DE3673437D1 - METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH A TRENCH. - Google Patents
METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH A TRENCH.Info
- Publication number
- DE3673437D1 DE3673437D1 DE8686102225T DE3673437T DE3673437D1 DE 3673437 D1 DE3673437 D1 DE 3673437D1 DE 8686102225 T DE8686102225 T DE 8686102225T DE 3673437 T DE3673437 T DE 3673437T DE 3673437 D1 DE3673437 D1 DE 3673437D1
- Authority
- DE
- Germany
- Prior art keywords
- trench
- producing
- semiconductor component
- semiconductor
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
- H01L21/743—Making of internal connections, substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60030576A JPS61191043A (en) | 1985-02-20 | 1985-02-20 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3673437D1 true DE3673437D1 (en) | 1990-09-20 |
Family
ID=12307673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686102225T Expired - Lifetime DE3673437D1 (en) | 1985-02-20 | 1986-02-20 | METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH A TRENCH. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4717682A (en) |
EP (1) | EP0193116B1 (en) |
JP (1) | JPS61191043A (en) |
KR (1) | KR900001245B1 (en) |
DE (1) | DE3673437D1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3320944C2 (en) * | 1982-06-21 | 1997-03-27 | Young Eng | Smoothing device for web edges |
US4929996A (en) * | 1988-06-29 | 1990-05-29 | Texas Instruments Incorporated | Trench bipolar transistor |
US5188971A (en) * | 1988-12-28 | 1993-02-23 | Synergy Semiconductor Corporation | Process for making a self-aligned bipolar sinker structure |
US5213994A (en) * | 1989-05-30 | 1993-05-25 | Motorola, Inc. | Method of making high voltage semiconductor device |
KR940006696B1 (en) * | 1991-01-16 | 1994-07-25 | 금성일렉트론 주식회사 | Manufacturing method of isolation layer of semiconductor device |
US5250837A (en) * | 1991-05-17 | 1993-10-05 | Delco Electronics Corporation | Method for dielectrically isolating integrated circuits using doped oxide sidewalls |
US5358884A (en) * | 1992-09-11 | 1994-10-25 | Micron Technology, Inc. | Dual purpose collector contact and isolation scheme for advanced bicmos processes |
US5275965A (en) * | 1992-11-25 | 1994-01-04 | Micron Semiconductor, Inc. | Trench isolation using gated sidewalls |
JP2914117B2 (en) * | 1993-08-28 | 1999-06-28 | 日本電気株式会社 | Method for manufacturing semiconductor device |
US5387540A (en) * | 1993-09-30 | 1995-02-07 | Motorola Inc. | Method of forming trench isolation structure in an integrated circuit |
US5856700A (en) * | 1996-05-08 | 1999-01-05 | Harris Corporation | Semiconductor device with doped semiconductor and dielectric trench sidewall layers |
US5933717A (en) * | 1997-03-04 | 1999-08-03 | Advanced Micro Devices, Inc. | Vertical transistor interconnect structure and fabrication method thereof |
US6069384A (en) * | 1997-03-04 | 2000-05-30 | Advanced Micro Devices, Inc. | Integrated circuit including vertical transistors with spacer gates having selected gate widths |
US6097076A (en) | 1997-03-25 | 2000-08-01 | Micron Technology, Inc. | Self-aligned isolation trench |
SE513471C2 (en) * | 1997-11-17 | 2000-09-18 | Ericsson Telefon Ab L M | Semiconductor component and semiconductor component manufacturing procedure |
US6153934A (en) * | 1998-07-30 | 2000-11-28 | International Business Machines Corporation | Buried butted contact and method for fabricating |
US20060076629A1 (en) * | 2004-10-07 | 2006-04-13 | Hamza Yilmaz | Semiconductor devices with isolation and sinker regions containing trenches filled with conductive material |
GB0507157D0 (en) * | 2005-04-08 | 2005-05-18 | Ami Semiconductor Belgium Bvba | Double trench for isolation of semiconductor devices |
US7982284B2 (en) * | 2006-06-28 | 2011-07-19 | Infineon Technologies Ag | Semiconductor component including an isolation structure and a contact to the substrate |
US7691734B2 (en) * | 2007-03-01 | 2010-04-06 | International Business Machines Corporation | Deep trench based far subcollector reachthrough |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3947299A (en) * | 1971-05-22 | 1976-03-30 | U.S. Philips Corporation | Method of manufacturing semiconductor devices |
US4140558A (en) * | 1978-03-02 | 1979-02-20 | Bell Telephone Laboratories, Incorporated | Isolation of integrated circuits utilizing selective etching and diffusion |
US4488162A (en) * | 1980-07-08 | 1984-12-11 | International Business Machines Corporation | Self-aligned metal field effect transistor integrated circuits using polycrystalline silicon gate electrodes |
US4322883A (en) * | 1980-07-08 | 1982-04-06 | International Business Machines Corporation | Self-aligned metal process for integrated injection logic integrated circuits |
JPS5734331A (en) * | 1980-08-11 | 1982-02-24 | Toshiba Corp | Manufacture of semiconductor device |
EP0051488B1 (en) * | 1980-11-06 | 1985-01-30 | Kabushiki Kaisha Toshiba | Method for manufacturing a semiconductor device |
FR2498812A1 (en) * | 1981-01-27 | 1982-07-30 | Thomson Csf | STRUCTURE OF TRANSISTORS IN AN INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME |
US4508579A (en) * | 1981-03-30 | 1985-04-02 | International Business Machines Corporation | Lateral device structures using self-aligned fabrication techniques |
JPS59220952A (en) * | 1983-05-31 | 1984-12-12 | Toshiba Corp | Manufacture of semiconductor device |
US4507853A (en) * | 1982-08-23 | 1985-04-02 | Texas Instruments Incorporated | Metallization process for integrated circuits |
JPS5992548A (en) * | 1982-11-18 | 1984-05-28 | Toshiba Corp | Semiconductor device and manufacture thereof |
US4549927A (en) * | 1984-06-29 | 1985-10-29 | International Business Machines Corporation | Method of selectively exposing the sidewalls of a trench and its use to the forming of a metal silicide substrate contact for dielectric filled deep trench isolated devices |
US4589193A (en) * | 1984-06-29 | 1986-05-20 | International Business Machines Corporation | Metal silicide channel stoppers for integrated circuits and method for making the same |
-
1985
- 1985-02-20 JP JP60030576A patent/JPS61191043A/en active Pending
-
1986
- 1986-02-11 KR KR1019860000932A patent/KR900001245B1/en not_active IP Right Cessation
- 1986-02-19 US US06/830,928 patent/US4717682A/en not_active Expired - Lifetime
- 1986-02-20 EP EP86102225A patent/EP0193116B1/en not_active Expired - Lifetime
- 1986-02-20 DE DE8686102225T patent/DE3673437D1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0193116A3 (en) | 1987-08-19 |
EP0193116A2 (en) | 1986-09-03 |
US4717682A (en) | 1988-01-05 |
KR900001245B1 (en) | 1990-03-05 |
KR860006832A (en) | 1986-09-15 |
JPS61191043A (en) | 1986-08-25 |
EP0193116B1 (en) | 1990-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |