DE3787367D1 - Heater for semiconductor wafers. - Google Patents

Heater for semiconductor wafers.

Info

Publication number
DE3787367D1
DE3787367D1 DE87304297T DE3787367T DE3787367D1 DE 3787367 D1 DE3787367 D1 DE 3787367D1 DE 87304297 T DE87304297 T DE 87304297T DE 3787367 T DE3787367 T DE 3787367T DE 3787367 D1 DE3787367 D1 DE 3787367D1
Authority
DE
Germany
Prior art keywords
heater
semiconductor wafers
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87304297T
Other languages
German (de)
Other versions
DE3787367T2 (en
Inventor
Anita S Gat
Eugene R Westerberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PROCESSING TECHNOLOGIES Inc AG
Original Assignee
PROCESSING TECHNOLOGIES Inc AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROCESSING TECHNOLOGIES Inc AG filed Critical PROCESSING TECHNOLOGIES Inc AG
Application granted granted Critical
Publication of DE3787367D1 publication Critical patent/DE3787367D1/en
Publication of DE3787367T2 publication Critical patent/DE3787367T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D99/00—Subject matter not provided for in other groups of this subclass
    • F27D99/0001—Heating elements or systems
    • F27D99/0006—Electric heating elements or system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B5/14—Arrangements of heating devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0003—Monitoring the temperature or a characteristic of the charge and using it as a controlling value
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0093—Maintaining a temperature gradient
DE19873787367 1987-05-14 1987-05-14 Heater for semiconductor wafers. Expired - Fee Related DE3787367T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19870304297 EP0290692B1 (en) 1987-05-14 1987-05-14 Apparatus for heating semiconductor wafers

Publications (2)

Publication Number Publication Date
DE3787367D1 true DE3787367D1 (en) 1993-10-14
DE3787367T2 DE3787367T2 (en) 1994-04-14

Family

ID=8197911

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873787367 Expired - Fee Related DE3787367T2 (en) 1987-05-14 1987-05-14 Heater for semiconductor wafers.

Country Status (2)

Country Link
EP (1) EP0290692B1 (en)
DE (1) DE3787367T2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5359693A (en) * 1991-07-15 1994-10-25 Ast Elektronik Gmbh Method and apparatus for a rapid thermal processing of delicate components
DE4223133A1 (en) * 1991-07-15 1993-01-21 T Elektronik Gmbh As Rapid thermal processing of sensitive devices - using heat source programme control to avoid defects in e.g. semiconductor devices
FR2794054B1 (en) * 1999-05-31 2001-08-10 Faure Bertrand Equipements Sa METHOD AND DEVICE FOR ASSEMBLING A MATTRESS BY ADHESIVE WITH A SEAT COVER FOR A SEAT

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3836751A (en) * 1973-07-26 1974-09-17 Applied Materials Inc Temperature controlled profiling heater
JPS59928A (en) * 1982-06-25 1984-01-06 Ushio Inc Photo heating device
JPS5938584A (en) * 1982-08-30 1984-03-02 ウシオ電機株式会社 Method of operating irradiating heating furnace
JPS5959876A (en) * 1982-09-30 1984-04-05 Ushio Inc Operating method of light irradiation furnace
GB2136937A (en) * 1983-03-18 1984-09-26 Philips Electronic Associated A furnace for rapidly heating semiconductor bodies

Also Published As

Publication number Publication date
EP0290692A1 (en) 1988-11-17
DE3787367T2 (en) 1994-04-14
EP0290692B1 (en) 1993-09-08

Similar Documents

Publication Publication Date Title
DE3750589T2 (en) Packaging for semiconductor elements.
DE3883873D1 (en) Carrier element for semiconductor apparatus.
DE3850855T2 (en) Semiconductor device.
DE3481957D1 (en) SEMICONDUCTOR ARRANGEMENT.
DE3583302D1 (en) SEMICONDUCTOR ARRANGEMENT.
DE68914479T2 (en) Edge exposure process for semiconductor wafers.
DE3483680D1 (en) SEMICONDUCTOR VALVE.
DE3767362D1 (en) WAFER SUPPORT FOR SEMICONDUCTOR COMPONENT PRODUCTION.
DE3584799D1 (en) SEMICONDUCTOR DEVICE.
DE3853764D1 (en) Intermediate system for integrated semiconductor circuits.
DE3750558T2 (en) Transfer system for semiconductor wafers.
DE3874469D1 (en) MEASURING METHOD FOR SEMICONDUCTOR ARRANGEMENT.
DE3786070D1 (en) COATED SEMICONDUCTOR ARRANGEMENT.
DE3582653D1 (en) SEMICONDUCTOR ARRANGEMENT.
DE3581370D1 (en) SEMICONDUCTOR DEVICE.
DE68913481T2 (en) Wafer positioning mechanism for notched wafers.
DE3787357D1 (en) Control circuit for semiconductor memories.
DE3889354D1 (en) Semiconductor device.
DE3887823T2 (en) Semiconductor memory.
DE3586568T2 (en) SEMICONDUCTOR DEVICE.
DE3587451D1 (en) SEMICONDUCTOR TRANSFER STRUCTURE.
DE3484817D1 (en) SEMICONDUCTOR ARRANGEMENT.
DE3787137D1 (en) SEMICONDUCTOR ARRANGEMENT.
DE69020772T2 (en) Trough formation for semiconductor components.
DE3886286T2 (en) Connection method for semiconductor device.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee