DE3715596A1 - Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB - Google Patents

Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB

Info

Publication number
DE3715596A1
DE3715596A1 DE3715596A DE3715596A DE3715596A1 DE 3715596 A1 DE3715596 A1 DE 3715596A1 DE 3715596 A DE3715596 A DE 3715596A DE 3715596 A DE3715596 A DE 3715596A DE 3715596 A1 DE3715596 A1 DE 3715596A1
Authority
DE
Germany
Prior art keywords
base
clips
components
inbuilt
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3715596A
Other languages
German (de)
Inventor
Martin Brueser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE3715596A priority Critical patent/DE3715596A1/en
Publication of DE3715596A1 publication Critical patent/DE3715596A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

The base (I) is of electrically insulating material fitted with spring clips (K). These form contacts points (L) at the bottom of the base and can be soldered onto a p.c.b. The electronic component (B), which is of the surface mounting type, is placed on top of the base and upshed under the free ends of the spring clips. These clips then hold the component (B) in position and also make the connection between it and the printed circuit. USE/ADVANTAGE - Development testing of circuits. Surface mounting devices can easily be changed.

Description

Die Erfindung bezieht sich auf Montagesockel für elektronische Bauteile (SMD-Bauteile).The invention relates to mounting base for electronic components (SMD components).

In der Elektronik werden neuerdings vielfach neue Bauteile (sogenannte SMD-Bauteile) verwendet, und zwar wegen ihrer Kompaktheit, hohen Packungsdichte, automatischen Bestückbarkeit und großen Zuverlässigkeit.In electronics, many new ones are emerging recently Components (so-called SMD components) used, because of their compactness, high packing density, automatic Equippability and great reliability.

Es gibt jedoch nicht die Möglichkeit mit den SMD-Bauteilen zu experimentieren oder diese leicht austauschbar anzulöten, da sie durch mehrmaliges Erwärmen beschädigt werden können.However, there is no possibility with the SMD components to experiment or solder them easily replaceable, as they can be damaged by repeated heating.

Der Erfindung liegt die Aufgabe zugrunde, vorwiegend für experimentelle Zwecke einen Montagesockel für elektronische SMD-Bauteile zu schaffen, der das Auswechseln von Bauteilen ermöglicht oder zumindest erleichtert.The object of the invention is predominantly for experimental purposes a mounting base for electronic SMD components to create, the replacement of components enables or at least facilitates.

Diese Aufgabe wird erfindungsgemäß durch die Kennzeichnungsmerkmale des Patentanspruchs gelöst.This object is achieved by the Characteristics of the claim solved.

Der erfindungsgemäße Montagesockel ist in seinen Maßen dem jeweiligen SMD-Bauteil ähnlich und wird anstelle des Bauteils auf die Platine gelötet, dann wird das entsprechende elektronische Bauteil in die Kontaktfedern eingesetzt und kann jederzeit und beliebig oft ausgetauscht werden.The mounting base according to the invention is in its dimensions similar to the respective SMD component and is used instead of Component soldered onto the board, then the corresponding one electronic component inserted in the contact springs and can be replaced at any time and as often as you like.

Die Zeichnungen zeigen in starker Vergrößerung eine Reihe von Ausführungsbeispielen des Montagesockels für verschiedene elektronische Bauteile, wobei in allen Figuren die im Prinzip gleichen, in natura nur wenige Millimeter messenden Teile wie folgt bezeichnet sind:The drawings show a number in large enlargement of embodiments of the mounting base for various electronic components, in all figures the principle the same parts, which in reality only measure a few millimeters are designated as follows:

I = Isolierblock aus Kunststoff B = SMD-Bauteil K = Kontaktfedern L = Lötflächen. I = insulating block made of plastic B = SMD component K = contact springs L = soldering surfaces.

Die Fig. 1a-c zeigen in drei verschiedenen Ansichten einen Montagesockel für Melf- oder Mini-Melf-Bauteile (Widerstände). Eine der zugehörigen Kontaktfedern K ist in den Fig. 2a und 2b in zwei Seitenansichten dargestellt. Figs. 1a-c show in three different views of a mounting base for MELF or mini-Melf components (resistors). One of the associated contact springs K is shown in FIGS. 2a and 2b in two side views.

Die Fig. 3a-c zeigen einen Montagesockel für Chip- Bauteile, wobei eine der zugehörigen Kontaktfedern K in den Fig. 4a und 4b dargestellt ist. FIGS. 3a-c show a mounting base for chip components, wherein one of the associated contact springs K is shown in Figs. 4a and 4b.

Ein Montagesockel für SOT-89-Bauteile (Transistor- Bauteile) ist in den Fig. 5a-c in drei Ansichten dargestellt, und eine der zugehörigen Kontaktfedern K ist in den Fig. 6a und 6b gezeigt.A mounting base for SOT-89 components (transistor components) is shown in three views in FIGS. 5a-c, and one of the associated contact springs K is shown in FIGS. 6a and 6b.

Die Fig. 7a-c zeigen schließlich einen Montagesockel für SOT-23-Bauteile. Eine der zugehörigen Kontaktfedern K zeigen die Fig. 8a und 8b in zwei Seitenansichten. FIGS. 7a-c finally show a mounting base for SOT-23 components. One of the related contact springs K, Figs. 8a and 8b in two side views.

Claims (1)

Montagesockel für elektronische Bauteile (SMD-Bauteile), gekennzeichnet durch einen Isolierblock (I) aus Kunststoff, der grundflächenmäßig die gleiche Bauform wie das elektronische Bauteil (B) aufweist und in dem zum Halten des Bauteils (B) Kontaktfedern (K) befestigt sind, die zum Anordnen auf einer Platine Lötflächen (L) aufweisen.Mounting base for electronic components (SMD components), characterized by an insulating block ( I ) made of plastic, which has the same design as the electronic component ( B ) and in which contact springs ( K ) are fastened to hold the component ( B ), which have soldering areas ( L ) for arrangement on a circuit board.
DE3715596A 1987-05-09 1987-05-09 Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB Withdrawn DE3715596A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3715596A DE3715596A1 (en) 1987-05-09 1987-05-09 Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3715596A DE3715596A1 (en) 1987-05-09 1987-05-09 Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB

Publications (1)

Publication Number Publication Date
DE3715596A1 true DE3715596A1 (en) 1988-11-24

Family

ID=6327236

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3715596A Withdrawn DE3715596A1 (en) 1987-05-09 1987-05-09 Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB

Country Status (1)

Country Link
DE (1) DE3715596A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688155A1 (en) * 1994-06-14 1995-12-20 Rudolf Schadow GmbH Adapter for electrically connecting opto-electronic components to a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688155A1 (en) * 1994-06-14 1995-12-20 Rudolf Schadow GmbH Adapter for electrically connecting opto-electronic components to a printed circuit board

Similar Documents

Publication Publication Date Title
EP0789427A3 (en) Circuitboard connector
EP0909120A3 (en) Housing for electronic components
DE69108302T2 (en) Electronic circuit with a spring arrangement for the power supply.
DE2547323C3 (en) Carrier plate for at least one integrated semiconductor storage
DE3701310A1 (en) Contact-making device for making contact with surface-mounted integrated circuits
DE1232623B (en) Flat modules for the interconnection of electrical components
DE3631963C2 (en)
DE3715596A1 (en) Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB
DE3641353C2 (en)
DE2753236C2 (en) Installation frame for an integrated semiconductor circuit arrangement without a housing
EP0350609A3 (en) Test appliance for circuit boards
DE4420525A1 (en) Connection system for contacting components with fine pitch patterning on PCB
DE969819C (en) Insulation plate with two-dimensional printed circuits applied to one or both sides and several soldering points made by dip soldering
EP0406764B1 (en) Adapter for testing integrated circuits mounted on a film
AT399422B (en) IC base and an electronic component
DE2815646A1 (en) Support assembly for circuit boards - has boards held by frame to form hollow cube with corner connections and internal heat sink
DE4137709A1 (en) Universal circuit board for bread boarding - has matrix of component connecting elements spaced at different intervals for connecting wide range of components.
EP0400539A3 (en) Plug contact for a circuit card
WO1986002230A1 (en) Hybrid mounting for electronic circuit
DE4420527A1 (en) Connection system to contact pin terminal components on PCB
DE2536596A1 (en) Circuit board for experimental mock-ups - makes circuit clear and allows connection of instrument
DE4218367A1 (en) Electronic device with large number of leads - has ends of leads fixed to strip of electrically insulating material, e.g. epoxy resin or polyamide
DE9316322U1 (en) Carrier with electrical traces and printed circuit
DE1255750B (en) Microminiaturized circuit structure, consisting of several stacked circuit boards
DE2731998A1 (en) Resistor structure with wire or resistive layer on its body - has two metal caps on its ends, with contacting devices forming plane

Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee