DE3726357A1 - Epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation of electrical components - Google Patents

Epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation of electrical components

Info

Publication number
DE3726357A1
DE3726357A1 DE19873726357 DE3726357A DE3726357A1 DE 3726357 A1 DE3726357 A1 DE 3726357A1 DE 19873726357 DE19873726357 DE 19873726357 DE 3726357 A DE3726357 A DE 3726357A DE 3726357 A1 DE3726357 A1 DE 3726357A1
Authority
DE
Germany
Prior art keywords
encapsulation
weight
epoxy resin
insulation resistance
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873726357
Other languages
German (de)
Inventor
Josef Dirmeyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE8718069U priority Critical patent/DE8718069U1/de
Priority to DE19873726357 priority patent/DE3726357A1/en
Priority to CH269788A priority patent/CH674986A5/de
Publication of DE3726357A1 publication Critical patent/DE3726357A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation

Abstract

An epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation (embedding) of electrical components, in particular ferrite annular-core inductors, interference suppression filters and the like, having the following composition of its starting components: 100 parts by weight of epoxy resin, 50 parts by weight of curing agent and 235 parts by weight of a Al2O3 as filler, where the filler contains less than 0.02% by weight of water-soluble Na2O.

Description

Die Erfindung betrifft einen wärmehärtenden Epoxidharzverguß mit geringem Schrumpfdruck und hohem Isolationswiderstand für den Verguß von elektrischen Bauteilen, insbesondere Ferrit-Ring­ kerndrosseln, Entstörfiltern und dergleichen.The invention relates to a thermosetting epoxy potting with low shrink pressure and high insulation resistance for the potting of electrical components, especially ferrite ring core chokes, interference filters and the like.

Beim Verguß von druckempfindlichen Bauelementen, die aus kera­ mischen Werkstoffen, insbesondere Ferrit gefertigt sind, treten Probleme auf, die sich diametral gegenüberstehen. Einerseits soll, um eine starke Druckeinwirkung auf den Werkstoff zu ver­ meiden, der Verguß nur einen geringen Schrumpfdruck ausüben, was einen weichen bzw. flexiblen Verguß voraussetzt; anderer­ seits soll die Feuchtedurchlässigkeit des Vergusses, die be­ kanntermaßen mit weicherem Verguß ansteigt, möglichst klein sein, da anderenfalls der Isolationswiderstand stark abfällt.When casting pressure-sensitive components made of kera Mix materials, especially ferrite are made Problems that are diametrically opposed. On the one hand to ver to exert a strong pressure on the material avoid the grouting only exert a slight shrinking pressure, which requires a soft or flexible potting; other on the other hand, the moisture permeability of the casting, which should be known to rise with softer casting, as small as possible be otherwise the insulation resistance drops sharply.

Zur Lösung dieses Problems wurden bislang die elektrischen Bau­ teile quasi zweifach vergossen, wobei der erste Verguß ein flexibler und der abschließende zweite ein Hartverguß war.So far, electrical construction has been used to solve this problem parts almost double shed, with the first shedding one was more flexible and the final second was a hard casting.

Dieses bekannte Verfahren bedingt einen zeitlich langen Ferti­ gungsdurchlauf und damit hohe Kosten, die nicht zuletzt auch durch hohen Ausschuß, hohen Energieverbrauch sowie großen Auf­ wand an Vergußhorden verursacht werden. Zusätzlich erfordert dieses Verfahren zwei Vergußanlagen, und zwar jeweils eine für den flexiblen und eine für den Hartverguß.This known method requires a long period of time throughput and thus high costs, not least also through high rejects, high energy consumption as well as large up wall of potting trays. Additionally required this process two casting machines, one for each the flexible and one for hard casting.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, einen Epoxidharzverguß anzugeben, der sich durch einen geringen Schrumpfdruck und hohen Isolationswiderstand auszeichnet und die vorerwähnten Nachteile des bekannten Verfahrens ausschließt. The present invention is based on the object Specify epoxy resin potting, which is characterized by a low Features shrink pressure and high insulation resistance excludes the aforementioned disadvantages of the known method.  

Zur Lösung dieser Aufgabe sieht die Erfindung einen Epoxidharz­ verguß mit folgender Zusammensetzung seiner Ausgangskomponenten vor:To achieve this object, the invention provides an epoxy resin encapsulate with the following composition of its starting components in front:

100 Gewichtsteile Epoxidharz
 50 Gewichtsteile Härter
235 Gewichtsteile Al₂O₃ als Füllstoff,100 parts by weight of epoxy resin
50 parts by weight of hardener
235 parts by weight of Al₂O₃ as filler,

wobei der Füllstoff weniger als 0,02 Gew.-% wasserlösliches Na₂O enthält.the filler being less than 0.02% by weight contains water-soluble Na₂O.

Dieser Verguß zeichnet sich durch eine hohe Flexibilität und damit geringen Schrumpfdruck und aufgrund des äußerst niedri­ gen Anteils an wasserlöslichem Na2O im Füllstoff durch eine sehr geringe Feuchtedurchlässigkeit aus.This encapsulation is characterized by high flexibility and thus low shrinkage pressure and by the extremely low proportion of water-soluble Na 2 O in the filler by a very low moisture permeability.

Bekanntlich enthalten die Harze Spuren von Chlor, die durch Feuchteeinwirkung mit dem im Füllstoff enthaltenen wasserlös­ lichen Na2O zu NaCl reagieren, wodurch der Verguß elektrisch leitend wird bzw. der Isolationswiderstand auf unerwünschte Werte absinkt. Durch den erfindungsgemäßen Vorschlag, durch den der Anteil an wasserlöslichem Na2O im Füllstoff stark verrin­ gert wird, wird dieses Absinken des Isolationswiderstandes ver­ mieden.As is known, the resins contain traces of chlorine, which react with moisture with the water-soluble Na 2 O contained in the filler to form NaCl, which makes the potting electrically conductive and the insulation resistance drops to undesirable values. By the proposal according to the invention, by which the proportion of water-soluble Na 2 O in the filler is greatly reduced, this decrease in the insulation resistance is avoided.

Claims (1)

Epoxidharzverguß mit geringem Schrumpfdruck und hohem Iso­ lationswiderstand für den Verguß von elektrischen Bauteilen, insbesondere Ferrit-Ringkerndrosseln, Entstörfiltern und der­ gleichen, gekennzeichnet durch folgende Zu­ sammensetzung seiner Ausgangskomponenten: 100 Gewichtsteile Epoxidharz
50 Gewichtsteile Härter
235 Gewichtsteile Al₂O₃ als Füllstoff,wobei der Füllstoff weniger als 0,02 Gew.-% wasserlösliches Na₂O enthält.Epoxy resin casting with low shrinkage pressure and high insulation resistance for the casting of electrical components, in particular ferrite toroidal chokes, interference filters and the like, characterized by the following composition of its starting components: 100 parts by weight of epoxy resin
50 parts by weight of hardener
235 parts by weight of Al₂O₃ as filler, the filler containing less than 0.02% by weight of water-soluble Na₂O.
DE19873726357 1987-08-07 1987-08-07 Epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation of electrical components Withdrawn DE3726357A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE8718069U DE8718069U1 (en) 1987-08-07 1987-08-07
DE19873726357 DE3726357A1 (en) 1987-08-07 1987-08-07 Epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation of electrical components
CH269788A CH674986A5 (en) 1987-08-07 1988-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873726357 DE3726357A1 (en) 1987-08-07 1987-08-07 Epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation of electrical components

Publications (1)

Publication Number Publication Date
DE3726357A1 true DE3726357A1 (en) 1989-02-16

Family

ID=6333323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873726357 Withdrawn DE3726357A1 (en) 1987-08-07 1987-08-07 Epoxy resin encapsulation having low shrinkage pressure and high insulation resistance for the encapsulation of electrical components

Country Status (2)

Country Link
CH (1) CH674986A5 (en)
DE (1) DE3726357A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289956A2 (en) * 1987-05-07 1988-11-09 Omron Tateisi Electronics Co. Sealing structure for an electronic component
WO1995002887A1 (en) * 1993-07-12 1995-01-26 Siemens Matsushita Components Gmbh & Co. Kg USE OF HIGHLY PERMEABLE MnZn FERRITES FOR INSULATOR-COATED FERRITE CORES IN INDUCTIVE COMPONENTS

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803279A (en) * 1968-05-13 1974-04-09 J Bailey Method of making high temperature plastic-ceramic castable
EP0191138A2 (en) * 1985-02-12 1986-08-20 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803279A (en) * 1968-05-13 1974-04-09 J Bailey Method of making high temperature plastic-ceramic castable
EP0191138A2 (en) * 1985-02-12 1986-08-20 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP 51-1 45 600 in Hochmolikularbericht, Nr. 4156/78 *
JP 63-2 64 625 in Hochmolekularbericht, Nr. 13063/89 *
LEE, H., NEVILLE, K.: Handbook of Epoxy Resins, Mc Graw-Hill, Inc. 1967, Kapitel 2, S. 2-1 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289956A2 (en) * 1987-05-07 1988-11-09 Omron Tateisi Electronics Co. Sealing structure for an electronic component
EP0289956A3 (en) * 1987-05-07 1990-03-07 Omron Tateisi Electronics Co. Sealing structure for an electronic component
WO1995002887A1 (en) * 1993-07-12 1995-01-26 Siemens Matsushita Components Gmbh & Co. Kg USE OF HIGHLY PERMEABLE MnZn FERRITES FOR INSULATOR-COATED FERRITE CORES IN INDUCTIVE COMPONENTS

Also Published As

Publication number Publication date
CH674986A5 (en) 1990-08-15

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Legal Events

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8110 Request for examination paragraph 44
8120 Willingness to grant licenses paragraph 23
8130 Withdrawal