DE3427004A1 - Device for applying flux to workpieces - Google Patents

Device for applying flux to workpieces

Info

Publication number
DE3427004A1
DE3427004A1 DE19843427004 DE3427004A DE3427004A1 DE 3427004 A1 DE3427004 A1 DE 3427004A1 DE 19843427004 DE19843427004 DE 19843427004 DE 3427004 A DE3427004 A DE 3427004A DE 3427004 A1 DE3427004 A1 DE 3427004A1
Authority
DE
Germany
Prior art keywords
flux
nozzle
suction device
workpieces
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843427004
Other languages
German (de)
Other versions
DE3427004C2 (en
Inventor
Ernst 6983 Kreuzwertheim Hohnerlein
Heinz 6981 Collenberg Seitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seho Systemtechnik GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19843427004 priority Critical patent/DE3427004A1/en
Publication of DE3427004A1 publication Critical patent/DE3427004A1/en
Application granted granted Critical
Publication of DE3427004C2 publication Critical patent/DE3427004C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

The invention relates to a device for applying flux to the underside of workpieces to be provided with soldered joints. To avoid the formation of residues through too much applied flux, a separate suction device is arranged behind the fluxing nozzle. The suction device draws off excess flux from the underside of the printed circuit board.

Description

~Vorrichtung zum Aufbringen von Flußmittel ~ Device for applying flux

auf Werkstllcke" Die Erfindung bezieht sich auf eine Vorrichtung zum Aufbringen von Flußmittel auf die Unterseite von mit L5tverbindungen zu versehenden Werkstlickön, z.B. elektrische Leiterplatten, mittels Wellen- oder Schaumfluxerdüsen. auf Werkstllcke "The invention relates to a device for applying flux to the underside of L5t connections to be provided Factory ticking, e.g. electrical circuit boards, by means of wave or foam flux nozzles.

Bei bekannten Vorrichtungen der genannten Art ist der Flußmittelauftrag nicht dosierbar, d.h. entsprechend der Oberflächenspannung und Adhäsion verbleibt entsprechend mehr oder weniger Flußmittel auf dem Werkstück.In known devices of the type mentioned, the flux is applied Cannot be dosed, i.e. remains in accordance with the surface tension and adhesion accordingly more or less flux on the workpiece.

Diese Flußmittelrückstände fuhren zu erheblichen Kontakti erungsfehl ern beim nachfolgenden automatischen Prüfen der Werkstücke, insbesondere der Leiterplatten. Das Verschleppen des zuviel aufgetragenen Flußmittels durch eine automatische Lötanlage führt zu einer Verschmutzung der gesamten Anlage.These flux residues lead to considerable contact errors in the subsequent automatic testing of the workpieces, especially the circuit boards. That Carry-over of the excess flux applied by an automatic soldering system leads to contamination of the entire system.

Der Erfindung liegt die Aufgabe zugrunde, eine Vorrichtung der eingangs genannten Art so auszugestalten, daß ein einwandfreier Auftrag des Flußmittels erfolgt, wobei auch die in dem Werkstück angeordneten Bohrungen erreicht werden und gleichwohl die Flußmittelrückstände auf der beaufschlagten Werkstückfläche auf ein Mindestmaß reduziert werden.The invention is based on the object of providing a device of the initially described designed in such a way that the flux is applied properly, the bores arranged in the workpiece are also reached, and at the same time the flux residues on the exposed workpiece surface to a minimum be reduced.

Diese Aufgabe wird nach der Erfindung dadurch gelöst, daß in Transportrichtung des Werkstückes hinter einer Fluxerdüse eine Absaugvorrichtung für das Flußmittel angeordnet ist.This object is achieved according to the invention in that in the transport direction of the workpiece behind a flux nozzle, a suction device for the flux is arranged.

Eine weitere Verbesserung wird erzielt, wenn zwischen der Fluxerdüse und der Absaugvorrichtung ein einstellbarer Engspalt vorgesehen wird.Another improvement is achieved if between the flux nozzle and an adjustable narrow gap is provided for the suction device.

Weitere vorteilhafte Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen und der nachstehenden Beschreibung.Further advantageous refinements of the invention emerge from the subclaims and the description below.

Die Erfindung ist im folgenden anhand der rein schematischen Zeichnung beispielsweise näher erläutert.The invention is described below with reference to the purely schematic drawing for example explained in more detail.

Eine Fluxer-Kammer 1 ist unterhalb einer Transportbahn für flache Werkstücke, z.B. elektrische Leiterplatten 2 angeordnet und umfaßt die Teile der Fluxervorrichtung, die im wesentlichen aus einer an sich bekannten Fluxerdüse 3 bestehen. Diese kann als Wellendüse oder als Schaumdüse ausgebildet sein und betrieben werden.A fluxer chamber 1 is below a transport path for flat Workpieces, e.g. electrical circuit boards 2, and comprises the parts of Flux device, which essentially consists of a known per se Flux nozzle 3 exist. This can be designed as a wave nozzle or as a foam nozzle be and be operated.

Die Leiterplatte 2 wird von der nicht dargestellten Transportvorrichtung in Richtung des Pfeiles 4 über die Auftragvorrichtung geführt.The circuit board 2 is from the transport device, not shown guided in the direction of arrow 4 over the application device.

Nach der Erfindung ist in Transportrichtung hinter der Fluxerdüse 3 eine Absaugdüse 5 angeordnet, die sich über die Breite der Transportbahn bzw. des Werkstückes und in dessen unmittelbarer Xåhe erstreckt. Das überschüssige Flußmittel bzw. Flußmittelschaum wird mittels dieser Absaugdüse von der Werkstückunterseite entfernt und über ein Saugrohr 6 einer Sammel- oder Beruhigungskammer 7 zugeführt. Diese ist an eine Unterdruckleitung 8 angeschlossen.According to the invention is behind the flux nozzle in the transport direction 3 a suction nozzle 5 is arranged, which extends over the width of the transport path or of the workpiece and in its immediate Xåhe extends. The excess flux or flux foam is removed from the underside of the workpiece by means of this suction nozzle removed and fed to a collection or calming chamber 7 via a suction pipe 6. This is connected to a vacuum line 8.

Aus der Kammer 7 wird das Flußmittel über eine Ablaufleitung 12 einem Vorratsbehälter oder einer Aufbereitungsanlage 13 zugeführt. Von dort wird das Flußmittel über eine Zulaufleitung 14 der Fluxerdüse 3 zugepumpt.From the chamber 7, the flux is via a drain line 12 a Storage container or a processing plant 13 supplied. From there the flux becomes Pumped to the flux nozzle 3 via a feed line 14.

Zur Verbesserung des Absaugeffektes ist in dem dargestellten Ausführungsbeispiel in Transportrichtung kurz vor der Absaugdüse 5 ein nach Art einer Venturidüse gestalteter Engspalt 9 vorgesehen. Dieser Engspalt wird zwischen der Werkstückunterseite und einer Leiste 7o gebildet. Zur optimalen Einstellung des Engspaltes ist diese Leiste lo an einer Welle 11 befestigt. Durch Drehen der Welle 11 ist ein Verstellen des Spaltes möglich.To improve the suction effect is in the illustrated embodiment in the direction of transport just before the suction nozzle 5, a venturi nozzle is designed Narrow gap 9 is provided. This narrow gap is between the underside of the workpiece and a bar 7o formed. This bar is used for optimal adjustment of the narrow gap lo attached to a shaft 11. By rotating the shaft 11 is an adjustment of the Gap possible.

Claims (6)

Ansprüche: 1. Vorrichtung zum Aufbringen von Flußmittel auf die Unterseite von mit Lötverbindungen zu versehenden Werkstücken, z.B. elektrische Leiterplatten, mittels Wellen- oder Schaumfluxerdüsen, dadurch gekennzeichnet, daß in Transportrichtung (4) hinter einer Fluxerdüse (3) eine Absaugvorrichtung (5, 6 ) für das Flußmittel angeordnet ist. Claims: 1. Device for applying flux to the underside of workpieces to be provided with soldered connections, e.g. electrical circuit boards, by means of wave or foam flux nozzles, characterized in that in the transport direction (4) behind a flux nozzle (3) a suction device (5, 6) for the flux is arranged. 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß zwischen der Fluxerdüse und der Absaugvorrichtung ein einstellbarer Engspalt (9) vorgesehen ist.2. Apparatus according to claim 1, characterized in that between An adjustable narrow gap (9) is provided for the flux nozzle and the suction device is. 3. Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß der Engspalt von einer um eine Längskante schwenkbaren Leiste (io) gebildet wird.3. Apparatus according to claim 2, characterized in that the narrow gap is formed by a bar (io) which can be pivoted around a longitudinal edge. 4. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Absaugvorrichtung eine mit Unterdruck beaufschlagte Absaugdüse (5) umfaßt.4. Device according to one of the preceding claims, characterized in that that the suction device comprises a suction nozzle (5) subjected to negative pressure. 5. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Absaugvorrichtung eine Beruhigungskammer (7 ) umfaßt.5. Device according to one of the preceding claims, characterized in that that the suction device comprises a calming chamber (7). 6. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Absaugvorrichtung eine Aufbereitungsanlage (13) nachgeschaltet ist.6. Device according to one of the preceding claims, characterized in that that the suction device is followed by a processing system (13).
DE19843427004 1984-07-21 1984-07-21 Device for applying flux to workpieces Granted DE3427004A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843427004 DE3427004A1 (en) 1984-07-21 1984-07-21 Device for applying flux to workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843427004 DE3427004A1 (en) 1984-07-21 1984-07-21 Device for applying flux to workpieces

Publications (2)

Publication Number Publication Date
DE3427004A1 true DE3427004A1 (en) 1986-01-23
DE3427004C2 DE3427004C2 (en) 1987-09-24

Family

ID=6241272

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843427004 Granted DE3427004A1 (en) 1984-07-21 1984-07-21 Device for applying flux to workpieces

Country Status (1)

Country Link
DE (1) DE3427004A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871105A (en) * 1988-04-06 1989-10-03 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for applying flux to a substrate
DE3822214A1 (en) * 1988-07-01 1990-01-04 Horst Jetter Separating device
EP0473817A1 (en) * 1990-09-03 1992-03-11 Siemens Aktiengesellschaft Device for applying soldering flux on printed circuit boards
FR2683114A1 (en) * 1991-10-28 1993-04-30 Brizais Jacqueline INSTALLATION FOR THE PROCESSING OF CIRCUIT BOARDS PRINTED BY A FLOW.
US5379943A (en) * 1993-10-19 1995-01-10 Ncr Corporation Hot air circulation apparatus and method for wave soldering machines
CN106825836A (en) * 2015-10-22 2017-06-13 千住金属工业株式会社 Flux collection system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1515672A1 (en) * 1965-04-07 1969-08-07 Electrovert Mfg Co Ltd Process for applying flux and soldering printed circuit boards and device for carrying out the process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1515672A1 (en) * 1965-04-07 1969-08-07 Electrovert Mfg Co Ltd Process for applying flux and soldering printed circuit boards and device for carrying out the process

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871105A (en) * 1988-04-06 1989-10-03 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for applying flux to a substrate
DE3822214A1 (en) * 1988-07-01 1990-01-04 Horst Jetter Separating device
EP0473817A1 (en) * 1990-09-03 1992-03-11 Siemens Aktiengesellschaft Device for applying soldering flux on printed circuit boards
FR2683114A1 (en) * 1991-10-28 1993-04-30 Brizais Jacqueline INSTALLATION FOR THE PROCESSING OF CIRCUIT BOARDS PRINTED BY A FLOW.
WO1993009653A1 (en) * 1991-10-28 1993-05-13 Jacqueline Brizais Apparatus for treating printed circuit boards with a flux
US5379943A (en) * 1993-10-19 1995-01-10 Ncr Corporation Hot air circulation apparatus and method for wave soldering machines
US5425495A (en) * 1993-10-19 1995-06-20 At&T Global Information Solutions Corporation Hot air circulation method for wave soldering machines
US5542595A (en) * 1993-10-19 1996-08-06 Ncr Corporation Hot air circulation apparatus and method for wave soldering machines
US5722582A (en) * 1993-10-19 1998-03-03 Ncr Corporation Hot air circulation for wave soldering machines
CN106825836A (en) * 2015-10-22 2017-06-13 千住金属工业株式会社 Flux collection system

Also Published As

Publication number Publication date
DE3427004C2 (en) 1987-09-24

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SEHO SYSTEMTECHNIK GMBH, 97892 KREUZWERTHEIM, DE

8381 Inventor (new situation)

Free format text: HOHNERLEIN, ERNST, 97892 KREUZWERTHEIM, DE SEITZ, HEINZ, 97903 COLLENBERG, DE

8339 Ceased/non-payment of the annual fee