DE3807892C2 - SMD high-frequency transformer for wave soldering technology and method for mounting the same on a circuit board - Google Patents
SMD high-frequency transformer for wave soldering technology and method for mounting the same on a circuit boardInfo
- Publication number
- DE3807892C2 DE3807892C2 DE19883807892 DE3807892A DE3807892C2 DE 3807892 C2 DE3807892 C2 DE 3807892C2 DE 19883807892 DE19883807892 DE 19883807892 DE 3807892 A DE3807892 A DE 3807892A DE 3807892 C2 DE3807892 C2 DE 3807892C2
- Authority
- DE
- Germany
- Prior art keywords
- frequency transformer
- circuit board
- mounting
- wave soldering
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
- H01F2005/046—Details of formers and pin terminals related to mounting on printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Description
Die Erfindung bezieht sich auf einen Hochfrequenztransfor mator für die Schwall-Löttechnik gemäß dem Oberbegriff des Patentanspruchs 1 sowie auf ein Verfahren zum Montieren desselben auf einer Platine.The invention relates to a high-frequency transform mator for wave soldering technology according to the generic term of claim 1 and a method for mounting the same on a circuit board.
Derartige Hochfrequenztransformatoren sind beispielsweise aus dem Artikel "Surface mounting pushes new designs in chip inductors" von H. Winard in der Zeitschrift Electronic Design vom März 1986, Band 34, Nr. 6 auf den Seiten 41 bis 46, bekannt.Such high-frequency transformers are, for example from the article "Surface mounting pushes new designs in chip inductors "by H. Winard in the magazine Electronic Design vom March 1986, Volume 34, No. 6 on pages 41 to 46.
Hochfrequenztransformatoren der im Oberbegriff des Patent anspruchs 1 angegebenen Art sind als Symmetrier-Transforma toren, Impedanz-Transformatoren, Differential-Transformato ren etc. von der Anmelderin bisher in einem Kontaktstifte tragenden Rahmen montiert worden und konnten hierdurch automatisch auf der Platine montiert werden. Um ein sattes Aufliegen auf der Platine bzw. der gedruckten Schaltung zu gewährleisten, wurden die Spulendrähte auf der Oberseite des Rahmens an die durchra genden Anschlußstifte gelötet, das so vorbereitete Bauteil dann automatisch in die korrespondierenden Löcher der gedruckten Schaltung gesteckt und dann auf konventionelle Weise mittels Lötwelle verlötet. Die hierfür erforderlichen Lötaugen bewirken bei den Frequenzen, für die diese Trans formatoren vorzugsweise verwendet werden, bereits Störungen im Frequenzverlauf durch parasitäre Kapazitäten.High frequency transformers in the preamble of the patent claims 1 specified are as symmetry transforma gates, impedance transformers, differential transformato ren etc. by the applicant in a contact pin load-bearing frame and could thereby can be automatically mounted on the board. To ensure that it is fully seated on the board or to ensure the printed circuit, the Coil wires on the top of the frame to the through The connector pins soldered, the component thus prepared then automatically into the corresponding holes in the printed circuit board and then on conventional Way soldered using a soldering wave. The necessary for this At the frequencies for which these trans Formators are preferably used, already malfunctions in the frequency response due to parasitic capacitances.
Das letztere gilt auch für die bekannten Einrichtungen zum richtungsabhängigen Übertragen von breitbandigen Signa len gemäß DE 24 48 789 A1, die mehrere, auf einen Mehrloch- Kern gewickelte Spulenwicklungen aufweisen, deren Enden durch Bohrungen in einer gedruckten Leiterplatte geführt und auf der von den Einrichtungen abgewendeten Platinensei te mit den Leiterbahnen verlötet sind.The latter also applies to the known facilities for directional transmission of broadband Signa len according to DE 24 48 789 A1, which several, on a multi-hole Core wound coil windings have their ends through holes in a printed circuit board and on the board side turned away from the facilities te are soldered to the conductor tracks.
Die an sich naheliegende Montage in SMD-Technik scheidet für Transformatoren und Einrichtungen dieser bekannten Art aus, weil das Bauteil die Löttemperatur nicht verträgt und auch die Gefahr besteht, daß die Wickeldrähte unkon trolliert miteinander verlötet werden.The obvious assembly in SMD technology is different for transformers and devices of these known Kind of because the component does not tolerate the soldering temperature and there is also a risk that the winding wires uncon trolled to be soldered together.
Auch ein Überzug des Bauteils mit einem hitzebeständigen Lack oder dgl. verbietet sich, weil dieser die elektrischen Eigenschaften des Transformators sehr nachteilig beein flußt.Also covering the component with a heat-resistant one Varnish or the like is forbidden because of this the electrical Properties of the transformer very adversely affected flows.
Gegenüber dem vorstehend geschilderten Stand der Technik liegt der Erfindung die Aufgabe zugrunde, einen Hochfre quenztransformator gemäß dem Oberbegriff des Patentan spruchs 1 zu schaffen, der sich für die Oberflächenmontage eignet, ohne daß die Gefahr besteht, daß er bei der Schwall-Lötung durch das heiße Lot beschädigt wird und/oder seine Wickeldrähte unkontrolliert miteinander verlötet werden, so daß er zusammen mit anderen Bauteilen in einem einzigen Arbeitsgang in SMD-Technik auf einer Platine montiert werden kann.Compared to the prior art described above the invention has for its object a Hochfre quenztransformer according to the preamble of the patent Proverb 1 to create the surface mount is suitable without the risk that he at the Gush soldering is damaged by the hot solder and / or his winding wires soldered together in an uncontrolled manner be so that it is together with other components in one single operation in SMD technology on a circuit board can be assembled.
Die vorstehende Aufgabe wird durch die im Kennzeichnungs teil des Anspruchs 1 genannten Merkmale gelöst.The above task is accomplished by the in labeling Part of claim 1 mentioned features solved.
Ein bevorzugtes Verfahren zur Montage des erfindungsgemäßen Transformators ist im Anspruch 3 angegeben.A preferred method for assembling the invention Transformer is specified in claim 3.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand der Zeichnung näher erläutert. Die Zeichnung zeigt eine bevorzugte Ausführungsform des erfindungsgemäßen Hochfrequenztransformators in Vorderansicht und Seitenan sicht jeweils im Schnitt, sowie in Draufsicht.An embodiment of the invention is as follows explained in more detail with reference to the drawing. The drawing shows a preferred embodiment of the invention High frequency transformers in front view and side view view in section, as well as in plan view.
Der bewickelte Kern 1, der ein Ringkern oder Zweiloch- Kern aus magnetisch leitendem Material, vorzugsweise Fer rit, sein kann, liegt in einer Art Wanne 2, die die notwen dige Anzahl von Anschlußstiften 3 trägt, und zwar normaler weise asymmetrisch 2 + 3 oder 2 + 4 Stück, um eine Orien tierungshilfe zu geben. Diese Stifte 3 sind rechtwinklig dergestalt abgebogen, daß sie über die Stirnseiten heraus ragen.The wound core 1 , which can be a toroidal or two-hole core made of magnetically conductive material, preferably fer rit, is in a type of tub 2 , which carries the necessary number of pins 3 , usually asymmetrically 2 + 3 or 2 + 4 pieces to give a guide. These pins 3 are bent at right angles in such a way that they protrude beyond the end faces.
Die Wanne 2 ist darüber hinaus auf der Seite, die drei oder vier Stifte trägt, verbreitert. Diese Verbreiterungen bilden Elemente, die als zusätzliche Orientierungshilfe für einen Montageautomaten dienen. Weiterhin befinden sich in der Wanne Snap-in-Vorrichtungen 4, damit während der Montage in einen korrespondierenden Ausschnitt der gedruckten Schaltung oder Platine 6 bis zum eigentlichen Verlöten eine Befestigung vorhanden ist. Die Wicklungsdräh te werden über den Außenrand der Wanne 2 hinweg an die abgewinkelten Anschlußstifte 3 gelegt und dann im Zuge der Schwall-Lötung zugleich mit den Stiften mit den ent sprechenden Leitungszügen 5 verlötet.The tub 2 is also widened on the side that carries three or four pins. These widenings form elements that serve as an additional orientation aid for an automatic assembly machine. Furthermore, snap-in devices 4 are located in the tub, so that an attachment is present during assembly in a corresponding cutout of the printed circuit or circuit board 6 until the actual soldering. The Wickwickdräh te are placed over the outer edge of the tub 2 to the angled pins 3 and then soldered to the pins with the appropriate cable 5 in the course of the wave soldering.
Die Vorteile der erfindungsgemäßen Konstruktion des be schriebenen Hochfrequenztransformators sind folgende:The advantages of the construction of the invention high frequency transformers are as follows:
- - Möglichkeit der automatischen Bestückung von der Lötseite einer gedruckten Schaltung oder Platine her,- Possibility of automatic assembly of the Solder side of a printed circuit or board ago,
- - besseres Handling mittels Unterdruckpipette durch eine größere feststehende Fläche,- Better handling with a vacuum pipette a larger fixed area,
- - Schwall-Lötung in einem Arbeitsgang mit anderen SMD-Bauteilen,- Wave soldering in one step with others SMD components,
- - dadurch Wegfall eines zweiten gesonderten Löt- und Bestückungsprozesses für HF-Transformatoren, und- thereby eliminating a second separate soldering and assembly process for HF transformers, and
- - bessere elektrische Daten des HF-Transformators im montierten Zustand.- better electrical data of the HF transformer in the assembled state.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19883807892 DE3807892C2 (en) | 1988-03-10 | 1988-03-10 | SMD high-frequency transformer for wave soldering technology and method for mounting the same on a circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19883807892 DE3807892C2 (en) | 1988-03-10 | 1988-03-10 | SMD high-frequency transformer for wave soldering technology and method for mounting the same on a circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3807892A1 DE3807892A1 (en) | 1989-09-21 |
DE3807892C2 true DE3807892C2 (en) | 1994-06-01 |
Family
ID=6349338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883807892 Expired - Fee Related DE3807892C2 (en) | 1988-03-10 | 1988-03-10 | SMD high-frequency transformer for wave soldering technology and method for mounting the same on a circuit board |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3807892C2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4129039C2 (en) * | 1991-08-31 | 1995-05-04 | Vogt Electronic Ag | High frequency transformer for SMD assembly |
FI105294B (en) | 1997-12-16 | 2000-07-14 | Nokia Networks Oy | Arrangement for realizing a magnetic circuit on a circuit board |
DE19830967C2 (en) * | 1998-07-10 | 2000-06-08 | Epcos Ag | Electromagnetic component |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2059861C3 (en) * | 1970-12-04 | 1980-08-28 | Toko K.K., Tokio | Tunable high frequency transformer |
DE2257605A1 (en) * | 1972-11-24 | 1974-05-30 | Bosch Elektronik Gmbh | HIGH FREQUENCY TRANSMITTER |
DE2448789A1 (en) * | 1974-10-12 | 1976-04-22 | Bosch Gmbh Robert | Directional transmission device for wideband signals - has one input and two outputs which are used for branching off in community aerials |
-
1988
- 1988-03-10 DE DE19883807892 patent/DE3807892C2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
Also Published As
Publication number | Publication date |
---|---|
DE3807892A1 (en) | 1989-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |