DE3789048D1 - Optische Zwischenverbindung von Geräten auf Chips. - Google Patents
Optische Zwischenverbindung von Geräten auf Chips.Info
- Publication number
- DE3789048D1 DE3789048D1 DE87309789T DE3789048T DE3789048D1 DE 3789048 D1 DE3789048 D1 DE 3789048D1 DE 87309789 T DE87309789 T DE 87309789T DE 3789048 T DE3789048 T DE 3789048T DE 3789048 D1 DE3789048 D1 DE 3789048D1
- Authority
- DE
- Germany
- Prior art keywords
- chips
- devices
- optical interconnection
- interconnection
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/34—Optical coupling means utilising prism or grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
- H01L31/173—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers formed in, or on, a common substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/803—Free space interconnects, e.g. between circuit boards or chips
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Transform (AREA)
- Semiconductor Lasers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/930,672 US4711997A (en) | 1986-11-14 | 1986-11-14 | Optical interconnection of devices on chips |
SG44194A SG44194G (en) | 1986-11-14 | 1994-03-25 | Optical interconnection of devices on chips |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3789048D1 true DE3789048D1 (de) | 1994-03-24 |
DE3789048T2 DE3789048T2 (de) | 1994-05-11 |
Family
ID=26663989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87309789T Expired - Fee Related DE3789048T2 (de) | 1986-11-14 | 1987-11-05 | Optische Zwischenverbindung von Geräten auf Chips. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4711997A (de) |
EP (1) | EP0268404B1 (de) |
JP (1) | JP2757989B2 (de) |
AU (1) | AU582314B2 (de) |
DE (1) | DE3789048T2 (de) |
ES (1) | ES2048739T3 (de) |
HK (1) | HK104594A (de) |
SG (1) | SG44194G (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4966447A (en) * | 1989-04-28 | 1990-10-30 | At&T Bell Laboratories | Integration of free-space planar optical components |
US5047623A (en) * | 1990-02-02 | 1991-09-10 | The United States Of America As Represented By The United States Department Of Energy | Transparent selective illumination means suitable for use in optically activated electrical switches and optically activated electrical switches constructed using same |
GB9024713D0 (en) * | 1990-11-14 | 1991-01-02 | Plessey Telecomm | Optical backplane interconnecting circuit boards |
US5151606A (en) * | 1991-01-23 | 1992-09-29 | Grumman Aerospace Corporation | Lambertian mirror optical |
US5237434A (en) * | 1991-11-05 | 1993-08-17 | Mcnc | Microelectronic module having optical and electrical interconnects |
US5434524A (en) * | 1992-09-16 | 1995-07-18 | International Business Machines Corporation | Method of clocking integrated circuit chips |
DE4313486C2 (de) * | 1992-11-25 | 1994-09-01 | Ant Nachrichtentech | Anordnung zur Ankopplung eines Lichtwellenleiters an mindestens ein lichtaussendendes oder -empfangendes Element |
JP2842132B2 (ja) * | 1993-03-05 | 1998-12-24 | 松下電器産業株式会社 | 光学デバイス |
ES2142897T3 (es) * | 1993-09-30 | 2000-05-01 | Siemens Microelectronics Inc | Optoacoplador lineal bidireccional. |
EP0653654B1 (de) * | 1993-11-09 | 2001-09-26 | Agilent Technologies Inc. a Delaware Corporation | Optische Detektoren und Quellen mit integrierten holographischen optischen Elementen für optoelektronische Verbindungen |
US5751009A (en) * | 1996-04-25 | 1998-05-12 | Motorola, Inc. | Optical isolator having leadframe with non-planar mounting portions |
US5790728A (en) * | 1996-06-28 | 1998-08-04 | Motorola, Inc. | Optical coupling component and method of making the same |
US6051848A (en) * | 1998-03-02 | 2000-04-18 | Motorola, Inc. | Optical device packages containing an optical transmitter die |
US7024067B2 (en) * | 2001-10-19 | 2006-04-04 | Visteon Global Technologies, Inc. | Communication system with a signal conduction matrix and surface signal router |
GB2385664B (en) * | 2001-10-19 | 2004-03-10 | Visteon Global Tech Inc | LCC-Based strain-gage sensor integrated with cylinder-head gasket |
US9177884B2 (en) * | 2012-10-09 | 2015-11-03 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method |
US9443835B2 (en) | 2014-03-14 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods |
US9305908B2 (en) | 2014-03-14 | 2016-04-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods |
US9541717B2 (en) | 2015-01-30 | 2017-01-10 | Avago Technologies General IP (Singapore) Pta. Ltd. | Optoelectronic assembly incorporating an optical fiber alignment structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2258215A1 (de) * | 1972-11-28 | 1974-05-30 | Max Planck Gesellschaft | Selektive optische koppelvorrichtung |
US4124860A (en) * | 1975-02-27 | 1978-11-07 | Optron, Inc. | Optical coupler |
JPS5651884A (en) * | 1979-10-03 | 1981-05-09 | Hitachi Ltd | Light sending and recieving element |
US4525687A (en) * | 1983-02-28 | 1985-06-25 | At&T Bell Laboratories | High speed light modulator using multiple quantum well structures |
FR2590995B1 (fr) * | 1985-02-26 | 1988-08-19 | Thomson Csf | Dispositif d'interconnexion optique de cartes de composants electroniques dans un coffret et procede de fabrication |
US4744623A (en) * | 1985-10-16 | 1988-05-17 | The Trustees Of Columbia University In The City Of New York | Integrated fiber optic coupler for VHSIC/VLSI interconnects |
-
1986
- 1986-11-14 US US06/930,672 patent/US4711997A/en not_active Expired - Lifetime
-
1987
- 1987-11-05 EP EP87309789A patent/EP0268404B1/de not_active Expired - Lifetime
- 1987-11-05 ES ES87309789T patent/ES2048739T3/es not_active Expired - Lifetime
- 1987-11-05 DE DE87309789T patent/DE3789048T2/de not_active Expired - Fee Related
- 1987-11-10 JP JP62282301A patent/JP2757989B2/ja not_active Expired - Fee Related
- 1987-11-12 AU AU81131/87A patent/AU582314B2/en not_active Ceased
-
1994
- 1994-03-25 SG SG44194A patent/SG44194G/en unknown
- 1994-09-29 HK HK104594A patent/HK104594A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SG44194G (en) | 1995-03-17 |
EP0268404A2 (de) | 1988-05-25 |
DE3789048T2 (de) | 1994-05-11 |
AU582314B2 (en) | 1989-03-16 |
US4711997A (en) | 1987-12-08 |
EP0268404A3 (en) | 1989-11-15 |
JPS63136005A (ja) | 1988-06-08 |
EP0268404B1 (de) | 1994-02-09 |
ES2048739T3 (es) | 1994-04-01 |
HK104594A (en) | 1994-10-07 |
JP2757989B2 (ja) | 1998-05-25 |
AU8113187A (en) | 1988-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |