DE3779010D1 - Wiedergewinnungsverfahren von loetmittelextraktionsloesungen. - Google Patents
Wiedergewinnungsverfahren von loetmittelextraktionsloesungen.Info
- Publication number
- DE3779010D1 DE3779010D1 DE8787901171T DE3779010T DE3779010D1 DE 3779010 D1 DE3779010 D1 DE 3779010D1 DE 8787901171 T DE8787901171 T DE 8787901171T DE 3779010 T DE3779010 T DE 3779010T DE 3779010 D1 DE3779010 D1 DE 3779010D1
- Authority
- DE
- Germany
- Prior art keywords
- recovery process
- solvent extraction
- extraction solutions
- tin
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000011084 recovery Methods 0.000 title 1
- 238000000638 solvent extraction Methods 0.000 title 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- LSDAFBBAZCPULC-UHFFFAOYSA-N [K].[Sn] Chemical compound [K].[Sn] LSDAFBBAZCPULC-UHFFFAOYSA-N 0.000 abstract 1
- 239000000356 contaminant Substances 0.000 abstract 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Substances OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910001414 potassium ion Inorganic materials 0.000 abstract 1
- 230000008929 regeneration Effects 0.000 abstract 1
- 238000011069 regeneration method Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 229910001432 tin ion Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
- C01G19/006—Compounds containing tin, with or without oxygen or hydrogen, and containing two or more other elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Removal Of Specific Substances (AREA)
- Manufacture And Refinement Of Metals (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
- Secondary Cells (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Extraction Or Liquid Replacement (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/820,038 US4673521A (en) | 1986-01-21 | 1986-01-21 | Process for regenerating solder stripping solutions |
PCT/US1987/000026 WO1987004451A1 (en) | 1986-01-21 | 1987-01-07 | Process for regenerating solder stripping solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3779010D1 true DE3779010D1 (de) | 1992-06-17 |
Family
ID=25229719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787901171T Expired - Lifetime DE3779010D1 (de) | 1986-01-21 | 1987-01-07 | Wiedergewinnungsverfahren von loetmittelextraktionsloesungen. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4673521A (de) |
EP (1) | EP0257058B1 (de) |
JP (1) | JPS63502600A (de) |
AT (1) | ATE76092T1 (de) |
AU (1) | AU591761B2 (de) |
BR (1) | BR8705382A (de) |
DE (1) | DE3779010D1 (de) |
WO (1) | WO1987004451A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011569A (en) * | 1987-02-04 | 1991-04-30 | Andus Corporation | Thin film artwork compounds |
US4911785A (en) * | 1987-02-04 | 1990-03-27 | Andus Corporation | The method of forming a thin film artwork compounds |
DE3728693A1 (de) * | 1987-08-27 | 1989-03-09 | Wacker Chemitronic | Verfahren und vorrichtung zum aetzen von halbleiteroberflaechen |
US4957653A (en) * | 1989-04-07 | 1990-09-18 | Macdermid, Incorporated | Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
US5017267A (en) * | 1990-07-17 | 1991-05-21 | Macdermid, Incorporated | Composition and method for stripping tin or tin-lead alloy from copper surfaces |
US5505872A (en) * | 1995-05-23 | 1996-04-09 | Applied Electroless Concepts, Inc. | Solder stripper recycle and reuse |
US6960370B2 (en) * | 2003-03-27 | 2005-11-01 | Scimed Life Systems, Inc. | Methods of forming medical devices |
CN102234513A (zh) * | 2010-04-20 | 2011-11-09 | 深圳富泰宏精密工业有限公司 | 含钛膜层的退镀液及其使用方法 |
JP2012238849A (ja) * | 2011-04-21 | 2012-12-06 | Rohm & Haas Electronic Materials Llc | 改良された多結晶テクスチャ化組成物および方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE489716A (de) * | 1948-07-12 | 1900-01-01 | ||
US2614913A (en) * | 1950-10-20 | 1952-10-21 | Gen Motors Corp | Brightening bath |
US2828193A (en) * | 1954-08-09 | 1958-03-25 | Turco Products Inc | Method for rejuvenation of aluminum treating solutions |
US2827367A (en) * | 1955-08-30 | 1958-03-18 | Texas Instruments Inc | Etching of semiconductor materials |
US3926699A (en) * | 1974-06-17 | 1975-12-16 | Rbp Chemical Corp | Method of preparing printed circuit boards with terminal tabs |
-
1986
- 1986-01-21 US US06/820,038 patent/US4673521A/en not_active Expired - Lifetime
-
1987
- 1987-01-07 DE DE8787901171T patent/DE3779010D1/de not_active Expired - Lifetime
- 1987-01-07 EP EP87901171A patent/EP0257058B1/de not_active Expired
- 1987-01-07 BR BR8705382A patent/BR8705382A/pt unknown
- 1987-01-07 WO PCT/US1987/000026 patent/WO1987004451A1/en active IP Right Grant
- 1987-01-07 AU AU70226/87A patent/AU591761B2/en not_active Ceased
- 1987-01-07 AT AT87901171T patent/ATE76092T1/de active
- 1987-01-07 JP JP62501227A patent/JPS63502600A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
AU591761B2 (en) | 1989-12-14 |
ATE76092T1 (de) | 1992-05-15 |
JPH0442475B2 (de) | 1992-07-13 |
WO1987004451A1 (en) | 1987-07-30 |
US4673521A (en) | 1987-06-16 |
AU7022687A (en) | 1987-08-14 |
EP0257058B1 (de) | 1992-05-13 |
EP0257058A4 (de) | 1988-07-14 |
EP0257058A1 (de) | 1988-03-02 |
BR8705382A (pt) | 1988-02-23 |
JPS63502600A (ja) | 1988-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |