DE3680354D1 - Nichtphotoempfindliche uebertragungsschutzschicht. - Google Patents

Nichtphotoempfindliche uebertragungsschutzschicht.

Info

Publication number
DE3680354D1
DE3680354D1 DE8686300769T DE3680354T DE3680354D1 DE 3680354 D1 DE3680354 D1 DE 3680354D1 DE 8686300769 T DE8686300769 T DE 8686300769T DE 3680354 T DE3680354 T DE 3680354T DE 3680354 D1 DE3680354 D1 DE 3680354D1
Authority
DE
Germany
Prior art keywords
photo
transfer layer
sensitive transfer
sensitive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686300769T
Other languages
English (en)
Inventor
John P Minnesota Min Vikesland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE3680354D1 publication Critical patent/DE3680354D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Materials For Photolithography (AREA)
DE8686300769T 1985-02-19 1986-02-05 Nichtphotoempfindliche uebertragungsschutzschicht. Expired - Fee Related DE3680354D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/702,827 US4621019A (en) 1985-02-19 1985-02-19 Non-photosensitive transfer resist

Publications (1)

Publication Number Publication Date
DE3680354D1 true DE3680354D1 (de) 1991-08-29

Family

ID=24822767

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686300769T Expired - Fee Related DE3680354D1 (de) 1985-02-19 1986-02-05 Nichtphotoempfindliche uebertragungsschutzschicht.

Country Status (6)

Country Link
US (1) US4621019A (de)
EP (1) EP0192377B1 (de)
JP (1) JPS61190333A (de)
KR (1) KR860006914A (de)
DE (1) DE3680354D1 (de)
IE (1) IE57243B1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0213488A2 (de) * 1985-08-26 1987-03-11 Itt Industries, Inc. Verfahren zur Herstellung von Mikrowellen-monolithischen integrierten Schaltungen aus Galliumarsenid
GB8913090D0 (en) * 1989-06-07 1989-07-26 Ciba Geigy Ag Method
US5569527A (en) * 1993-11-08 1996-10-29 Bixby International Corporation Adhesive system
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
US6702916B2 (en) * 1997-05-14 2004-03-09 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
DE19752926A1 (de) * 1997-11-28 1999-06-10 Bosch Gmbh Robert Verfahren zum Aufbringen eines Schutzlacks auf einen Wafer
US6120693A (en) * 1998-11-06 2000-09-19 Alliedsignal Inc. Method of manufacturing an interlayer via and a laminate precursor useful for same
US6280555B1 (en) * 1999-03-30 2001-08-28 Robert L. Wilbur Method of forming a printed circuit board
US6379573B1 (en) * 1999-07-13 2002-04-30 University Of Honolulu Self-limiting isotropic wet etching process

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB765466A (en) * 1953-12-10 1957-01-09 Aero Res Ltd Improvements in or relating to methods of bringing about adhesion between surfaces
GB795822A (en) * 1955-05-20 1958-05-28 Masson Seeley And Company Ltd Improvements in or relating to the production of printed electric circuits
US3526504A (en) * 1966-07-07 1970-09-01 Du Pont Photocrosslinkable elements and processes
US3810812A (en) * 1968-08-26 1974-05-14 C Koenig Covering mask
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
US4193797A (en) * 1971-03-22 1980-03-18 E. I. Dupont De Nemours And Company Method for making photoresists
US3782939A (en) * 1972-02-09 1974-01-01 Mining And Mfg Co Dry positive-acting photoresist
US4123581A (en) * 1976-11-18 1978-10-31 A. B. Dick Company Self-adhering stencil
DE2907577A1 (de) * 1979-02-27 1980-08-28 Itc Kepets Kg Mittel fuer die uebertragung von motiven (lay-out) gedruckter schaltungen auf kupferbeschichtete platten
US4247616A (en) * 1979-07-27 1981-01-27 Minnesota Mining And Manufacturing Company Positive-acting photoresist composition
US4414275A (en) * 1981-07-13 1983-11-08 Loctite (Ireland) Limited UV Curable adhesive tape
CA1204349A (en) * 1981-12-12 1986-05-13 Klaus Grah Blanking strip for electrolytic processes
US4515877A (en) * 1982-11-27 1985-05-07 Basf Aktiengesellschaft Image-recording materials and image-recording carried out using these to produce an optical mask
DE3246774A1 (de) * 1982-12-17 1984-06-20 Beiersdorf Ag, 2000 Hamburg Schutzabdeckung fuer die galvanotechnik

Also Published As

Publication number Publication date
IE860115L (en) 1986-08-19
KR860006914A (ko) 1986-09-15
EP0192377A2 (de) 1986-08-27
IE57243B1 (en) 1992-06-17
JPS61190333A (ja) 1986-08-25
US4621019A (en) 1986-11-04
EP0192377B1 (de) 1991-07-24
EP0192377A3 (en) 1988-04-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee