DE3786844T2 - Integrated circuit pack. - Google Patents

Integrated circuit pack.

Info

Publication number
DE3786844T2
DE3786844T2 DE87304862T DE3786844T DE3786844T2 DE 3786844 T2 DE3786844 T2 DE 3786844T2 DE 87304862 T DE87304862 T DE 87304862T DE 3786844 T DE3786844 T DE 3786844T DE 3786844 T2 DE3786844 T2 DE 3786844T2
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit pack
pack
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87304862T
Other languages
German (de)
Other versions
DE3786844D1 (en
Inventor
Norio Hidaka
Yasutake Hirachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62125733A external-priority patent/JPS63107055A/en
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3786844D1 publication Critical patent/DE3786844D1/en
Publication of DE3786844T2 publication Critical patent/DE3786844T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE87304862T 1986-06-02 1987-06-02 Integrated circuit pack. Expired - Fee Related DE3786844T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12773986 1986-06-02
JP62125733A JPS63107055A (en) 1986-06-02 1987-05-25 Package for integrated circuit

Publications (2)

Publication Number Publication Date
DE3786844D1 DE3786844D1 (en) 1993-09-09
DE3786844T2 true DE3786844T2 (en) 1993-11-11

Family

ID=26462067

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87304862T Expired - Fee Related DE3786844T2 (en) 1986-06-02 1987-06-02 Integrated circuit pack.

Country Status (4)

Country Link
US (1) US4881116A (en)
EP (1) EP0249378B1 (en)
CA (1) CA1320006C (en)
DE (1) DE3786844T2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922325A (en) * 1987-10-02 1990-05-01 American Telephone And Telegraph Company Multilayer ceramic package with high frequency connections
EP0331289A3 (en) * 1988-02-26 1991-04-03 Hitachi, Ltd. Semiconductor device with impedance matching means
US5132770A (en) * 1988-08-25 1992-07-21 Kabushiki Kaisha Toshiba Semiconductor device having improved multi-layered substrate structure
GB2233821A (en) * 1989-07-11 1991-01-16 Oxley Dev Co Ltd Ceramic package including a semiconductor chip
US5150280A (en) * 1989-08-11 1992-09-22 Fujitsu Limited Electronic circuit package
US5206986A (en) * 1989-08-11 1993-05-04 Fujitsu Limited Method of producing an electronic circuit package
FR2655195B1 (en) * 1989-11-24 1997-07-18 Mitsubishi Electric Corp SEMICONDUCTOR DEVICE HAVING ELECTROMAGNETIC RADIATION SHIELDING AND MANUFACTURING METHOD.
US5256590A (en) * 1989-11-24 1993-10-26 Mitsubishi Denki Kabushiki Kaisha Method of making a shielded semiconductor device
JPH0766949B2 (en) * 1990-09-28 1995-07-19 富士通株式会社 IC package
JPH04256203A (en) * 1991-02-07 1992-09-10 Mitsubishi Electric Corp Package for microwave band ic
JP2766920B2 (en) * 1992-01-07 1998-06-18 三菱電機株式会社 IC package and its mounting method
US5283463A (en) * 1992-03-05 1994-02-01 Westinghouse Electric Corp. High power self commutating semiconductor switch
US5468994A (en) * 1992-12-10 1995-11-21 Hewlett-Packard Company High pin count package for semiconductor device
US5338970A (en) * 1993-03-24 1994-08-16 Intergraph Corporation Multi-layered integrated circuit package with improved high frequency performance
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US6172412B1 (en) * 1993-10-08 2001-01-09 Stratedge Corporation High frequency microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5631807A (en) * 1995-01-20 1997-05-20 Minnesota Mining And Manufacturing Company Electronic circuit structure with aperture suspended component
US5602421A (en) * 1995-01-31 1997-02-11 Hughes Aircraft Company Microwave monolithic integrated circuit package with improved RF ports
US5650760A (en) * 1995-11-13 1997-07-22 Hughes Aircraft Company Microwave enclosure
US6301122B1 (en) 1996-06-13 2001-10-09 Matsushita Electric Industrial Co., Ltd. Radio frequency module with thermally and electrically coupled metal film on insulating substrate
WO1998020528A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE
US5955704A (en) * 1996-11-21 1999-09-21 Dell U.S.A., L.P. Optimal PWA high density routing to minimize EMI substrate coupling in a computer system
FR2769130B1 (en) * 1997-09-30 2001-06-08 Thomson Csf METHOD FOR COATING AN ELECTRONIC CHIP AND ELECTRONIC CARD COMPRISING AT LEAST ONE COATED CHIP ACCORDING TO THIS PROCESS
EP1298728A1 (en) * 2001-09-27 2003-04-02 Agilent Technologies, Inc. (a Delaware corporation) IC package with an electromagnetic interference screening device
US6960490B2 (en) * 2002-03-14 2005-11-01 Epitactix Pty Ltd. Method and resulting structure for manufacturing semiconductor substrates
JP3938742B2 (en) * 2002-11-18 2007-06-27 Ｎｅｃエレクトロニクス株式会社 Electronic component device and manufacturing method thereof
US20070251883A1 (en) * 2006-04-28 2007-11-01 Niu Q Jason Reverse Osmosis Membrane with Branched Poly(Alkylene Oxide) Modified Antifouling Surface
JP2010034212A (en) * 2008-07-28 2010-02-12 Toshiba Corp High-frequency ceramic package and method of fabricating the same
TWI446506B (en) * 2011-01-05 2014-07-21 Unimicron Technology Corp Package substrate having a via hole and fabrication method thereof
JP7156641B2 (en) 2019-02-14 2022-10-19 住友電工デバイス・イノベーション株式会社 Packages for semiconductor devices and semiconductor devices
CN113838826A (en) * 2020-06-23 2021-12-24 华邦电子股份有限公司 Package structure and method for manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854661A (en) * 1981-09-29 1983-03-31 Fujitsu Ltd Multilayer ceramic semiconductor package
JPS58190046A (en) * 1982-04-30 1983-11-05 Fujitsu Ltd Semiconductor device
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
US4560962A (en) * 1983-08-30 1985-12-24 Burroughs Corporation Multilayered printed circuit board with controlled 100 ohm impedance
JPS60134440A (en) * 1983-12-23 1985-07-17 Hitachi Ltd Semiconductor integrated circuit device
US4673904A (en) * 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate

Also Published As

Publication number Publication date
EP0249378B1 (en) 1993-08-04
EP0249378A2 (en) 1987-12-16
EP0249378A3 (en) 1988-10-12
US4881116A (en) 1989-11-14
DE3786844D1 (en) 1993-09-09
CA1320006C (en) 1993-07-06

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Legal Events

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8339 Ceased/non-payment of the annual fee