DE3789048D1 - Optische Zwischenverbindung von Geräten auf Chips. - Google Patents

Optische Zwischenverbindung von Geräten auf Chips.

Info

Publication number
DE3789048D1
DE3789048D1 DE87309789T DE3789048T DE3789048D1 DE 3789048 D1 DE3789048 D1 DE 3789048D1 DE 87309789 T DE87309789 T DE 87309789T DE 3789048 T DE3789048 T DE 3789048T DE 3789048 D1 DE3789048 D1 DE 3789048D1
Authority
DE
Germany
Prior art keywords
chips
devices
optical interconnection
interconnection
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87309789T
Other languages
English (en)
Other versions
DE3789048T2 (de
Inventor
David Andrew Barclay Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of DE3789048D1 publication Critical patent/DE3789048D1/de
Publication of DE3789048T2 publication Critical patent/DE3789048T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/34—Optical coupling means utilising prism or grating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • H01L31/173—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers formed in, or on, a common substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H04B10/803—Free space interconnects, e.g. between circuit boards or chips

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Transform (AREA)
  • Semiconductor Lasers (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
DE87309789T 1986-11-14 1987-11-05 Optische Zwischenverbindung von Geräten auf Chips. Expired - Fee Related DE3789048T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/930,672 US4711997A (en) 1986-11-14 1986-11-14 Optical interconnection of devices on chips
SG44194A SG44194G (en) 1986-11-14 1994-03-25 Optical interconnection of devices on chips

Publications (2)

Publication Number Publication Date
DE3789048D1 true DE3789048D1 (de) 1994-03-24
DE3789048T2 DE3789048T2 (de) 1994-05-11

Family

ID=26663989

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87309789T Expired - Fee Related DE3789048T2 (de) 1986-11-14 1987-11-05 Optische Zwischenverbindung von Geräten auf Chips.

Country Status (8)

Country Link
US (1) US4711997A (de)
EP (1) EP0268404B1 (de)
JP (1) JP2757989B2 (de)
AU (1) AU582314B2 (de)
DE (1) DE3789048T2 (de)
ES (1) ES2048739T3 (de)
HK (1) HK104594A (de)
SG (1) SG44194G (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966447A (en) * 1989-04-28 1990-10-30 At&T Bell Laboratories Integration of free-space planar optical components
US5047623A (en) * 1990-02-02 1991-09-10 The United States Of America As Represented By The United States Department Of Energy Transparent selective illumination means suitable for use in optically activated electrical switches and optically activated electrical switches constructed using same
GB9024713D0 (en) * 1990-11-14 1991-01-02 Plessey Telecomm Optical backplane interconnecting circuit boards
US5151606A (en) * 1991-01-23 1992-09-29 Grumman Aerospace Corporation Lambertian mirror optical
US5237434A (en) * 1991-11-05 1993-08-17 Mcnc Microelectronic module having optical and electrical interconnects
US5434524A (en) * 1992-09-16 1995-07-18 International Business Machines Corporation Method of clocking integrated circuit chips
DE4313486C2 (de) * 1992-11-25 1994-09-01 Ant Nachrichtentech Anordnung zur Ankopplung eines Lichtwellenleiters an mindestens ein lichtaussendendes oder -empfangendes Element
JP2842132B2 (ja) * 1993-03-05 1998-12-24 松下電器産業株式会社 光学デバイス
ES2142897T3 (es) * 1993-09-30 2000-05-01 Siemens Microelectronics Inc Optoacoplador lineal bidireccional.
EP0653654B1 (de) * 1993-11-09 2001-09-26 Agilent Technologies Inc. a Delaware Corporation Optische Detektoren und Quellen mit integrierten holographischen optischen Elementen für optoelektronische Verbindungen
US5751009A (en) * 1996-04-25 1998-05-12 Motorola, Inc. Optical isolator having leadframe with non-planar mounting portions
US5790728A (en) * 1996-06-28 1998-08-04 Motorola, Inc. Optical coupling component and method of making the same
US6051848A (en) * 1998-03-02 2000-04-18 Motorola, Inc. Optical device packages containing an optical transmitter die
US7024067B2 (en) * 2001-10-19 2006-04-04 Visteon Global Technologies, Inc. Communication system with a signal conduction matrix and surface signal router
GB2385664B (en) * 2001-10-19 2004-03-10 Visteon Global Tech Inc LCC-Based strain-gage sensor integrated with cylinder-head gasket
US9177884B2 (en) * 2012-10-09 2015-11-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method
US9443835B2 (en) 2014-03-14 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
US9305908B2 (en) 2014-03-14 2016-04-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods
US9541717B2 (en) 2015-01-30 2017-01-10 Avago Technologies General IP (Singapore) Pta. Ltd. Optoelectronic assembly incorporating an optical fiber alignment structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2258215A1 (de) * 1972-11-28 1974-05-30 Max Planck Gesellschaft Selektive optische koppelvorrichtung
US4124860A (en) * 1975-02-27 1978-11-07 Optron, Inc. Optical coupler
JPS5651884A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Light sending and recieving element
US4525687A (en) * 1983-02-28 1985-06-25 At&T Bell Laboratories High speed light modulator using multiple quantum well structures
FR2590995B1 (fr) * 1985-02-26 1988-08-19 Thomson Csf Dispositif d'interconnexion optique de cartes de composants electroniques dans un coffret et procede de fabrication
US4744623A (en) * 1985-10-16 1988-05-17 The Trustees Of Columbia University In The City Of New York Integrated fiber optic coupler for VHSIC/VLSI interconnects

Also Published As

Publication number Publication date
SG44194G (en) 1995-03-17
EP0268404A2 (de) 1988-05-25
DE3789048T2 (de) 1994-05-11
AU582314B2 (en) 1989-03-16
US4711997A (en) 1987-12-08
EP0268404A3 (en) 1989-11-15
JPS63136005A (ja) 1988-06-08
EP0268404B1 (de) 1994-02-09
ES2048739T3 (es) 1994-04-01
HK104594A (en) 1994-10-07
JP2757989B2 (ja) 1998-05-25
AU8113187A (en) 1988-05-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee