc. | Method of making a probe test board |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963986A (en) * | 1975-02-10 | 1976-06-15 | International Business Machines Corporation | Programmable interface contactor structure |
WO1980000101A1 (en) * | 1978-06-21 | 1980-01-24 | Cerprobe Corp | Probe and interface device for integrated circuit wafers |
US4523144A (en) * | 1980-05-27 | 1985-06-11 | Japan Electronic Materials Corp. | Complex probe card for testing a semiconductor wafer |
JPS57194367A (en) * | 1981-05-27 | 1982-11-29 | Hitachi Ltd | Tester for electronic parts |
US4510445A (en) * | 1981-11-02 | 1985-04-09 | Joseph Kvaternik | Miniature circuit processing devices and matrix test heads for use therein |
US4488111A (en) * | 1982-06-01 | 1984-12-11 | At&T Technologies, Inc. | Coupling devices for operations such as testing |
US4567432A (en) * | 1983-06-09 | 1986-01-28 | Texas Instruments Incorporated | Apparatus for testing integrated circuits |
JPS60242379A (ja) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | プロ−ブカ−ド |
JPS6138191U (ja) * | 1984-08-08 | 1986-03-10 | 三菱重工業株式会社 | プロペラ摺合せ用吊り装置 |
-
1988
- 1988-03-17 JP JP63062106A patent/JPS63274154A/ja active Granted
- 1988-03-28 CA CA000562615A patent/CA1270069A/en not_active Expired - Fee Related
- 1988-04-08 EP EP19880105610 patent/EP0288801B1/de not_active Expired - Lifetime
- 1988-04-08 DE DE19883883590 patent/DE3883590T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0288801A2 (de) | 1988-11-02 |
JPH0580146B2 (de) | 1993-11-08 |
CA1270069A (en) | 1990-06-05 |
EP0288801B1 (de) | 1993-09-01 |
JPS63274154A (ja) | 1988-11-11 |
DE3883590T2 (de) | 1994-04-21 |
EP0288801A3 (en) | 1988-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |