DE3773732D1 - Mikroschweissgeraet mit verbessertem entwurf der elektrodenspitze. - Google Patents

Mikroschweissgeraet mit verbessertem entwurf der elektrodenspitze.

Info

Publication number
DE3773732D1
DE3773732D1 DE8787103632T DE3773732T DE3773732D1 DE 3773732 D1 DE3773732 D1 DE 3773732D1 DE 8787103632 T DE8787103632 T DE 8787103632T DE 3773732 T DE3773732 T DE 3773732T DE 3773732 D1 DE3773732 D1 DE 3773732D1
Authority
DE
Germany
Prior art keywords
welding machine
electrode tip
improved electrode
tip design
micro welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787103632T
Other languages
English (en)
Inventor
Wolfgang Friedrich Mueeller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3773732D1 publication Critical patent/DE3773732D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/3009—Pressure electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/30—Features relating to electrodes
    • B23K11/31—Electrode holders and actuating devices therefor
    • B23K11/318—Supporting devices for electrode holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Resistance Welding (AREA)
DE8787103632T 1986-04-28 1987-03-13 Mikroschweissgeraet mit verbessertem entwurf der elektrodenspitze. Expired - Fee Related DE3773732D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/856,514 US4697058A (en) 1986-04-28 1986-04-28 Microweld apparatus with an improved electrode tip design and tip support

Publications (1)

Publication Number Publication Date
DE3773732D1 true DE3773732D1 (de) 1991-11-21

Family

ID=25323820

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787103632T Expired - Fee Related DE3773732D1 (de) 1986-04-28 1987-03-13 Mikroschweissgeraet mit verbessertem entwurf der elektrodenspitze.

Country Status (4)

Country Link
US (1) US4697058A (de)
EP (1) EP0243638B1 (de)
JP (1) JPS62257738A (de)
DE (1) DE3773732D1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138127A (en) * 1991-07-31 1992-08-11 Hughes Aircraft Company Pressure welding with closed loop force control
US5525774A (en) * 1994-08-16 1996-06-11 Globe Products Inc. Method and apparatus for fusing lead wires of coils to terminals
CN1132714C (zh) * 2001-06-07 2003-12-31 杨仕桐 可直接焊漆包线的点电焊机
TWI316097B (en) * 2002-06-21 2009-10-21 Ebara Corp Substrate holder and plating apparatus
US9624596B2 (en) 2002-07-22 2017-04-18 Ebara Corporation Electrochemical deposition method
EP2627264B1 (de) 2010-10-11 2015-06-17 Cook Medical Technologies LLC Medizinische vorrichtungen mit lösbaren schwenkbaren backen
US9211608B2 (en) 2011-03-15 2015-12-15 Medical Instrument Development Laboratories, Inc. Laser welding of disc to close needle end
US9999546B2 (en) 2014-06-16 2018-06-19 Illinois Tool Works Inc. Protective headwear with airflow
CN104384675A (zh) * 2014-10-17 2015-03-04 无锡英普林纳米科技有限公司 细线线圈的微电弧焊接工艺
US11812816B2 (en) 2017-05-11 2023-11-14 Illinois Tool Works Inc. Protective headwear with airflow
RU2759103C1 (ru) * 2021-05-13 2021-11-09 Александр Владимирович Подувальцев Установка для микросварки проволочных проводников

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3263057A (en) * 1963-05-09 1966-07-26 North American Aviation Inc Thermocompression bonder
US3263059A (en) * 1963-11-19 1966-07-26 Ibm Fine insulated wire welder
US3238351A (en) * 1964-12-04 1966-03-01 Hughes Aireraft Company Electrode assembly having cantilever suspended electrodes
US3775579A (en) * 1972-05-30 1973-11-27 Ibm Method and apparatus for repairing printed circuits
US4171477A (en) * 1976-03-16 1979-10-16 International Business Machines Corporation Micro-surface welding
JPS55150247A (en) * 1979-05-11 1980-11-22 Hitachi Ltd Parallel gap electrode and process for welding using the same
JPS5770785U (de) * 1980-10-14 1982-04-28

Also Published As

Publication number Publication date
JPH0451054B2 (de) 1992-08-18
JPS62257738A (ja) 1987-11-10
EP0243638B1 (de) 1991-10-16
EP0243638A2 (de) 1987-11-04
US4697058A (en) 1987-09-29
EP0243638A3 (en) 1989-01-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee