DE3729789A1 - Method for mounting electronic microcomponents on a printed circuit board - Google Patents

Method for mounting electronic microcomponents on a printed circuit board

Info

Publication number
DE3729789A1
DE3729789A1 DE19873729789 DE3729789A DE3729789A1 DE 3729789 A1 DE3729789 A1 DE 3729789A1 DE 19873729789 DE19873729789 DE 19873729789 DE 3729789 A DE3729789 A DE 3729789A DE 3729789 A1 DE3729789 A1 DE 3729789A1
Authority
DE
Germany
Prior art keywords
printed circuit
components
electronic components
circuit board
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873729789
Other languages
German (de)
Inventor
Arne Dipl Ing Pfannenschmidt
Gerd Fischbeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEG Olympia Office GmbH
Original Assignee
AEG Olympia AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEG Olympia AG filed Critical AEG Olympia AG
Priority to DE19873729789 priority Critical patent/DE3729789A1/en
Publication of DE3729789A1 publication Critical patent/DE3729789A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

For simultaneously populating printed circuit boards with electronic components by means of suitable automatic machines, temporary adhesive mounting of these components is necessary, before the soldering process ensures connection and mounting. Methods for fitting or transferring very small adhesive droplets are already known, for which purpose complicated and expensive devices are required. The invention is based on the object of simplifying and reducing the price of temporarily fitting electronic components on the printed circuit boards before the soldering process. This is achieved in that the electronic components and/or the printed circuit boards are provided after completion of their manufacture with a layer of inactive adhesive material, which is activated in order to bond the electronic components to the printed circuit boards, and is cured after the components have been fitted, for example by the influence of heat. The inactive adhesive material can be applied onto the printed circuit boards using, for example, the mask-printing method. Expensive and complicated machines for transferring metered adhesive droplets are thus no longer necessary.

Description

Die Erfindung betrifft ein Verfahren zur Befestigung von elek­ tronischen Mikro-Bauelementen zylindrischer oder quaderförmiger Form, sogenannte Chip-Bauelemente auf der kupferkaschierten Seite einer gedruckten Leiterplatte, Schaltkarte oder sonstige Sub­ strate mittels einer Klebeverbindung vor einem nachfolgenden Lötvorgang der im Oberbegriff des Patentanspruchs 1 angegebenen Art.The invention relates to a method for fastening elek tronic micro-components cylindrical or cuboid Shape, so-called chip components on the copper-clad side a printed circuit board, circuit board or other sub strate by means of an adhesive connection before a subsequent one Soldering process specified in the preamble of claim 1 Art.

Die elektronischen Bauteile wurden in letzter Zeit weiter ver­ kleinert. Es kommen nunmehr Mikro-Bauelemente, sogenannte Chip- Bauelemente, zum Einsatz. Wegen ihrer geringen Größe sind sie für manuelle Bestückung sehr schwer zu handhaben und daher weniger geeignet. Daher werden sie nach modernen Verfahren mittels auto­ matischer Maschinen höchst präzise plaziert. Dazu war es not­ wendig, Verfahren für das Aufbringen oder Übertragen sehr kleiner Klebermengen zu entwickeln, die die plazierten Flach- oder Rund- Chips bis zum Anschließen und Befestigen z. B. durch Löten in ihrer exakten Position festhalten. Bei der sogenannten Simultan- Bestückung, für die es entsprechende Maschinen gibt, entstand das Problem ebenfalls zuvor eine entsprechende große Anzahl von Klebepunkten mit größter Genauigkeit gleichzeitig aufzubringen. Es wurden Verfahren bekannt, die nach dem Siebdruck oder aber mittels Stift-Eintauch-Technik arbeiten. Beim Siebdruck ist zwar eine gute Dosierbarkeit gegeben. Es ist aber nicht möglich, solche Leiterplatten zu bedrucken, die vorher automatisch mit axialen oder radialen Bauteilen vorbestückt sind.The electronic components have recently been further ver diminishes. Now there are micro components, so-called chip Components, for use. Because of their small size, they are for manual assembly very difficult to handle and therefore less suitable. Therefore, they are made using modern auto matic machines placed very precisely. For that it was necessary manoeuvrable, process for applying or transferring very small To develop quantities of glue that match the flat or round Chips to connect and attach z. B. by soldering in hold on to their exact position. With the so-called simultaneous Equipped with machines for which this is the result Problem also previously a corresponding large number of Apply glue dots at the same time with the greatest accuracy. Processes have been known which are based on screen printing or work using the pen-immersion technique. With screen printing is true given good meterability. But it is not possible to print such circuit boards that previously automatically with axial or radial components are pre-equipped.

Durch die EP-OS 00 49 451 ist ein Stift-Eintauch-Verfahren be­ kannt. Hierbei werden die Klebepunkte von einer entsprechenden Anzahl von Stiften übertragen, die in einem entsprechenden Muster senkrecht hängend in einer horizontalen Halteplatte befestigt sind. Diese Halteplatte mit den gleich langen Stiften wird über eine Wanne mit Kleber bis zum Eintauchen der Stiftenden geführt. Die beim Hochheben mitgenommenen Klebermengen werden anschließend gleichzeitig auf die Leiterplatte getupft. Auch hierbei ist eine gleichmäßige Übertragung von Klebertröpfchen auf die Leiterplatte nicht immer gewährleistet.EP-OS 00 49 451 is a pen-immersion method knows. Here the glue dots are of a corresponding Number of pins transferred in a corresponding pattern Hanging vertically in a horizontal mounting plate are. This holding plate with the pins of the same length is about  a tub of glue until the ends of the pins are immersed. The quantities of glue taken with you when you lift them are then dabbed onto the circuit board at the same time. Here too is one Even transfer of droplets of adhesive onto the circuit board not always guaranteed.

Auch bei einem manuellen Bestücken von Leiterplatten ist das dazu erforderliche Aufbringen von Klebertröpfchen sehr schwierig und zeitraubend.This also applies to manual assembly of printed circuit boards required application of adhesive droplets very difficult and time consuming.

Der Erfindung liegt die Aufgabe zugrunde, sowohl das manuelle als auch das automatische Bestücken von Leiterplatten mit Mikro-Bau­ elementen einfacher und sicherer zu gestalten, wobei gleichmäßige Klebermengen zum Befestigen der Bauelemente zur Verfügung stehen. Diese Aufgabe wird durch das im Patentanspruch 1 gekennzeichnete Verfahren gelöst.The invention is based, both manual and also the automatic assembly of printed circuit boards with micro-construction to make elements easier and safer, being even Amounts of adhesive for attaching the components are available. This object is characterized by that in claim 1 Procedure solved.

Zum Befestigen von elektronischen Mikro-Bauelementen zylindri­ scher oder quaderförmiger Form, sogenannte Chip-Bauelemente, auf der kupferkaschierten Seite einer bedruckten Leiterplatte oder Schaltkarte gibt es verschiedene Kleber, die hinsichtlich ihrer Viskosität, Haftfähigkeit, Fließfähigkeit und Aushärtbarkeit voneinander abweichen. Als vorteilhaft ist hierfür ein durch kurzzeitige UV- und/oder IR-Bestrahlung aushärtbarer Kleber geeignet, der die Bauelemente genügend sicher festhält. Die Leiterplatten müssen nämlich anschließend für den Lötvorgang umgekehrt werden, wobei keine Bauelemente von der Leiterplatte abfallen dürfen.For attaching electronic micro components cylindri shear or cuboid shape, so-called chip components the copper-clad side of a printed circuit board or There are different types of glue in their circuit board Viscosity, adhesiveness, flowability and curability differ from each other. A through is advantageous for this temporary UV and / or IR radiation curable adhesive suitable that holds the components securely. The Printed circuit boards have to be used for the soldering process be reversed with no components from the circuit board may fall off.

Die elektronischen Bauelemente und/oder die Leiterplatten werden nach ihren Fertigstellungen mit einer Schicht von unaktiven klebendem Material versehen, das zum Verkleben der elektronischen Bauelemente mit den Leiterplatten aktiviert und nach dem Be­ stücken durch Wärmeeinwirkung, UV-Bestrahlung oder durch che­ mische Einwirkung ausgehärtet wird. Das Aktivieren des Klebma­ terials kann z. B. durch Wärmeeinwirkung, chemische Wirkung oder auch durch Abziehen einer Schutzfolie erfolgen. The electronic components and / or the printed circuit boards are after their completions with a layer of inactive provided adhesive material for gluing the electronic Components activated with the circuit boards and after loading pieces by exposure to heat, UV radiation or by che mixing action is cured. Activating the adhesive terials can e.g. B. by heat, chemical action or also done by peeling off a protective film.  

Das Klebematerial wird z. B. im Massendruckverfahren auf die Leiterplatten an den Stellen aufgebracht, wo elektronische Bau­ elemente mit der Leiterplatte verbunden werden sollen. Zum Be­ stücken wird das Klebematerial örtlich kurzzeitig z. B. durch Wärmeeinwirkung aktiviert, wonach dann das Klebematerial nach dem Bestücken der Leiterplatte mit den elektronischen Bauelementen noch einem Aushärtevorgang unterzogen wird. Hierdurch wird ge­ währleistet, daß die elektronischen Bauelemente vor dem Lötvor­ gang sicher an der Leiterplatte befestigt werden. Danach kann das Verlöten der elektronischen Bauelemente mit der Leiterplatte in bekannter Weise z. B. mittels einer Wellenlötung durchgeführt werden.The adhesive material is e.g. B. in the mass printing process on the Printed circuit boards applied in places where electronic construction elements to be connected to the circuit board. For example pieces is the adhesive material locally briefly z. B. by Heat activated, after which the adhesive material after the Equipping the circuit board with the electronic components still undergoes a curing process. This will ge ensures that the electronic components before soldering gang be securely attached to the circuit board. After that it can Solder the electronic components to the circuit board in known manner z. B. performed by wave soldering will.

Es ist auch möglich, daß auf die Leiterplatte ein doppelseitig klebendes Klebeband aufgebracht wird, dessen mit den Bauelementen zusammenwirkende Klebeschicht vor dem Bestücken durch eine Schutzfolie abdeckbar ist. Diese Schutzfolie kann bei einer auto­ matischen Bestückung auch durch eine Vorrichtung automatisch abgezogen werden. Da die elektronischen Bauelemente durch die Klebeschicht sicher gehalten werden, erübrigt sich hierbei ein Aushärten der Klebeschicht nach dem Bestückungsvorgang.It is also possible that a double-sided on the circuit board adhesive tape is applied, with the components interacting adhesive layer before loading by a Protective film can be covered. This protective film can be used with an auto matically equipped by a device automatically subtracted from. Since the electronic components through the Adhesive layer to be held securely, is unnecessary here Hardening of the adhesive layer after the assembly process.

Das Klebematerial zum Befestigen der elektronischen Bauteile auf den Leiterplatten kann selbstverständlich auch an den elektroni­ schen Bauelementen selbst angeordnet werden. Das Aufbringen des Klebematerials auf die elektronischen Bauelemente kann z. B. durch Eintauchen dieser Bauelemente in eine Wanne mit Kleber erfolgen. Vor dem Befestigen der elektronischen Bauelemente auf der Leiterplatte muß das sonst unaktive Klebematerial ebenfalls z. B. durch Wärmeeinwirkung noch aktiviert werden. Auch hierdurch erübrigt sich das Übertragen von dosierten Klebetröpfchen un­ mittelbar vor dem Bestückungsvorgang.The adhesive material for attaching the electronic components the circuit boards can of course also be connected to the electronics The components themselves are arranged. The application of the Adhesive material on the electronic components can, for. B. by immersing these components in a tub with glue respectively. Before attaching the electronic components the otherwise inactive adhesive material must also be on the circuit board e.g. B. still be activated by exposure to heat. This too there is no need to transfer metered droplets of adhesive indirectly before the assembly process.

Das erfindungsgemäße Befestigungsverfahren ist einfach und kostengünstig und sowohl für eine manuelle als auch für eine automatische Bestückung vorteilhaft einsetzbar.The fastening method according to the invention is simple and inexpensive and for both a manual and a automatic assembly can be used advantageously.

Auch kann der Kleber aus einem leitenden Material bestehen, wo­ durch der Lötvorgang dann entfallen kann.The adhesive can also consist of a conductive material where can then be omitted by the soldering process.

Claims (5)

1. Verfahren zur Befestigung von elektronischen Mikro-Bauele­ menten zylindrischer oder quaderförmiger Form, sogenannte Chip-Bauelemente, auf der kupferkaschierten Seite einer bedruckten Leiterplatte oder Schaltkarte mittels einer Klebeverbindung vor einem nachfolgendem Lötvorgang, da­ durch gekennzeichnet, daß die elektronischen Bauelemente und/oder die Leiterplatten nach ihren Fertig­ stellungen mit einer Schicht von unaktivem klebendem Mat­ erial versehen werden, das zum Verkleben der elektronischen Bauelemente mit der Leiterplatte aktiviert und nach dem Bestücken, z. B. durch Wärmeeinwirkung ausgehärtet wird.1. A method for fastening electronic micro-components cylindrical or cuboid shape, so-called chip components, on the copper-clad side of a printed circuit board or circuit board by means of an adhesive connection before a subsequent soldering process, characterized in that the electronic components and / or the Printed circuit boards are provided with a layer of inactive adhesive material after their completions, which is activated for gluing the electronic components to the printed circuit board and after assembly, for. B. is cured by exposure to heat. 2. Verfahren nach Anspruch 1, dadurch gekennzeich­ net, daß das Klebematerial im Maskendruckverfahren auf die Leiterplatten aufgebracht wird.2. The method according to claim 1, characterized in net that the adhesive material in the mask printing process the circuit boards is applied. 3. Verfahren nach Anspruch 1, dadurch gekennzeich­ net, daß das Klebematerial die freie Oberfläche eines mit den Leiterplatten bereits verbundenes, doppelseitig kleben­ des Klebeband ist, dessen Klebeschicht durch eine abziehbare Schutzfolie abdeckbar ist.3. The method according to claim 1, characterized in net that the adhesive material with the free surface of a glue double-sided to the printed circuit board of the adhesive tape, the adhesive layer of which is removable Protective film can be covered. 4. Verfahren nach Anspruch 1, dadurch gekennzeich­ net, daß die elektronischen Bauelemente nach ihren Fertigstellungen mit dem unaktiven Klebematerial versehen werden, das vor dem Bestücken der Bauelemente kurzzeitig aktiviert und anschließend dann wieder ausgehärtet wird.4. The method according to claim 1, characterized in net that the electronic components according to their Provide completions with the inactive adhesive material be that briefly before assembling the components activated and then cured again. 5. Verfahren zur Befestigung von elektronischen Mikro-Bauele­ menten auf der kupferkaschierten Seite einer bedruckten Leiterplatte, Schaltkarte oder eines sonstigen Substrates mittels einer Klebeverbindung, dadurch gekennzeich­ net, daß die elektronischen Bauelemente und/oder die Leiterplatten nach ihren Fertigstellungen mit einer Schicht von unaktivem Leitklebematerial versehen werden, das zum Verkleben der elektronischen Bauelemente mit der Leiter­ platte aktiviert und nach dem Bestücken, z. B. durch Wärme­ einwirkung ausgehärtet wird.5. Method of attaching electronic micro components elements on the copper-clad side of a printed PCB, circuit board or other substrate by means of an adhesive connection, characterized  net that the electronic components and / or the Printed circuit boards with one layer after their completion be provided by inactive conductive adhesive material, which for Gluing the electronic components to the ladder plate activated and after loading, z. B. by heat exposure is cured.
DE19873729789 1987-09-05 1987-09-05 Method for mounting electronic microcomponents on a printed circuit board Withdrawn DE3729789A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873729789 DE3729789A1 (en) 1987-09-05 1987-09-05 Method for mounting electronic microcomponents on a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873729789 DE3729789A1 (en) 1987-09-05 1987-09-05 Method for mounting electronic microcomponents on a printed circuit board

Publications (1)

Publication Number Publication Date
DE3729789A1 true DE3729789A1 (en) 1989-03-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873729789 Withdrawn DE3729789A1 (en) 1987-09-05 1987-09-05 Method for mounting electronic microcomponents on a printed circuit board

Country Status (1)

Country Link
DE (1) DE3729789A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859470A (en) * 1992-11-12 1999-01-12 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NL-Z: "Philips tech. Rev." 40 (1982), Nr. 11/12, S. 342, 346 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859470A (en) * 1992-11-12 1999-01-12 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device
US5920125A (en) * 1992-11-12 1999-07-06 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device

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