DE3477446D1 - Device for the electrolytic deposition of a conductive material on integrated-circuit wafers - Google Patents
Device for the electrolytic deposition of a conductive material on integrated-circuit wafersInfo
- Publication number
- DE3477446D1 DE3477446D1 DE8484113282T DE3477446T DE3477446D1 DE 3477446 D1 DE3477446 D1 DE 3477446D1 DE 8484113282 T DE8484113282 T DE 8484113282T DE 3477446 T DE3477446 T DE 3477446T DE 3477446 D1 DE3477446 D1 DE 3477446D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated
- conductive material
- electrolytic deposition
- circuit wafers
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Combinations Of Printed Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH6430/83A CH659259A5 (fr) | 1983-12-01 | 1983-12-01 | Dispositif pour le depot electrolytique d'un materiau conducteur sur des plaques de circuits integres. |
FR8320813A FR2557365B1 (fr) | 1983-12-23 | 1983-12-23 | Dispositif pour le depot electrolytique d'un materiau conducteur sur des plaques de circuits integres |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3477446D1 true DE3477446D1 (en) | 1989-04-27 |
Family
ID=25699564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484113282T Expired DE3477446D1 (en) | 1983-12-01 | 1984-11-05 | Device for the electrolytic deposition of a conductive material on integrated-circuit wafers |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0144752B1 (de) |
DE (1) | DE3477446D1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0283681B1 (de) * | 1987-02-23 | 1992-05-06 | Siemens Aktiengesellschaft | Galvanisiereinrichtung zur Erzeugung von Höckern auf Chip-Bauelementen |
FR2773262B1 (fr) * | 1997-12-30 | 2000-03-10 | Sgs Thomson Microelectronics | Procede de formation d'elements conducteurs dans un circuit integre |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3306602A (en) * | 1964-08-11 | 1967-02-28 | Bendix Corp | Work holder fixture |
US3347771A (en) * | 1965-01-25 | 1967-10-17 | Bendix Corp | Lead-tin alloy plating fixture for silicon |
DE1255433B (de) * | 1965-09-25 | 1967-11-30 | Siemens Ag | Verfahren zum elektrolytischen Abscheiden wenigstens einer loetfaehigen Schicht auf einen nicht loetbaren, poroesen Halbleiterkoerper |
DE2340423A1 (de) * | 1973-08-09 | 1975-02-20 | Siemens Ag | Weichgeloetete kontaktanordnung |
-
1984
- 1984-11-05 DE DE8484113282T patent/DE3477446D1/de not_active Expired
- 1984-11-05 EP EP19840113282 patent/EP0144752B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0144752A1 (de) | 1985-06-19 |
EP0144752B1 (de) | 1989-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |