DE3572013D1 - An acid copper electroplating solution as well as a method of electroplating - Google Patents

An acid copper electroplating solution as well as a method of electroplating

Info

Publication number
DE3572013D1
DE3572013D1 DE8585105038T DE3572013T DE3572013D1 DE 3572013 D1 DE3572013 D1 DE 3572013D1 DE 8585105038 T DE8585105038 T DE 8585105038T DE 3572013 T DE3572013 T DE 3572013T DE 3572013 D1 DE3572013 D1 DE 3572013D1
Authority
DE
Germany
Prior art keywords
electroplating
acid copper
well
formula
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585105038T
Other languages
English (en)
Inventor
John Houman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Application granted granted Critical
Publication of DE3572013D1 publication Critical patent/DE3572013D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroluminescent Light Sources (AREA)
DE8585105038T 1984-04-27 1985-04-25 An acid copper electroplating solution as well as a method of electroplating Expired DE3572013D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/604,917 US4490220A (en) 1982-09-30 1984-04-27 Electrolytic copper plating solutions

Publications (1)

Publication Number Publication Date
DE3572013D1 true DE3572013D1 (en) 1989-09-07

Family

ID=24421560

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585105038T Expired DE3572013D1 (en) 1984-04-27 1985-04-25 An acid copper electroplating solution as well as a method of electroplating

Country Status (5)

Country Link
US (1) US4490220A (de)
EP (1) EP0163131B1 (de)
JP (1) JPS6119791A (de)
AT (1) ATE45193T1 (de)
DE (1) DE3572013D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721985A1 (de) * 1987-06-30 1989-01-12 Schering Ag Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6544399B1 (en) * 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
EP1069210A1 (de) * 1999-07-12 2001-01-17 Applied Materials, Inc. Verfahren zur elektrochemischen Abscheidung von Strukturen mit hohem Aspektverhältnis
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US20030049858A1 (en) * 2001-07-15 2003-03-13 Golden Josh H. Method and system for analyte determination in metal plating baths
US20040046121A1 (en) * 2001-07-15 2004-03-11 Golden Josh H. Method and system for analyte determination in metal plating baths
US20030030800A1 (en) * 2001-07-15 2003-02-13 Golden Josh H. Method and system for the determination of arsenic in aqueous media
WO2003023395A1 (en) * 2001-09-12 2003-03-20 Microbar Systems, Inc. Enhanced detection of metal plating additives
JP3789107B2 (ja) * 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
EP1422320A1 (de) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Kupfer-Elektroplattierungsbad
CA3119028A1 (en) 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer
CN110284162B (zh) * 2019-07-22 2020-06-30 广州三孚新材料科技股份有限公司 一种光伏汇流焊带无氰碱性镀铜液及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2888390A (en) * 1956-11-08 1959-05-26 Anaconda Co Electrolytic refining of copper
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper
JPS5330279B2 (de) * 1972-07-19 1978-08-25
JPS4931406A (de) * 1972-07-20 1974-03-20
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
WO1984001393A1 (en) * 1982-09-30 1984-04-12 Learonal Inc Electrolytic copper plating solutions

Also Published As

Publication number Publication date
EP0163131A2 (de) 1985-12-04
ATE45193T1 (de) 1989-08-15
JPS6357510B2 (de) 1988-11-11
EP0163131B1 (de) 1989-08-02
JPS6119791A (ja) 1986-01-28
EP0163131A3 (en) 1988-02-03
US4490220A (en) 1984-12-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition