DE3505318C2 - - Google Patents

Info

Publication number
DE3505318C2
DE3505318C2 DE3505318A DE3505318A DE3505318C2 DE 3505318 C2 DE3505318 C2 DE 3505318C2 DE 3505318 A DE3505318 A DE 3505318A DE 3505318 A DE3505318 A DE 3505318A DE 3505318 C2 DE3505318 C2 DE 3505318C2
Authority
DE
Germany
Prior art keywords
workpiece
pulses
electrolyte
voltage
voltage source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3505318A
Other languages
German (de)
English (en)
Other versions
DE3505318A1 (de
Inventor
Minoru Amagasaki Hyogo Jp Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59028199A external-priority patent/JPS60174896A/ja
Priority claimed from JP26893484A external-priority patent/JPS61147897A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE3505318A1 publication Critical patent/DE3505318A1/de
Application granted granted Critical
Publication of DE3505318C2 publication Critical patent/DE3505318C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/09—Wave forms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Electroplating Methods And Accessories (AREA)
DE19853505318 1984-02-16 1985-02-15 Elektrolysegeraet Granted DE3505318A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59028199A JPS60174896A (ja) 1984-02-16 1984-02-16 電解装置
JP26893484A JPS61147897A (ja) 1984-12-20 1984-12-20 電解めっき方法

Publications (2)

Publication Number Publication Date
DE3505318A1 DE3505318A1 (de) 1985-08-14
DE3505318C2 true DE3505318C2 (fr) 1989-06-08

Family

ID=26366249

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853505318 Granted DE3505318A1 (de) 1984-02-16 1985-02-15 Elektrolysegeraet

Country Status (2)

Country Link
US (1) US4608138A (fr)
DE (1) DE3505318A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706124A1 (de) * 1987-02-25 1988-09-08 Agie Ag Ind Elektronik Verfahren zum elektroerosiven bearbeiten von elektrisch schwach oder nicht leitenden werkstuecken sowie elektroerosionsmaschine zur durchfuehrung des verfahrens
US5202004A (en) * 1989-12-20 1993-04-13 Digital Instruments, Inc. Scanning electrochemical microscopy
US5292418A (en) * 1991-03-08 1994-03-08 Mitsubishi Denki Kabushiki Kaisha Local laser plating apparatus
KR940005622B1 (ko) * 1991-10-22 1994-06-21 현대전자산업 주식회사 화합물 반도체의 광전기 화학적 식각장치
US5595637A (en) * 1995-11-17 1997-01-21 Rockwell International Corporation Photoelectrochemical fabrication of electronic circuits
US6146515A (en) * 1998-12-16 2000-11-14 Tecnu, Inc. Power supply and method for producing non-periodic complex waveforms
GB2372041B (en) * 2000-09-23 2004-12-01 Univ Cambridge Tech Electrochemical surface treatment of metals and metallic alloys
US20030075455A1 (en) * 2001-10-19 2003-04-24 Cambridge University Technical Services Ltd. Electrochemical treatment of metals
US20060141157A1 (en) * 2003-05-27 2006-06-29 Masahiko Sekimoto Plating apparatus and plating method
SE0403047D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
CN100388997C (zh) * 2006-09-18 2008-05-21 南京航空航天大学 喷射液束电解-激光复合加工方法及其装置
DE102009029551B4 (de) * 2009-09-17 2013-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten
DE102009051688A1 (de) * 2009-10-23 2011-04-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur lichtinduzierten galvanischen Pulsabscheidung zur Ausbildung einer Saatschicht für einen Metallkontakt einer Solarzelle und zur nachfolgenden Verstärkung dieser Saatschicht bzw. dieses Metallkontakts sowie Anordnung zur Durchführung des Verfahrens
CN101856753B (zh) * 2010-04-27 2012-08-15 江苏大学 激光空泡空化的光电化学三维加工方法及装置
US9039887B2 (en) * 2012-05-14 2015-05-26 United Technologies Corporation Component finishing method and assembly
US10115599B2 (en) 2012-09-28 2018-10-30 The Board Of Trustees Of The University Of Illinois Spectrally and temporally engineered processing using photoelectrochemistry
EP3485068A4 (fr) 2016-07-13 2020-04-22 Iontra LLC Procédés, dispositifs et compositions électrochimiques
WO2018044930A1 (fr) * 2016-08-29 2018-03-08 Board Of Trustees Of The University Of Arkansas Structuration électrochimique dirigée par la lumière de structures en cuivre

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE953758C (de) * 1954-05-22 1956-12-06 Reich Robert W Verfahren zum galvanischen Abscheiden metallischer UEberzugsschichten unter Einwirkung von Ultraschall
US3622804A (en) * 1970-08-19 1971-11-23 Udylite Corp System for periodically reversing electrical energy through a load
US3886053A (en) * 1973-11-01 1975-05-27 James M Leland Programmable pulse electroplating process
SU633938A1 (ru) * 1974-04-08 1978-11-25 Минский радиотехнический институт Способ электролитического серебрени изделий
US3975254A (en) * 1974-08-13 1976-08-17 Westinghouse Electric Corporation Forward-reverse pulse cycling anodizing and electroplating process power supply
JPS5243769A (en) * 1975-10-02 1977-04-06 Katsuharu Hayata Method of removing offensive odor with s.i.t. agent
JPS5817274B2 (ja) * 1977-09-01 1983-04-06 株式会社井上ジャパックス研究所 電着加工方法
US4127183A (en) * 1978-02-17 1978-11-28 American Air Filter Company, Inc. Silencer device
US4283259A (en) * 1979-05-08 1981-08-11 International Business Machines Corporation Method for maskless chemical and electrochemical machining
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
US4369099A (en) * 1981-01-08 1983-01-18 Bell Telephone Laboratories, Incorporated Photoelectrochemical etching of semiconductors
US4415414A (en) * 1982-09-10 1983-11-15 Bell Telephone Laboratories, Incorporated Etching of optical surfaces
US4414066A (en) * 1982-09-10 1983-11-08 Bell Telephone Laboratories, Incorporated Electrochemical photoetching of compound semiconductors

Also Published As

Publication number Publication date
US4608138A (en) 1986-08-26
DE3505318A1 (de) 1985-08-14

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Legal Events

Date Code Title Description
OR8 Request for search as to paragraph 43 lit. 1 sentence 1 patent law
8105 Search report available
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee