DE3418155A1 - Method for producing electrically conductive bushings in enamelled metal plates - Google Patents

Method for producing electrically conductive bushings in enamelled metal plates

Info

Publication number
DE3418155A1
DE3418155A1 DE19843418155 DE3418155A DE3418155A1 DE 3418155 A1 DE3418155 A1 DE 3418155A1 DE 19843418155 DE19843418155 DE 19843418155 DE 3418155 A DE3418155 A DE 3418155A DE 3418155 A1 DE3418155 A1 DE 3418155A1
Authority
DE
Germany
Prior art keywords
enamelled
holes
metal plate
electrically conductive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843418155
Other languages
German (de)
Inventor
Heinz 7257 Ditzingen Ebner
Gerhard Dipl.-Ing. 7148 Remseck Seibold
Stauros Dipl.-Chem. Dr. 7000 Stuttgart Smernos
Gerhard 7000 Stuttgart Wessel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19843418155 priority Critical patent/DE3418155A1/en
Publication of DE3418155A1 publication Critical patent/DE3418155A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H01B17/303—Sealing of leads to lead-through insulators
    • H01B17/305—Sealing of leads to lead-through insulators by embedding in glass or ceramic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacture Of Switches (AREA)

Abstract

In the case of the method, the metal plate (2) is first perforated, is then deburred and is subsequently enamelled. Thereafter, the enamelled hole walls are provided with a metal coating (11) by the use of thin-film technology. Connecting pins (7) which can be soldered are then inserted into the metallised holes and are mounted in a gas-tight manner in the holes by means of solder (12). According to a deviating method, the metallisation of the hole walls is carried out in that an electrically conductive paste is introduced into the enamelled holes by suction by means of a vacuum, and the metal coating (11) is subsequently produced by burning the paste into the enamel layer (1). <IMAGE>

Description

Verfahren zur Herstellung von elektrisch leitenden Method of making electrically conductive

Durchführungen in emaillierten Metallplatten Elektrische Durchführungen werden unter anderem für hermetisch gekapselte Bauelemente benötigt, bei denen innerhalb eines Gehäuses endende Anschlüsse zur weiteren elektrischen Verbindung von außen zugänglich sein müssen. Bushings in enamelled metal plates. Electrical bushings are required, among other things, for hermetically sealed components, in which within a housing ending connections for further electrical connection from the outside must be accessible.

Aus der DE-AS 22 58 968 ist ein Gehäuse bekannt, bei dem die Grundplatte und die mit der Grundplatte verbundene Abdeckkappe aus Stahl hergestellt sind. Die Abdeckkappe weist einen Rand auf, welcher mit der Grundplatte durch Verschweißen gasdicht verbunden ist. Die Grundplatte enthält eine elektrisch leitende Durchführung. Diese besteht aus einer die Grundplatte durchsetzenden öffnung, in die unter Einschluß eines Anschlußstiftes Preßglas eingeschmolzen ist. Die Durchführung ist ebenfalls gasdicht. Die Herstellung von derartigen Durchführungen ist jedoch teuer. Zum Pressen des Glases werden z.B. relativ hohe Temperaturen benötigt, die einen entsprechenden Aufwand an speziellen Vorrichtungen erfordern.From DE-AS 22 58 968 a housing is known in which the base plate and the cap connected to the base plate are made of steel. the Cover cap has an edge which is welded to the base plate is connected gas-tight. The base plate contains an electrically conductive feedthrough. This consists of an opening that penetrates the base plate and into which it is enclosed a connection pin pressed glass melted down. The implementation is also gastight. The manufacture of such bushings is, however expensive. To press the glass, for example, relatively high temperatures are required, which require a corresponding expenditure on special devices.

Der Erfindung liegt die Aufgabe zugrunde, ein einfaches und kostengünstiges Verfahren zur gasdichten Herstellung von elektrisch leitenden Durchführungen in emaillierten Metallplatten anzugeben. Diese Aufgabe wird erfindungsgemaß durch die Anwendung der im Kennzeichen des Patentanspruchs 1 angegebenen Verfahrensschritte gelöst. Eine weitere Lösung der der Erfindung zugrundeliegenden Aufgabe ist im Patentanspruch 2 angegeben. Die Anwendung vorteilhafter Verfahrensschritte bei der Ausübung des Herstellungsverfahrens sind den Unteransprüchen zu entnehmen.The invention is based on the object of a simple and inexpensive Process for the gas-tight production of electrically conductive bushings in enamelled metal plates. This object is achieved according to the invention by the Application of the process steps indicated in the characterizing part of claim 1 solved. Another solution to the problem on which the invention is based is set out in the patent claim 2 specified. The use of advantageous procedural steps in the exercise of the Manufacturing process can be found in the subclaims.

Im Gegensatz zum Herstellungsverfahren von Glasdurchführungen gestattet das vorliegende Verfahren Durchführungen bei einer Temperatur < 3000 C zu fertigen.In contrast to the manufacturing process for glass feedthroughs, permitted the present process to produce bushings at a temperature of <3000 C.

Anordnungsbeschrankungen bestehen praktisch nicht; die Durchführungen können daher je nach Zweckmäßigkeitserwägungen über die gesamte Plattenfläche verteilt vorgesehen werden. Das Einsetzen der Anschlußstifte in die metallisierten Löcher der emaillierten Metallplatte ist schließlich in vorteilhafter Weise genauso vornehmbar, wie das Bestücken von dielektrischen Leiterplatten mit konventionellen Bauelementen. Weitere Vorteile sind in der Beschreibung erwähnt.There are practically no restrictions on arrangement; the bushings can therefore be distributed over the entire surface of the plate, depending on the considerations of expediency are provided. Inserting the connector pins into the metallized holes the enamelled metal plate can finally be carried out in an advantageous manner, like populating dielectric circuit boards with conventional components. Further advantages are mentioned in the description.

Die Erfindung wird anhand einer Zeichnung wie folgt näher erläutert. In der Zeichnung zeigen: Fig. 1 ein Gehäuse mit mehreren in der emaillierten Grundplatte angeordneten Durchführungen, teilweise längsgeschnitten; Fig. 2 den Ausschnitt einer emaillierten Metallplatte mit Durchführung, längsgeschnitten.The invention is explained in more detail with reference to a drawing as follows. In the drawing show: Fig. 1 shows a housing with several in the Enamelled base plate arranged bushings, partially cut lengthways; Fig. 2 shows the detail of an enamelled metal plate with implementation, cut lengthways.

Bei dem in Fig. 1 dargestellten Gehäuse 1 handelt es sich um eine hermetisch gekapselte Ausführung. Seine Grundplatte besteht aus einer emaillierten Metallplatte 2, die mit dem umlaufenden Rand 3 einer Abdeckkappe 4 gasdicht verbunden ist. Die Emailschicht der Metallplatte 2 dient bei vorliegendem Ausführungsbeispiel als Träger für ein elektrisches Leitungsmuster 5, mit dem verschiedenartige Bauelemente 6 verbunden sind. Für den elektrischen Anschluß einer solcherart gebildeten Hybridschaltung sind in der Grundplatte des Gehäuses 1 mehrere, elektrisch leitende Durchführungen angeordnet.The housing 1 shown in Fig. 1 is a Hermetically sealed design. Its base plate consists of an enamelled one Metal plate 2, which is connected to the circumferential edge 3 of a cover cap 4 in a gas-tight manner is. The enamel layer of the metal plate 2 is used in the present exemplary embodiment as a carrier for an electrical line pattern 5, with the various components 6 are connected. For the electrical connection of a hybrid circuit formed in this way are in the base plate of the housing 1, several electrically conductive bushings arranged.

Die Durchführungen können beispielsweise einfache, lötfähige zylindrische Metallstifte oder auch Anschlußstifte 7 sein, die z.B. aus einem Schaft 8 mit im Durchmesser größerem Kopfteil 9 bestehen, welche die Grundplatte isoliert durchsetzen.The bushings can, for example, be simple, solderable cylindrical ones Metal pins or connection pins 7, which e.g. consist of a shaft 8 with im There are larger diameter head part 9, which enforce the base plate in isolation.

Zur Herstellung der Durchführungen wird die Metallplatte 2 vor dem Emaillieren an beliebig vorbestimmten Stellen durch Bohren oder Stanzen mit der gewünschten Anzahl von Löchern versehen und die Löcher anschließend entgratet.To produce the bushings, the metal plate 2 is in front of the Enamelling at any predetermined location by drilling or punching with the the desired number of holes and then deburred the holes.

Nach dem Einbrennen der Emailschicht 10 werden die Lochwandungen mit einem Metallbelag 11 beschichtet (Fig. 2).After the enamel layer 10 has been fired in, the walls of the holes are also included a metal coating 11 coated (Fig. 2).

Dieser ist z.B. durch Anwendung der Dünnschichttechnik herstellbar, bei der die emaillierte Metallplatte 2 im Vakuum aufgedampfte oder aufgestäubte Metallflächen erhält, aus denen die benötigten Strukturen anschließend freigeätzt werden. Dies ist in der Weise durchführbar, daß entweder nur die Lochwandungen einen Metallbelag 11 aufweisen oder auch, daß der Metallbelag sich auf wenigstens einer Flachseite der emaillierten Metallplatte 2 als Leiterbahn eines Leitungsmusters 5 und/oder als Lötauge fortsetzt. Die Leiterbahnen bzw. Lötaugen bilden dann eine die Löcher vorzugsweise ringförmig umgebende Einfassung.This can be produced, for example, by using thin-film technology, in which the enamelled metal plate 2 in Vacuum deposited or sputtered metal surfaces are obtained from which the required structures are subsequently obtained be etched free. This can be done in such a way that either only the hole walls have a metal coating 11 or that the metal coating is at least a flat side of the enamelled metal plate 2 as a conductor path of a line pattern 5 and / or continues as a soldering eye. The conductor tracks or solder eyes then form one enclosure preferably annularly surrounding the holes.

Der Metallbelag 11 in den Löchern der emaillierten Metallplatte 2 ist auch mittels der Dickschichttechnik herstellbar. Hierbei wird die Metallplatte 2 ebenfalls vor dem Emaillieren gelocht und nach dem Emaillieren in die Löcher eine elektrisch leitende Paste durch Ansaugen mittels Vakuum eingebracht bis die Lochwandungen vollständig mit Paste benetzt sind. Ist außerdem ein Leitungsmuster 5 vorgesehen, wird dieses im Siebdruckverfahren hergestellt und die vorgetrocknete Paste anschließend in die Emailschicht 10 eingebrannt. Dabei können ebenfalls die Löcher umgebende Einfassungen erzeugt werden.The metal covering 11 in the holes of the enamelled metal plate 2 can also be produced using thick-film technology. This is where the metal plate 2 also punched before enamelling and after enamelling in the holes Electrically conductive paste introduced by suction using a vacuum up to the hole walls are completely wetted with paste. If a line pattern 5 is also provided, this is produced using the screen printing process and then the pre-dried paste burned into the enamel layer 10. This can also surround the holes Edges are generated.

Haben die Löcher in der Metallplatte 2 unabhängig vom Herstellungsverfahren einen Metallbelag 11 erhalten, wird ein Anschlußstift 7 in jedes Loch eingesetzt und darin mittels Lot 12 gasdicht befestigt. Für das Einlöten der Anschlußstifte 7 können alle herkömmlichen Verfahren und Vorrichtungen benutzt werden, insbesondere auch die mit einer stehenden Zinnwelle arbeitenden Lötvorrichtungen.Have the holes in the metal plate 2 regardless of the manufacturing process When a metal sheet 11 is obtained, a terminal pin 7 is inserted into each hole and fastened therein in a gastight manner by means of solder 12. For soldering in the connection pins 7, all conventional methods and devices can be used, in particular also the soldering devices that work with a standing wave of tin.

Claims (4)

Patentansprüche 1. Verfahren zur Herstellung von elektrisch leitenden Durchführungen in emaillierten Metallplatten, g e k e n n z e i c h n e t d u r c h die Anwendung folgender Verfahrensschritte: a) Einbringen von Löchern in die Metallpatte (2), bevor diese emailliert wird, b) Metallisieren der emaillierten Lochwandungen durch Anwenden der Dünnschichttechnik, c) Einsetzen von separat angefertigten Anschlußstiften (7) in die Metallbeläge (11) aufweisenden Löcher der emaillierten Metallplatte (2) und Einlöten der Anschlußstifte (7). Claims 1. A method for producing electrically conductive Feedthroughs in enamelled metal plates, g e k e n n n z e i c h n e t d u r c h the application of the following process steps: a) Making holes in the Metal plate (2) before it is enamelled, b) metallizing the enamelled Hole walls by using thin-film technology, c) inserting separately made Connection pins (7) in the metal coverings (11) having holes of the enamelled Metal plate (2) and soldering in the connecting pins (7). 2. Verfahren zur Herstellung von elektrisch leitenden Durchführungen in emaillierten Metallplatten, gekennzeichnet durch die Anwendung folgender Verfahrensschritte: a) Herstellen von Löchern in der Metallplatte (2), bevor diese emailliert wird, b) Einbringen einer elektrisch leitenden Paste in die emaillierten Löcher und Benetzen der Lochwandungen durch Ansaugen der Paste mittels Vakuum, c) Einbrennen der leitenden Paste in die Emaille der Lochwandungen, d) Einsetzen von separat angefertigten Anschlußstiften (7) in die Metallbeläge (11) aufweisenden Löcher der emaillierten Metallplatte (2) und Einlöten der Anschlußstifte (7).2. Process for the production of electrically conductive feedthroughs in enamelled metal plates, characterized by the use of the following process steps: a) Making holes in the metal plate (2) before it is enamelled, b) Introducing an electrically conductive paste into the enamelled holes and wetting the hole walls by sucking in the paste by means of a vacuum, c) burning in the conductive ones Paste into the enamel of the hole walls, d) Insertion of separately manufactured connection pins (7) in the metal coverings (11) having holes in the enamelled metal plate (2) and soldering in the connecting pins (7). 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die durch Bohren oder Stanzen hergestellten Löcher vor dem Emaillieren der Metallplatte (2) entgratet werden.3. The method according to claim 1 or 2, characterized in that the holes made by drilling or punching before enamelling the metal plate (2) be deburred. 4. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß beim Metallisieren der Löcher wenigstens auf einer Seite der emaillierten Metallplatte (2) jeweils eine die Löcher umgebende Einfassung mit ausgebildet wird.4. The method according to claim 1 or 2, characterized in that when Plating the holes on at least one side of the enamelled metal plate (2) an enclosure surrounding the holes is also formed.
DE19843418155 1984-05-16 1984-05-16 Method for producing electrically conductive bushings in enamelled metal plates Withdrawn DE3418155A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843418155 DE3418155A1 (en) 1984-05-16 1984-05-16 Method for producing electrically conductive bushings in enamelled metal plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843418155 DE3418155A1 (en) 1984-05-16 1984-05-16 Method for producing electrically conductive bushings in enamelled metal plates

Publications (1)

Publication Number Publication Date
DE3418155A1 true DE3418155A1 (en) 1985-11-28

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DE19843418155 Withdrawn DE3418155A1 (en) 1984-05-16 1984-05-16 Method for producing electrically conductive bushings in enamelled metal plates

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10341404A1 (en) * 2003-09-05 2005-04-14 Siemens Ag Switch carrier e.g. for electrical switching assemblies, has substrate made from steel, having two sides and recess with dielectric applied to both sides of substrate and into recess

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10341404A1 (en) * 2003-09-05 2005-04-14 Siemens Ag Switch carrier e.g. for electrical switching assemblies, has substrate made from steel, having two sides and recess with dielectric applied to both sides of substrate and into recess
DE10341404B4 (en) * 2003-09-05 2006-06-01 Siemens Ag Circuit device with a circuit carrier

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