DE3473198D1 - Multilevel metal structure and process for making same - Google Patents

Multilevel metal structure and process for making same

Info

Publication number
DE3473198D1
DE3473198D1 DE8484115496T DE3473198T DE3473198D1 DE 3473198 D1 DE3473198 D1 DE 3473198D1 DE 8484115496 T DE8484115496 T DE 8484115496T DE 3473198 T DE3473198 T DE 3473198T DE 3473198 D1 DE3473198 D1 DE 3473198D1
Authority
DE
Germany
Prior art keywords
metal structure
making same
multilevel metal
multilevel
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484115496T
Other languages
German (de)
English (en)
Inventor
Harbans Singh Sachdev
Krishna Sachdev
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3473198D1 publication Critical patent/DE3473198D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10P14/662
    • H10P14/6336
    • H10P14/683
    • H10P14/6922
    • H10W20/058
    • H10W20/4473
    • H10W70/69
DE8484115496T 1983-12-27 1984-12-14 Multilevel metal structure and process for making same Expired DE3473198D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56556283A 1983-12-27 1983-12-27

Publications (1)

Publication Number Publication Date
DE3473198D1 true DE3473198D1 (en) 1988-09-08

Family

ID=24259173

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484115496T Expired DE3473198D1 (en) 1983-12-27 1984-12-14 Multilevel metal structure and process for making same

Country Status (3)

Country Link
EP (1) EP0150403B1 (cg-RX-API-DMAC10.html)
JP (1) JPS60142545A (cg-RX-API-DMAC10.html)
DE (1) DE3473198D1 (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4519872A (en) * 1984-06-11 1985-05-28 International Business Machines Corporation Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes
DE3604917A1 (de) * 1986-02-17 1987-08-27 Messerschmitt Boelkow Blohm Verfahren zur herstellung eines integrierten verbandes in reihe geschalteter duennschicht-solarzellen
US5141817A (en) * 1989-06-13 1992-08-25 International Business Machines Corporation Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
WO1991010261A1 (en) * 1990-01-04 1991-07-11 International Business Machines Corporation Semiconductor interconnect structure utilizing a polyimide insulator
US5300813A (en) * 1992-02-26 1994-04-05 International Business Machines Corporation Refractory metal capped low resistivity metal conductor lines and vias
US5550405A (en) * 1994-12-21 1996-08-27 Advanced Micro Devices, Incorporated Processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ICS
JPH1013899A (ja) * 1996-06-21 1998-01-16 Nec Shizuoka Ltd 無線選択呼出受信機
JP3505520B2 (ja) 2001-05-11 2004-03-08 松下電器産業株式会社 層間絶縁膜
US7579232B1 (en) * 2008-07-11 2009-08-25 Sandisk 3D Llc Method of making a nonvolatile memory device including forming a pillar shaped semiconductor device and a shadow mask

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface
US4367119A (en) * 1980-08-18 1983-01-04 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
JPS57211239A (en) * 1981-06-22 1982-12-25 Nippon Telegr & Teleph Corp <Ntt> Formation of insulating film

Also Published As

Publication number Publication date
EP0150403B1 (en) 1988-08-03
EP0150403A1 (en) 1985-08-07
JPH0224019B2 (cg-RX-API-DMAC10.html) 1990-05-28
JPS60142545A (ja) 1985-07-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee